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SMJ44C251B-12HJM883C

Video DRAM, 256KX4, 120ns, CMOS, CDSO28, CERAMIC, LCC-28

器件类别:存储    存储   

厂商名称:Micross

厂商官网:https://www.micross.com

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器件参数
参数名称
属性值
厂商名称
Micross
零件包装代码
DLCC
包装说明
SON,
针数
28
Reach Compliance Code
compliant
ECCN代码
EAR99
访问模式
FAST PAGE
最长访问时间
120 ns
其他特性
RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH
JESD-30 代码
R-CDSO-N28
JESD-609代码
e4
长度
18.29 mm
内存密度
1048576 bit
内存集成电路类型
VIDEO DRAM
内存宽度
4
功能数量
1
端口数量
2
端子数量
28
字数
262144 words
字数代码
256000
工作模式
SYNCHRONOUS
最高工作温度
125 °C
最低工作温度
-55 °C
组织
256KX4
封装主体材料
CERAMIC, METAL-SEALED COFIRED
封装代码
SON
封装形状
RECTANGULAR
封装形式
SMALL OUTLINE
认证状态
Not Qualified
筛选级别
MIL-STD-883
座面最大高度
2.54 mm
最大供电电压 (Vsup)
5.5 V
最小供电电压 (Vsup)
4.5 V
标称供电电压 (Vsup)
5 V
表面贴装
YES
技术
CMOS
温度等级
MILITARY
端子面层
PALLADIUM GOLD
端子形式
NO LEAD
端子节距
1.27 mm
端子位置
DUAL
宽度
10.16 mm
参数对比
与SMJ44C251B-12HJM883C相近的元器件有:SMJ44C251B-10HMM883C、SMJ44C251B-12HMM883C、SMJ44C251B-10HJM883C、SMJ44C251B-12JDM883C、SMJ44C251B-10SVM883C、SMJ44C251B-12SVM883C、SMJ44C251B-10JDM883C。描述及对比如下:
型号 SMJ44C251B-12HJM883C SMJ44C251B-10HMM883C SMJ44C251B-12HMM883C SMJ44C251B-10HJM883C SMJ44C251B-12JDM883C SMJ44C251B-10SVM883C SMJ44C251B-12SVM883C SMJ44C251B-10JDM883C
描述 Video DRAM, 256KX4, 120ns, CMOS, CDSO28, CERAMIC, LCC-28 Video DRAM, 256KX4, 100ns, CMOS, CDSO28, CERAMIC, LCC-28 Video DRAM, 256KX4, 120ns, CMOS, CDSO28, CERAMIC, LCC-28 Video DRAM, 256KX4, 100ns, CMOS, CDSO28, CERAMIC, LCC-28 Video DRAM, 256KX4, 120ns, CMOS, CDIP28, 0.400 INCH, CERAMIC, DIP-28 Video DRAM, 256KX4, 100ns, CMOS, CZIP28, CERAMIC, ZIP-28 Video DRAM, 256KX4, 120ns, CMOS, CZIP28, CERAMIC, ZIP-28 Video DRAM, 256KX4, 100ns, CMOS, CDIP28, 0.400 INCH, CERAMIC, DIP-28
零件包装代码 DLCC DLCC DLCC DLCC DIP ZIP ZIP DIP
包装说明 SON, SON, SON, SON, DIP, ZIP, ZIP, DIP,
针数 28 28 28 28 28 28 28 28
Reach Compliance Code compliant compliant compliant compliant compliant compliant compliant compli
ECCN代码 EAR99 EAR99 EAR99 EAR99 EAR99 EAR99 EAR99 EAR99
访问模式 FAST PAGE FAST PAGE FAST PAGE FAST PAGE FAST PAGE FAST PAGE FAST PAGE FAST PAGE
最长访问时间 120 ns 100 ns 120 ns 100 ns 120 ns 100 ns 120 ns 100 ns
其他特性 RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH
JESD-30 代码 R-CDSO-N28 R-CDSO-N28 R-CDSO-N28 R-CDSO-N28 R-CDIP-T28 R-CZIP-T28 R-CZIP-T28 R-CDIP-T28
长度 18.29 mm 18.29 mm 18.29 mm 18.29 mm 35.687 mm 36.83 mm 36.83 mm 35.687 mm
内存密度 1048576 bit 1048576 bit 1048576 bit 1048576 bit 1048576 bit 1048576 bit 1048576 bit 1048576 bi
内存集成电路类型 VIDEO DRAM VIDEO DRAM VIDEO DRAM VIDEO DRAM VIDEO DRAM VIDEO DRAM VIDEO DRAM VIDEO DRAM
内存宽度 4 4 4 4 4 4 4 4
功能数量 1 1 1 1 1 1 1 1
端口数量 2 2 2 2 2 2 2 2
端子数量 28 28 28 28 28 28 28 28
