型号
- 型号
- 关键词
| 型号 | SN74AS112N | SN54ALS112AFH | SN74ALS112AFN | SN74AS112FN |
|---|---|---|---|---|
| 描述 | IC,FLIP-FLOP,DUAL,J/K TYPE,AS-TTL,DIP,16PIN,PLASTIC | IC,FLIP-FLOP,DUAL,J/K TYPE,ALS-TTL,LLCC,20PIN,CERAMIC | IC,FLIP-FLOP,DUAL,J/K TYPE,ALS-TTL,LDCC,20PIN,PLASTIC | IC,FLIP-FLOP,DUAL,J/K TYPE,AS-TTL,LDCC,20PIN,PLASTIC |
| 是否Rohs认证 | 不符合 | 不符合 | 不符合 | 不符合 |
| 包装说明 | DIP, DIP16,.3 | QCCN, LCC20,.35SQ | QCCJ, LDCC20,.4SQ | QCCJ, LDCC20,.4SQ |
| Reach Compliance Code | not_compliant | not_compliant | not_compliant | not_compliant |
| JESD-30 代码 | R-PDIP-T16 | S-XQCC-N20 | S-PQCC-J20 | S-PQCC-J20 |
| 逻辑集成电路类型 | J-K FLIP-FLOP | J-K FLIP-FLOP | J-K FLIP-FLOP | J-K FLIP-FLOP |
| 功能数量 | 2 | 2 | 2 | 2 |
| 端子数量 | 16 | 20 | 20 | 20 |
| 最高工作温度 | 70 °C | 125 °C | 70 °C | 70 °C |
| 封装主体材料 | PLASTIC/EPOXY | CERAMIC | PLASTIC/EPOXY | PLASTIC/EPOXY |
| 封装代码 | DIP | QCCN | QCCJ | QCCJ |
| 封装等效代码 | DIP16,.3 | LCC20,.35SQ | LDCC20,.4SQ | LDCC20,.4SQ |
| 封装形状 | RECTANGULAR | SQUARE | SQUARE | SQUARE |
| 封装形式 | IN-LINE | CHIP CARRIER | CHIP CARRIER | CHIP CARRIER |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 表面贴装 | NO | YES | YES | YES |
| 技术 | TTL | TTL | TTL | TTL |
| 温度等级 | COMMERCIAL | MILITARY | COMMERCIAL | COMMERCIAL |
| 端子形式 | THROUGH-HOLE | NO LEAD | J BEND | J BEND |
| 端子节距 | 2.54 mm | 1.27 mm | 1.27 mm | 1.27 mm |
| 端子位置 | DUAL | QUAD | QUAD | QUAD |
| 触发器类型 | NEGATIVE EDGE | NEGATIVE EDGE | NEGATIVE EDGE | NEGATIVE EDGE |
| 厂商名称 | Texas Instruments(德州仪器) | - | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) |