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SI4730-D60-GMR

AM/FM, AUDIO SINGLE CHIP RECEIVER, QCC20
调幅/调频, 音频单片接收器, QCC20

器件类别:半导体    其他集成电路(IC)   

厂商名称:SILABS

厂商官网:http://www.silabs.com

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器件:SI4730-D60-GMR

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器件参数
参数名称
属性值
功能数量
1
端子数量
20
最大工作温度
85 Cel
最小工作温度
-20 Cel
最大供电/工作电压
5.5 V
最小供电/工作电压
2.7 V
额定输出电压
80 mV
加工封装描述
ROHS COMPLIANT, QFN-20
状态
ACTIVE
工艺
CMOS
包装形状
SQUARE
包装尺寸
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
表面贴装
Yes
端子形式
NO LEAD
端子间距
0.5000 mm
端子位置
QUAD
包装材料
UNSPECIFIED
温度等级
OTHER
消费IC类型
AUDIO SINGLE CHIP RECEIVER
谐波失真
0.1000 %
额定输出电压
60 mV
额定频率信噪比
58 dB
文档预览
Si4730/31/34/35-D60
B
ROADCAST
AM/FM/SW/LW R
ADIO
R
ECEIVER
Features
Worldwide FM band support
(64–108 MHz)
Worldwide AM band support
(520–1710 kHz)
SW band support (Si4734/35)
(2.3–26.1 MHz)
LW band support (Si4734/35)
(153–279 kHz)
Excellent real-world performance
Integrated VCO
Advanced AM/FM seek tuning
Automatic frequency control (AFC)
Automatic gain control (AGC)
Digital FM stereo decoder
Programmable de-emphasis
Advanced Audio Processing
Multiplexed stereo audio AUXIN
ADC with 85 dB dynamic range
Seven selectable AM channel filters
AM/FM/SW/LW digital tuning
EN55020 compliant
No manual alignment necessary
Programmable reference clock
Adjustable soft mute control
RDS/RBDS processor (Si4731/35)
Digital audio out
2-wire and 3-wire control interface
Integrated LDO regulator
Wide range of ferrite loop sticks and
air loop antennas supported
QFN and SSOP packages

