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SI53102-A3-GMR

IC CLK BUFFER PCIE 1:2 8TDFN

器件类别:逻辑    逻辑   

厂商名称:Silicon Laboratories Inc

器件标准:

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器件参数
参数名称
属性值
是否Rohs认证
符合
厂商名称
Silicon Laboratories Inc
零件包装代码
DFN
包装说明
TDFN-8
针数
8
Reach Compliance Code
compliant
Samacsys Description
Clock Multiplexer 2-OUT 8-Pin TDFN EP T/R
其他特性
ALSO OPERATES AT 3.3 V SUPPLY
系列
53102
输入调节
DIFFERENTIAL
JESD-30 代码
R-PDSO-N8
长度
1.6 mm
逻辑集成电路类型
LOW SKEW CLOCK DRIVER
功能数量
1
反相输出次数
端子数量
8
实输出次数
4
最高工作温度
85 °C
最低工作温度
-40 °C
封装主体材料
PLASTIC/EPOXY
封装代码
HVSON
封装等效代码
SOLCC8,.06,16
封装形状
RECTANGULAR
封装形式
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE
电源
2.5/3.3 V
认证状态
Not Qualified
Same Edge Skew-Max(tskwd)
0.1 ns
座面最大高度
0.8 mm
最大供电电压 (Vsup)
2.75 V
最小供电电压 (Vsup)
2.25 V
标称供电电压 (Vsup)
2.5 V
表面贴装
YES
温度等级
INDUSTRIAL
端子形式
NO LEAD
端子节距
0.4 mm
端子位置
DUAL
宽度
1.4 mm
Base Number Matches
1
文档预览
Si53102-A1/A2/A3 Data Sheet
PCI-Express Gen 1, Gen 2, Gen 3, and Gen 4 1:2 Fan-out Clock
Buffer
Si53102-A1/A2/A3 is a family of high-performance 1:2 PCIe fan output buffers. This low-
additive-jitter clock buffer family is compliant to PCIe Gen 1, Gen 2, Gen 3, and Gen 4
specifications. The ultra-small footprint (1.4x1.6 mm) and industry-leading low power
consumption make the Si53102-A1/A2/A3 the ideal clock solution for consumer and em-
bedded applications. Measuring PCIe clock jitter is quick and easy with the Silicon Labs
PCIe Clock Jitter Tool. Download it for free at
www.silabs.com/pcie-learningcenter.
Applications
• Network Attached Storage
• Multi-function Printer
• Wireless Access Point
• Server/Storage
KEY FEATURES
• PCI-Express Gen 1, Gen 2, Gen 3, and
Gen 4 common clock compliant
• Two low-power PCIe clock outputs
• Supports Serial-ATA (SATA) at 100 MHz
• No termination resistors required for
differential clocks
• 2.5 V or 3.3 V Power supply
• Spread Spectrum Tolerant
• Extended Temperature Range
• –40 to 85 °C
• Small package 8-pin TDFN (1.4 x 1.6 mm)
• For PCIe Gen 1: Si53102-A1
• For PCIe Gen 2: Si53102-A2
• For PCIe Gen 3/4: Si53102-A3
VDD
DIFFIN
DIFFIN
DIFF1
DIFF2
VSS
silabs.com
| Building a more connected world.
Rev. 1.4
Si53102-A1/A2/A3 Data Sheet
Ordering Guide
1. Ordering Guide
Table 1.1. Ordering Guide
Part Number
Si53102-A1-GM
Si53102-A1-GMR
Si53102-A2-GM
Si53102-A2-GMR
Si53102-A3-GM
Si53102-A3-GMR
Package Type
8-pin TDFN
8-pin TDFN—Tape and Reel
8-pin TDFN
8-pin TDFN—Tape and Reel
8-pin TDFN
8-pin TDFN—Tape and Reel
Temperature
Extended, –40 to 85 °C
Extended, –40 to 85 °C
Extended, –40 to 85 °C
Extended, –40 to 85 °C
Extended, –40 to 85 °C
Extended, –40 to 85 °C
silabs.com
| Building a more connected world.
Rev. 1.4 | 2
Table of Contents
1. Ordering Guide
