型号 | SN54ALS112AFH | SN74ALS112AFN | SN74AS112FN | SN74AS112N |
---|---|---|---|---|
描述 | IC,FLIP-FLOP,DUAL,J/K TYPE,ALS-TTL,LLCC,20PIN,CERAMIC | IC,FLIP-FLOP,DUAL,J/K TYPE,ALS-TTL,LDCC,20PIN,PLASTIC | IC,FLIP-FLOP,DUAL,J/K TYPE,AS-TTL,LDCC,20PIN,PLASTIC | IC,FLIP-FLOP,DUAL,J/K TYPE,AS-TTL,DIP,16PIN,PLASTIC |
是否Rohs认证 | 不符合 | 不符合 | 不符合 | 不符合 |
包装说明 | QCCN, LCC20,.35SQ | QCCJ, LDCC20,.4SQ | QCCJ, LDCC20,.4SQ | DIP, DIP16,.3 |
Reach Compliance Code | not_compliant | not_compliant | not_compliant | not_compliant |
JESD-30 代码 | S-XQCC-N20 | S-PQCC-J20 | S-PQCC-J20 | R-PDIP-T16 |
逻辑集成电路类型 | J-K FLIP-FLOP | J-K FLIP-FLOP | J-K FLIP-FLOP | J-K FLIP-FLOP |
功能数量 | 2 | 2 | 2 | 2 |
端子数量 | 20 | 20 | 20 | 16 |
最高工作温度 | 125 °C | 70 °C | 70 °C | 70 °C |
封装主体材料 | CERAMIC | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
封装代码 | QCCN | QCCJ | QCCJ | DIP |
封装等效代码 | LCC20,.35SQ | LDCC20,.4SQ | LDCC20,.4SQ | DIP16,.3 |
封装形状 | SQUARE | SQUARE | SQUARE | RECTANGULAR |
封装形式 | CHIP CARRIER | CHIP CARRIER | CHIP CARRIER | IN-LINE |
认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
表面贴装 | YES | YES | YES | NO |
技术 | TTL | TTL | TTL | TTL |
温度等级 | MILITARY | COMMERCIAL | COMMERCIAL | COMMERCIAL |
端子形式 | NO LEAD | J BEND | J BEND | THROUGH-HOLE |
端子节距 | 1.27 mm | 1.27 mm | 1.27 mm | 2.54 mm |
端子位置 | QUAD | QUAD | QUAD | DUAL |
触发器类型 | NEGATIVE EDGE | NEGATIVE EDGE | NEGATIVE EDGE | NEGATIVE EDGE |
厂商名称 | - | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) |