RoHS compliant
Ordering Information:
See page 33.
Pin Assignments
Si473x-D60 (QFN)
GPO3/[DCLK]
17
10
VD
GPO2/[INT]
DFS/[RIN]
16
15 DOUT/[LIN]
14 LOUT/[DFS]
13 ROUT/[DOUT]
12 GND
7
SCLK
8
SDIO
9
RCLK
11 VA
GPO1
19
NC
Applications
Table and portable radios
Mini/micro systems
CD/DVD and Blu-ray players
Stereo boom boxes
Modules for consumer electronics
Clock radios
Mini HiFi and docking stations
Entertainment systems
NC
1
20
18
FMI 2
RFGND 3
AMI 4
RST 5
6
SEN
GND
PAD
Description
The Si473x-D60 digital CMOS AM/FM radio receiver IC integrates the complete
tuner function from antenna input to digital audio output and includes a stereo
audio AUXIN ADC input for converting analog audio into standard I2S digital
audio, enabling a cost efficient digital audio platform for consumer electronic
applications with high TDMA noise immunity, superior radio performance, and
high fidelity audio power amplification. When enabling the analog inputs in stereo
AUXIN ADC-mode, the Si473x-D60 supports I2S digital audio output only (no
analog output).
Si473x-D60(SSOP)
DOUT/[LIN]
DFS/[RIN]
GPO3/[DCLK]
GPO2/[INT]
GPO1
NC
NC
1
2
3
4
5
6
7
8
9
10
11
12
24
23
22
21
20
19
18
17
16
15
14
13
LOUT/[DFS]
ROUT/[DOUT]
DBYP
VA
VD
RCLK
SDIO
SCLK
SEN
RST
GND
GND
Functional Block Diagram
FM / SW
AN T
R IN
LIN
FM I
LN A
AGC
A M / LW
A NT
AMI
R FG N D
2.7~5.5 V (Q FN )
2.0~5.5 V (SSO P)
+
LN A
AGC
VA
GND
LD O
AFC
M ux
M ux
FMI
RFGND
Si473x-D60
RD S
(S i4731/
35)
LO W -IF
AD C
D SP
AD C
DA C
LO UT
DA C
DO UT
DIG ITA L
AU D IO
DFS
G PO /D CLK
NC
NC
AMI
RO UT
CO NTR O L
INTER FAC E
VD
1.62 - 3.6 V
This product, its features, and/or its
architecture is covered by one or more of
the following patents, as well as other
patents, pending and issued, both
foreign and domestic: 7,127,217;
7,272,373;
7,272,375;
7,321,324;
7,355,476;
7,426,376;
7,471,940;
7,339,503; 7,339,504.
RCLK
SCLK
SEN
Rev. 1.1 11/11
Copyright © 2011 by Silicon Laboratories
SDIO
RST
Si473x-D60
Si4730/31/34/35-D60
2
Rev. 1.1
Si4730/31/34/35-D60
T
ABLE O F
C
ONTENTS
Section
Page
1. Electrical Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .5
2. Typical Application Schematic . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20
2.1. QFN Typical Application Schematic . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20
2.2. SSOP Typical Application Schematic . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21
3. Bill of Materials . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22
3.1. QFN/SSOP Bill of Materials . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22
4. Functional Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23
4.1. Overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23
4.2. Operating Modes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24
4.3. FM Receiver . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .24
4.4. AM Receiver . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .24
4.5. SW Receiver . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24
4.6. LW Receiver . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .24
4.7. Stereo Audio AUXIN ADC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24
4.8. Digital Audio Interface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25
4.9. Stereo Audio Processing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27
4.10. Received Signal Qualifiers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27
4.11. Volume Control . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27
4.12. Stereo DAC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27
4.13. Soft Mute . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27
4.14. FM Hi-Cut Control . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27
4.15. De-emphasis . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28
4.16. RDS/RBDS Processor
(Si4731/35 Only) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .28
4.17. Tuning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28
4.18. Seek . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28
4.19. Reference Clock . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28
4.20. Control Interface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29
4.21. GPO Outputs . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30
4.22. Firmware Upgrades . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .30
4.23. Reset, Powerup, and Powerdown . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30
4.24. 2 V Operation (SSOP Only) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30
4.25. Programming with Commands . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30
5. Pin Descriptions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31
5.1. Si473x-D60-GM . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .31
5.2. Si473x-D60-GU . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 32
6. Ordering Guide . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 33
7. Package Outline . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 34
