RF Mixer DOUBLE BAL MIXER/OSCILLATOR
器件类别:其他集成电路(IC) 消费电路
厂商名称:NXP(恩智浦)
厂商官网:https://www.nxp.com
下载文档型号 | SA612AD,118 | SA612AD-01112 | SA612AD,602 | SA612AN/01,112 |
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描述 | RF Mixer DOUBLE BAL MIXER/OSCILLATOR | RF Mixer LP VHF DBL-BAL W/OSC | 射频混合器 DOUBLE BAL MIXER/OSCILLATOR | 射频无线杂项 LP VHF DBL-BAL W/OSC |
Brand Name | NXP Semiconductor | - | NXP Semiconductor | NXP Semiconductor |
厂商名称 | NXP(恩智浦) | - | NXP(恩智浦) | NXP(恩智浦) |
零件包装代码 | SOIC | - | SOIC | DIP |
包装说明 | SOP, | - | SOP, | DIP, |
针数 | 8 | - | 8 | 8 |
制造商包装代码 | SOT96-1 | - | SOT96-1 | SOT97-1 |
Reach Compliance Code | unknown | - | unknown | unknown |
JESD-30 代码 | R-PDSO-G8 | - | R-PDSO-G8 | R-PDIP-T8 |
长度 | 4.9 mm | - | 4.9 mm | 9.5 mm |
端子数量 | 8 | - | 8 | 8 |
最高工作温度 | 85 °C | - | 85 °C | 85 °C |
最低工作温度 | -40 °C | - | -40 °C | -40 °C |
封装主体材料 | PLASTIC/EPOXY | - | PLASTIC/EPOXY | PLASTIC/EPOXY |
封装代码 | SOP | - | SOP | DIP |
封装形状 | RECTANGULAR | - | RECTANGULAR | RECTANGULAR |
封装形式 | SMALL OUTLINE | - | SMALL OUTLINE | IN-LINE |
认证状态 | Not Qualified | - | Not Qualified | Not Qualified |
座面最大高度 | 1.75 mm | - | 1.75 mm | 4.2 mm |
表面贴装 | YES | - | YES | NO |
温度等级 | INDUSTRIAL | - | INDUSTRIAL | INDUSTRIAL |
端子形式 | GULL WING | - | GULL WING | THROUGH-HOLE |
端子节距 | 1.27 mm | - | 1.27 mm | 2.54 mm |
端子位置 | DUAL | - | DUAL | DUAL |
宽度 | 3.9 mm | - | 3.9 mm | 7.62 mm |