型号
- 型号
- 关键词
IC,LOGIC GATE,QUAD 2-INPUT AND,LS-TTL,SOP,14PIN,PLASTIC
器件类别：逻辑
厂商名称：NXP(恩智浦)
厂商官网：https://www.nxp.com
下载文档| 型号 | SN74LS09DR2 | SN74LS09J | SN74LS09JDS | SN74LS09NS | SN74LS09D | 54LS09/BDBJC | 54LS09/BCBJC | 54LS09/BABJC |
|---|---|---|---|---|---|---|---|---|
| 描述 | IC,LOGIC GATE,QUAD 2-INPUT AND,LS-TTL,SOP,14PIN,PLASTIC | IC,LOGIC GATE,QUAD 2-INPUT AND,LS-TTL,DIP,14PIN,CERAMIC | IC,LOGIC GATE,QUAD 2-INPUT AND,LS-TTL,DIP,14PIN,CERAMIC | IC,LOGIC GATE,QUAD 2-INPUT AND,LS-TTL,DIP,14PIN,PLASTIC | IC,LOGIC GATE,QUAD 2-INPUT AND,LS-TTL,SOP,14PIN,PLASTIC | IC,LOGIC GATE,QUAD 2-INPUT AND,LS-TTL,FP,14PIN,CERAMIC | IC,LOGIC GATE,QUAD 2-INPUT AND,LS-TTL,DIP,14PIN,CERAMIC | IC,LOGIC GATE,QUAD 2-INPUT AND,LS-TTL,FP,14PIN,CERAMIC |
| 是否Rohs认证 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 |
| 厂商名称 | NXP(恩智浦) | NXP(恩智浦) | NXP(恩智浦) | NXP(恩智浦) | NXP(恩智浦) | NXP(恩智浦) | NXP(恩智浦) | NXP(恩智浦) |
| 包装说明 | SOP, SOP14,.25 | DIP, DIP14,.3 | DIP, DIP14,.3 | DIP, DIP14,.3 | SOP, SOP14,.25 | DFP, FL14,.3 | DIP, DIP14,.3 | DFP, FL14,.3 |
| Reach Compliance Code | unknown | unknown | unknown | unknown | unknown | unknown | unknown | unknown |
| JESD-30 代码 | R-PDSO-G14 | R-XDIP-T14 | R-XDIP-T14 | R-PDIP-T14 | R-PDSO-G14 | R-XDFP-F14 | R-XDIP-T14 | R-XDFP-F14 |
| JESD-609代码 | e0 | e0 | e0 | e0 | e0 | e0 | e0 | e0 |
| 逻辑集成电路类型 | AND GATE | AND GATE | AND GATE | AND GATE | AND GATE | AND GATE | AND GATE | AND GATE |
| 端子数量 | 14 | 14 | 14 | 14 | 14 | 14 | 14 | 14 |
| 最高工作温度 | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 125 °C | 125 °C | 125 °C |
| 输出特性 | OPEN-COLLECTOR | OPEN-COLLECTOR | OPEN-COLLECTOR | OPEN-COLLECTOR | OPEN-COLLECTOR | OPEN-COLLECTOR | OPEN-COLLECTOR | OPEN-COLLECTOR |
| 封装主体材料 | PLASTIC/EPOXY | CERAMIC | CERAMIC | PLASTIC/EPOXY | PLASTIC/EPOXY | CERAMIC | CERAMIC | CERAMIC |
| 封装代码 | SOP | DIP | DIP | DIP | SOP | DFP | DIP | DFP |
| 封装等效代码 | SOP14,.25 | DIP14,.3 | DIP14,.3 | DIP14,.3 | SOP14,.25 | FL14,.3 | DIP14,.3 | FL14,.3 |
| 封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| 封装形式 | SMALL OUTLINE | IN-LINE | IN-LINE | IN-LINE | SMALL OUTLINE | FLATPACK | IN-LINE | FLATPACK |
| 电源 | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| 施密特触发器 | NO | NO | NO | NO | NO | NO | NO | NO |
| 标称供电电压 (Vsup) | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| 表面贴装 | YES | NO | NO | NO | YES | YES | NO | YES |
| 技术 | TTL | TTL | TTL | TTL | TTL | TTL | TTL | TTL |
| 温度等级 | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | MILITARY | MILITARY | MILITARY |
| 端子面层 | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
| 端子形式 | GULL WING | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | GULL WING | FLAT | THROUGH-HOLE | FLAT |
| 端子节距 | 1.27 mm | 2.54 mm | 2.54 mm | 2.54 mm | 1.27 mm | 1.27 mm | 2.54 mm | 1.27 mm |
| 端子位置 | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL |
| Base Number Matches | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
| 认证状态 | Not Qualified | Not Qualified | - | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
模拟电子
单片机
嵌入式系统
stm32/stm8
嵌入式系统
51单片机