字数 262144 words 262144 words 262144 words 262144 words 262144 words 262144 words 262144 words 262144 words
字数代码 256000 256000 256000 256000 256000 256000 256000 256000
工作模式 SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS
最高工作温度 125 °C 125 °C 125 °C 125 °C 125 °C 125 °C 125 °C 125 °C
最低工作温度 -55 °C -55 °C -55 °C -55 °C -55 °C -55 °C -55 °C -55 °C
组织 256KX4 256KX4 256KX4 256KX4 256KX4 256KX4 256KX4 256KX4
封装主体材料 CERAMIC, METAL-SEALED COFIRED CERAMIC, METAL-SEALED COFIRED CERAMIC, METAL-SEALED COFIRED CERAMIC, METAL-SEALED COFIRED CERAMIC, METAL-SEALED COFIRED CERAMIC, METAL-SEALED COFIRED CERAMIC, METAL-SEALED COFIRED CERAMIC, METAL-SEALED COFIRED
封装代码 SON SON SON SON DIP ZIP ZIP DIP
封装形状 RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR
封装形式 SMALL OUTLINE SMALL OUTLINE SMALL OUTLINE SMALL OUTLINE IN-LINE IN-LINE IN-LINE IN-LINE
认证状态 Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified
筛选级别 MIL-STD-883 MIL-STD-883 MIL-STD-883 MIL-STD-883 MIL-STD-883 MIL-STD-883 MIL-STD-883 MIL-STD-883
座面最大高度 2.54 mm 2.54 mm 2.54 mm 2.54 mm 4.445 mm 13.08 mm 13.08 mm 4.445 mm
最大供电电压 (Vsup) 5.5 V 5.5 V 5.5 V 5.5 V 5.5 V 5.5 V 5.5 V 5.5 V
最小供电电压 (Vsup) 4.5 V 4.5 V 4.5 V 4.5 V 4.5 V 4.5 V 4.5 V 4.5 V
标称供电电压 (Vsup) 5 V 5 V 5 V 5 V 5 V 5 V 5 V 5 V
表面贴装 YES YES YES YES NO NO NO NO
技术 CMOS CMOS CMOS CMOS CMOS CMOS CMOS CMOS
温度等级 MILITARY MILITARY MILITARY MILITARY MILITARY MILITARY MILITARY MILITARY
端子形式 NO LEAD NO LEAD NO LEAD NO LEAD THROUGH-HOLE THROUGH-HOLE THROUGH-HOLE THROUGH-HOLE
端子节距 1.27 mm 1.27 mm 1.27 mm 1.27 mm 2.54 mm 2.54 mm 2.54 mm 2.54 mm
端子位置 DUAL DUAL DUAL DUAL DUAL ZIG-ZAG ZIG-ZAG DUAL
宽度 10.16 mm 10.16 mm 10.16 mm 10.16 mm 10.16 mm 2.92 mm 2.92 mm 10.16 mm
厂商名称 Micross - - - Micross Micross Micross Micross
JESD-609代码 e4 e4 e4 e4 e4 - - e4
端子面层 PALLADIUM GOLD PALLADIUM GOLD PALLADIUM GOLD PALLADIUM GOLD PALLADIUM GOLD - - PALLADIUM GOLD
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E0 E1 E2 E3 E4 E5 E6 E7 E8 E9 EA EB EC ED EE EF EG EH EI EJ EK EL EM EN EO EP EQ ER ES ET EU EV EW EX EY EZ F0 F1 F2 F3 F4 F5 F6 F7 F8 F9 FA FB FC FD FE FF FG FH FI FJ FK FL FM FN FO FP FQ FR FS FT FU FV FW FX FY FZ G0 G1 G2 G3 G4 G5 G6 G7 G8 G9 GA GB GC GD GE GF GG GH GI GJ GK GL GM GN GO GP GQ GR GS GT GU GV GW GX GZ H0 H1 H2 H3 H4 H5 H6 H7 H8 HA HB HC HD HE HF HG HH HI HJ HK HL HM HN HO HP HQ HR HS HT HU HV HW HX HY HZ I1 I2 I3 I4 I5 I6 I7 IA IB IC ID IE IF IG IH II IK IL IM IN IO IP IQ IR IS IT IU IV IW IX J0 J1 J2 J6 J7 JA JB JC JD JE JF JG JH JJ JK JL JM JN JP JQ JR JS JT JV JW JX JZ K0 K1 K2 K3 K4 K5 K6 K7 K8 K9 KA KB KC KD KE KF KG KH KI KJ KK KL KM KN KO KP KQ KR KS KT KU KV KW KX KY KZ
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