7.1. Si473x-D60 QFN . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 34
7.2. Si473x-D60 SSOP . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 35
8. PCB Land Pattern . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .36
Rev. 1.1
3
Si4730/31/34/35-D60
8.1. Si473x-D60 QFN . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 36
8.2. Si473x-D60 SSOP . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 38
9. Top Markings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .39
9.1. Si473x-D60 Top Marking (QFN) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 39
9.2. Top Marking Explanation (QFN) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 39
9.3. Si473x-D60 Top Marking (SSOP) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 40
9.4. Top Marking Explanation (SSOP) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 40
10. Additional Reference Resources . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 41
Document Change List . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .42
Contact Information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .44
4
Rev. 1.1
Si4730/31/34/35-D60
1. Electrical Specifications
Table 1. Recommended Operating Conditions
1
Parameter
Analog Supply Voltage
Digital and I/O Supply Voltage
Power Supply Powerup Rise Time
Interface Power Supply Powerup Rise Time
Ambient Temperature
Symbol
V
A
V
D
V
DDRISE
V
IORISE
T
A
Test Condition
Min
2.7
2
1.62
10
10
–20
Typ
25
Max
5.5
3.6
85
Unit
V
V
µs
µs
C
Notes:
1.
All minimum and maximum specifications apply across the recommended operating conditions. Typical values apply at
V
A
= 3.3 V and 25
C
unless otherwise stated.
2.
SSOP devices operate down to 2 V at 25 °C. See section “4.24. 2 V Operation (SSOP Only)” for details.
Rev. 1.1
5
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参数对比
与SI4730-D60-GMR相近的元器件有:Si4730-D60-GM、Si4730-D60-GU2、Si4731-D60-GM、Si4731-D60-GU2、Si4734-D60-GM、Si4734-D60-GU2、Si4735-D60-GM、Si4735-D60-GU2。描述及对比如下:
型号 SI4730-D60-GMR Si4730-D60-GM Si4730-D60-GU2 Si4731-D60-GM Si4731-D60-GU2 Si4734-D60-GM Si4734-D60-GU2 Si4735-D60-GM Si4735-D60-GU2
描述 AM/FM, AUDIO SINGLE CHIP RECEIVER, QCC20 AM/FM, AUDIO SINGLE CHIP RECEIVER, QCC20 AM/FM, AUDIO SINGLE CHIP RECEIVER, QCC20 AM/FM, AUDIO SINGLE CHIP RECEIVER, QCC20 AM/FM, AUDIO SINGLE CHIP RECEIVER, QCC20 AM/FM, AUDIO SINGLE CHIP RECEIVER, QCC20 AM/FM, AUDIO SINGLE CHIP RECEIVER, QCC20 AM/FM, AUDIO SINGLE CHIP RECEIVER, QCC20 AM/FM, AUDIO SINGLE CHIP RECEIVER, QCC20
功能数量 1 1 1 1 1 1 1 1 1
端子数量 20 20 20 20 20 20 20 20 20
最大工作温度 85 Cel 85 Cel 85 Cel 85 Cel 85 Cel 85 Cel 85 Cel 85 Cel 85 Cel
最小工作温度 -20 Cel -20 Cel -20 Cel -20 Cel -20 Cel -20 Cel -20 Cel -20 Cel -20 Cel
最大供电/工作电压 5.5 V 5.5 V 5.5 V 5.5 V 5.5 V 5.5 V 5.5 V 5.5 V 5.5 V
最小供电/工作电压 2.7 V 2.7 V 2.7 V 2.7 V 2.7 V 2.7 V 2.7 V 2.7 V 2.7 V
加工封装描述 ROHS COMPLIANT, QFN-20 ROHS COMPLIANT, QFN-20 ROHS COMPLIANT, QFN-20 ROHS COMPLIANT, QFN-20 ROHS COMPLIANT, QFN-20 ROHS COMPLIANT, QFN-20 ROHS COMPLIANT, QFN-20 ROHS COMPLIANT, QFN-20 ROHS COMPLIANT, QFN-20
状态 ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE
工艺 CMOS CMOS CMOS CMOS CMOS CMOS CMOS CMOS CMOS
包装形状 SQUARE SQUARE SQUARE SQUARE SQUARE SQUARE SQUARE SQUARE SQUARE
包装尺寸 CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE 芯片 CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
表面贴装 Yes Yes Yes Yes Yes Yes Yes Yes Yes
端子形式 NO LEAD NO LEAD NO LEAD NO LEAD NO LEAD NO 铅 NO LEAD NO LEAD NO LEAD
端子间距 0.5000 mm 0.5000 mm 0.5000 mm 0.5000 mm 0.5000 mm 0.5000 mm 0.5000 mm 0.5000 mm 0.5000 mm
端子位置 QUAD QUAD QUAD QUAD QUAD QUAD QUAD QUAD
包装材料 UNSPECIFIED UNSPECIFIED UNSPECIFIED UNSPECIFIED UNSPECIFIED UNSPECIFIED UNSPECIFIED UNSPECIFIED UNSPECIFIED
温度等级 OTHER OTHER OTHER OTHER OTHER 其他 OTHER OTHER OTHER
消费IC类型 AUDIO SINGLE CHIP RECEIVER AUDIO SINGLE CHIP RECEIVER AUDIO SINGLE CHIP RECEIVER AUDIO SINGLE CHIP RECEIVER AUDIO SINGLE CHIP RECEIVER 音频单片接收器 AUDIO SINGLE CHIP RECEIVER AUDIO SINGLE CHIP RECEIVER AUDIO SINGLE CHIP RECEIVER
谐波失真 0.1000 % 0.1000 % 0.1000 % 0.1000 % 0.1000 % 0.1000 % 0.1000 % 0.1000 % 0.1000 %
额定频率信噪比 58 dB 58 dB 58 dB 58 dB 58 dB 58 dB 58 dB 58 dB 58 dB
额定输出电压 60 mV 60 mV 60 mV 60 mV 60 mV 60 mV 60 mV 60 mV 60 mV
热门器件
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器件捷径:
E0 E1 E2 E3 E4 E5 E6 E7 E8 E9 EA EB EC ED EE EF EG EH EI EJ EK EL EM EN EO EP EQ ER ES ET EU EV EW EX EY EZ F0 F1 F2 F3 F4 F5 F6 F7 F8 F9 FA FB FC FD FE FF FG FH FI FJ FK FL FM FN FO FP FQ FR FS FT FU FV FW FX FY FZ G0 G1 G2 G3 G4 G5 G6 G7 G8 G9 GA GB GC GD GE GF GG GH GI GJ GK GL GM GN GO GP GQ GR GS GT GU GV GW GX GZ H0 H1 H2 H3 H4 H5 H6 H7 H8 HA HB HC HD HE HF HG HH HI HJ HK HL HM HN HO HP HQ HR HS HT HU HV HW HX HY HZ I1 I2 I3 I4 I5 I6 I7 IA IB IC ID IE IF IG IH II IK IL IM IN IO IP IQ IR IS IT IU IV IW IX J0 J1 J2 J6 J7 JA JB JC JD JE JF JG JH JJ JK JL JM JN JP JQ JR JS JT JV JW JX JZ K0 K1 K2 K3 K4 K5 K6 K7 K8 K9 KA KB KC KD KE KF KG KH KI KJ KK KL KM KN KO KP KQ KR KS KT KU KV KW KX KY KZ
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