型号
- 型号
- 关键词
Single Pole, Double-Throw (SPDT) Analog Switch or 2:1 Analog Multiplexer/Demultiplexer 8-VSSOP
器件标准：
| 型号 | SN74LVC2G53DCUTG4 | SN74LVC2G53DCTRE4 | SN74LVC2G53DCTRG4 | SN74LVC2G53DCURE4 | SN74LVC2G53DCURG4 | SN74LVC2G53DCUT |
|---|---|---|---|---|---|---|
| 描述 | Single Pole, Double-Throw (SPDT) Analog Switch or 2:1 Analog Multiplexer/Demultiplexer 8-VSSOP | Single Pole, Double-Throw (SPDT) Analog Switch or 2:1 Analog Multiplexer/Demultiplexer 8-SM8 -40 to 85 | Single Pole, Double-Throw (SPDT) Analog Switch or 2:1 Analog Multiplexer/Demultiplexer 8-SM8 -40 to 85 | Analog Switch ICs Dual Analog | Single Pole, Double-Throw (SPDT) Analog Switch or 2:1 Analog Multiplexer/Demultiplexer 8-VSSOP -40 to 85 | Single Pole, Double-Throw (SPDT) Analog Switch or 2:1 Analog Multiplexer/Demultiplexer 8-VSSOP -40 to 85 |
| Brand Name | Texas Instruments | Texas Instruments | Texas Instruments | Texas Instruments | Texas Instruments | Texas Instruments |
| 是否Rohs认证 | 符合 | 符合 | 符合 | 符合 | 符合 | 符合 |
| 厂商名称 | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) |
| 包装说明 | VSSOP, TSSOP8,.12,20 | LSSOP, SSOP8,.16 | LSSOP, SSOP8,.16 | VSSOP, TSSOP8,.12,20 | VSSOP, TSSOP8,.12,20 | VSSOP, TSSOP8,.12,20 |
| Reach Compliance Code | compliant | compliant | compliant | compliant | compliant | compliant |
| 模拟集成电路 - 其他类型 | SINGLE-ENDED MULTIPLEXER | SINGLE-ENDED MULTIPLEXER | SINGLE-ENDED MULTIPLEXER | SINGLE-ENDED MULTIPLEXER | SINGLE-ENDED MULTIPLEXER | SINGLE-ENDED MULTIPLEXER |
| JESD-30 代码 | R-PDSO-G8 | R-PDSO-G8 | R-PDSO-G8 | R-PDSO-G8 | R-PDSO-G8 | R-PDSO-G8 |
| 长度 | 2.3 mm | 2.95 mm | 2.95 mm | 2.3 mm | 2.3 mm | 2.3 mm |
| 信道数量 | 1 | 2 | 2 | 2 | 2 | 2 |
| 功能数量 | 1 | 1 | 1 | 1 | 1 | 1 |
| 端子数量 | 8 | 8 | 8 | 8 | 8 | 8 |
| 最大通态电阻 (Ron) | 30 Ω | 20 Ω | 20 Ω | 20 Ω | 20 Ω | 20 Ω |
| 最高工作温度 | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C |
| 最低工作温度 | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C |
| 封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| 封装代码 | VSSOP | LSSOP | LSSOP | VSSOP | VSSOP | VSSOP |
| 封装等效代码 | TSSOP8,.12,20 | SSOP8,.16 | SSOP8,.16 | TSSOP8,.12,20 | TSSOP8,.12,20 | TSSOP8,.12,20 |
| 封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| 封装形式 | SMALL OUTLINE, VERY THIN PROFILE, SHRINK PITCH | SMALL OUTLINE, LOW PROFILE, SHRINK PITCH | SMALL OUTLINE, LOW PROFILE, SHRINK PITCH | SMALL OUTLINE, VERY THIN PROFILE, SHRINK PITCH | SMALL OUTLINE, VERY THIN PROFILE, SHRINK PITCH | SMALL OUTLINE, VERY THIN PROFILE, SHRINK PITCH |
| 峰值回流温度（摄氏度） | 260 | 260 | 260 | NOT SPECIFIED | 260 | 260 |
| 电源 | 1.8/5 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 座面最大高度 | 0.85 mm | 1.3 mm | 1.3 mm | 0.9 mm | 0.9 mm | 0.9 mm |
| 最大信号电流 | 0.1 A | 0.1 A | 0.1 A | 0.1 A | 0.1 A | 0.1 A |
| 最大供电电流 (Isup) | 0.01 mA | 0.01 mA | 0.01 mA | 0.01 mA | 0.01 mA | 0.01 mA |
| 表面贴装 | YES | YES | YES | YES | YES | YES |
| 技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
| 温度等级 | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL |
| 端子形式 | GULL WING | GULL WING | GULL WING | GULL WING | GULL WING | GULL WING |
| 端子节距 | 0.5 mm | 0.65 mm | 0.65 mm | 0.5 mm | 0.5 mm | 0.5 mm |
| 端子位置 | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
| 宽度 | 2 mm | 2.8 mm | 2.8 mm | 2 mm | 2 mm | 2 mm |
| Base Number Matches | 1 | 1 | 1 | 1 | 1 | 1 |
| 是否无铅 | 不含铅 | - | 不含铅 | 含铅 | 不含铅 | 不含铅 |
| Factory Lead Time | 6 weeks | - | 6 weeks | 16 weeks | 6 weeks | 1 week |
| 标称带宽 | 300 MHz | - | 300 MHz | - | 300 MHz | 300 MHz |
| JESD-609代码 | e4 | e4 | e4 | - | e4 | e4 |
| 湿度敏感等级 | 1 | 1 | 1 | - | 1 | 1 |
| 输出 | COMMON OUTPUT | - | COMMON OUTPUT | - | COMMON OUTPUT | COMMON OUTPUT |
| 切换 | BREAK-BEFORE-MAKE | - | BREAK-BEFORE-MAKE | - | BREAK-BEFORE-MAKE | BREAK-BEFORE-MAKE |
| 端子面层 | Nickel/Palladium/Gold (Ni/Pd/Au) | Nickel/Palladium/Gold (Ni/Pd/Au) | Nickel/Palladium/Gold (Ni/Pd/Au) | - | Nickel/Palladium/Gold (Ni/Pd/Au) | Nickel/Palladium/Gold (Ni/Pd/Au) |
| 零件包装代码 | - | SOIC | SOIC | SOIC | SOIC | SOIC |
| 针数 | - | 8 | 8 | 8 | 8 | 8 |
| 标称断态隔离度 | - | 50 dB | 50 dB | 50 dB | 50 dB | 50 dB |
| 通态电阻匹配规范 | - | 5 Ω | 5 Ω | 5 Ω | 5 Ω | 5 Ω |
| 最大供电电压 (Vsup) | - | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V |
| 最小供电电压 (Vsup) | - | 1.65 V | 1.65 V | 1.65 V | 1.65 V | 1.65 V |
| 标称供电电压 (Vsup) | - | 2.3 V | 2.3 V | 2.3 V | 2.3 V | 2.3 V |
| 最长断开时间 | - | 7.9 ns | 7.9 ns | 7.9 ns | 7.9 ns | 7.9 ns |
| 最长接通时间 | - | 7.2 ns | 7.2 ns | 7.2 ns | 7.2 ns | 7.2 ns |
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