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
2. Electrical Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
3. Test and Measurement Setup . . . . . . . . . . . . . . . . . . . . . . . . . 7
4. Recommended Design Guideline . . . . . . . . . . . . . . . . . . . . . . . . 9
5. Pin Descriptions
6. Package Outline
7. Land Pattern
8. Revision History
8.1 Revision 1.0
8.2 Revision 1.1
8.3 Revision 1.2
8.4 Revision 1.3
8.5 Revision 1.4
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. . . . . . . . . . . . . . . . . . . . . . . . . . . . . .13
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silabs.com
| Building a more connected world.
Rev. 1.4 | 3
Si53102-A1/A2/A3 Data Sheet
Electrical Specifications
2. Electrical Specifications
Table 2.1. Recommended Operating Conditions
Parameter
Supply Voltage (3.3 V Sup-
ply)
Supply Voltage (2.5 V Sup-
ply)
Symbol
V
DD
V
DD
Test Condition
3.3 V ± 10%
2.5 V ± 10%
Min
2.97
2.25
Typ
3.3
2.5
Max
3.63
2.75
Unit
V
V
Table 2.2. DC Electrical Specifications
Parameter
Operating Voltage (V
DD
=
3.3 V)
Operating Voltage (V
DD
=
2.5 V)
Operating Supply Current
Input Pin Capacitance
Output Pin Capacitance
Symbol
V
DD
V
DD
I
DD
C
IN
C
OUT
Test Condition
3.3 V ± 10%
2.5 V ± 10%
Full Active
Input Pin Capacitance
Output Pin Capacitance
Min
2.97
2.25
Typ
3.30
2.5
3
Max
3.63
2.75
15
5
5
Unit
V
V
mA
pF
pF
Table 2.3. AC Electrical Specifications
1, 2, 3
Parameter
DIFFIN at 0.7 V
Input frequency
DIFFIN and DIFFINb
Rising/Falling Slew Rate
Differential Input High Volt-
age
Differential Input Low Volt-
age
Crossing Point Voltage at
0.7 V Swing
Vcross Variation Over All
edges
Differential Ringback Volt-
age
Time before Ringback Al-
lowed
Absolute Maximum Input
Voltage
Absolute Minimum Input
Voltage
V
IH
V
IL
V
OX
ΔV
OX
V
RB
T
STABLE
V
MAX
V
MIN
–0.3
Single-ended measurement
Single-ended measurement
Fin
T
R
/ T
F
Single ended measurement:
V
OL
= 0.175 to V
OH
= 0.525
V (Averaged)
150
250
–100
500
–150
550
140
100
1.15
mV
mV
mV
mV
mV
ps
V
V
10
0.6
100
175
4
MHz
V/ns
Symbol
Condition
Min
Typ
Max
Unit
silabs.com
| Building a more connected world.
Rev. 1.4 | 4
Si53102-A1/A2/A3 Data Sheet
Electrical Specifications
Parameter
DIFFIN and DIFFINb Duty
Cycle
Rise/Fall Matching
Symbol
T
DC
T
RFM
Condition
Measured at crossing point
VOX
Determined as a fraction of
2 x (TR – TF)/(TR + TF)
DIFF Clocks
Duty Cycle
Output Skew
Frequency Accuracy
Slew Rate
T
DC
T
SKEW
F
ACC
t
r/f2
Measured at crossing point
VOX
Measured at 0 V differential
All output clocks
Measured differentially from
±150 mV
PCIe Gen 1 Pk-Pk Additive
Jitter
PCIe Gen 2 Additive Phase
Jitter
PCIe Gen 2 Additive Phase
Jitter
PCIe Gen 3 Additive Phase
Jitter
Pk-Pk
GEN1
PCIe Gen 1
Si53102-A1
RMS
GEN2
10 kHz < F < 1.5 MHz,
Si53102-A2
RMS
GEN2
1.5 MHz < F < Nyquist,
Si53102-A2
RMS
GEN3
Includes PLL BW 2–4 MHz,
CDR = 10 MHz,
Si53102-A3, VDD=3.3 V
Includes PLL BW 2–4 MHz,
CDR = 10 MHz,
Si53102-A3, VDD=2.5V
PCIe Gen 4 Additive Phase
Jitter
Crossing Point Voltage at
0.7 V Swing
Enable/Disable and Setup
Clock Stabilization from
Powerup
T
STABLE
Power up to first output
3.0
ms
RMS
GEN4
PCIe Gen4, VDD=3.3V
PCIe Gen4, VDD=2.5V
V
OX
VDD = 3.3 V
VDD = 2.5 V
300
200
0.22
0.25
550
550
ps
ps
mV
mV
0.25
ps
0.22
ps
0.50
ps
0.50
ps
10
ps
45
0.6
55
100
100
4.0
%
ps
ppm
V/ns
Min
45
Typ
Max
55
20
Unit
%
%
Note:
1. Visit
www.pcisig.com
for complete PCIe specifications
2. Gen 4 specifications based on the PCI-Express Base Specification 4.0 rev. 0.5.
3. Download the Silicon Labs PCIe Clock Jitter Tool at
www.silabs.com/pcie-learningcenter.
silabs.com
| Building a more connected world.
Rev. 1.4 | 5
查看更多>
参数对比
与SI53102-A3-GMR相近的元器件有:Si53102-A2-GM、SI53102-A1-GMR、SI53102-A1-GM。描述及对比如下:
型号 SI53102-A3-GMR Si53102-A2-GM SI53102-A1-GMR SI53102-A1-GM
描述 IC CLK BUFFER PCIE 1:2 8TDFN clock buffer pcie gen2 1:2 buffer IC CLK BUFFER PCIE 1:2 8TDFN IC CLK BUFFER PCIE 1:2 8TDFN
是否Rohs认证 符合 符合 符合 符合
厂商名称 Silicon Laboratories Inc Silicon Laboratories Inc Silicon Laboratories Inc Silicon Laboratories Inc
零件包装代码 DFN DFN DFN DFN
包装说明 TDFN-8 HVSON, SOLCC8,.06,16 TDFN-8 TDFN-8
针数 8 8 8 8
Reach Compliance Code compliant compli compliant compliant
其他特性 ALSO OPERATES AT 3.3 V SUPPLY ALSO OPERATES AT 3.3 V SUPPLY ALSO OPERATES AT 3.3 V SUPPLY ALSO OPERATES AT 3.3 V SUPPLY
系列 53102 53102 53102 53102
输入调节 DIFFERENTIAL DIFFERENTIAL DIFFERENTIAL DIFFERENTIAL
JESD-30 代码 R-PDSO-N8 R-PDSO-N8 R-PDSO-N8 R-PDSO-N8
长度 1.6 mm 1.6 mm 1.6 mm 1.6 mm
逻辑集成电路类型 LOW SKEW CLOCK DRIVER LOW SKEW CLOCK DRIVER LOW SKEW CLOCK DRIVER LOW SKEW CLOCK DRIVER
功能数量 1 1 1 1
端子数量 8 8 8 8
实输出次数 4 4 4 4
最高工作温度 85 °C 85 °C 85 °C 85 °C
最低工作温度 -40 °C -40 °C -40 °C -40 °C
封装主体材料 PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
封装代码 HVSON HVSON HVSON HVSON
封装等效代码 SOLCC8,.06,16 SOLCC8,.06,16 SOLCC8,.06,16 SOLCC8,.06,16
封装形状 RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR
封装形式 SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE
电源 2.5/3.3 V 2.5/3.3 V 2.5/3.3 V 2.5/3.3 V
认证状态 Not Qualified Not Qualified Not Qualified Not Qualified
Same Edge Skew-Max(tskwd) 0.1 ns 0.1 ns 0.1 ns 0.1 ns
座面最大高度 0.8 mm 0.8 mm 0.8 mm 0.8 mm
最大供电电压 (Vsup) 2.75 V 2.75 V 2.75 V 2.75 V
最小供电电压 (Vsup) 2.25 V 2.25 V 2.25 V 2.25 V
标称供电电压 (Vsup) 2.5 V 2.5 V 2.5 V 2.5 V
表面贴装 YES YES YES YES
温度等级 INDUSTRIAL INDUSTRIAL INDUSTRIAL INDUSTRIAL
端子形式 NO LEAD NO LEAD NO LEAD NO LEAD
端子节距 0.4 mm 0.4 mm 0.4 mm 0.4 mm
端子位置 DUAL DUAL DUAL DUAL
宽度 1.4 mm 1.4 mm 1.4 mm 1.4 mm
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