IC,EEPROM,NOR FLASH,1MX16,CMOS,BGA,48PIN,PLASTIC
厂商名称:Microchip(微芯科技)
厂商官网:https://www.microchip.com
器件标准:
下载文档型号 | SST39WF1602-70-4I-B3KE-MQ2-T | SST39WF1602-70-4I-B3KE-MQ2 | SST39WF1601-70-4I-B3KE-MQ1 | SST39WF1602-70-4I-MAQE-MQ2 | SST39WF1602-70-4I-MAQE-MQ2-T |
---|---|---|---|---|---|
描述 | IC,EEPROM,NOR FLASH,1MX16,CMOS,BGA,48PIN,PLASTIC | FLASH 1.8V PROM | FLASH 1.8V PROM | Flash, 1MX16, 70ns, PBGA48 | Flash, 1MX16, 70ns, PBGA48 |
Reach Compliance Code | compliant | compli | compliant | compliant | compliant |
最长访问时间 | 70 ns | 70 ns | 70 ns | 70 ns | 70 ns |
JESD-30 代码 | R-PBGA-B48 | R-PBGA-B48 | R-PBGA-B48 | R-PBGA-B48 | R-PBGA-B48 |
内存密度 | 16777216 bit | 16777216 bi | 16777216 bit | 16777216 bit | 16777216 bit |
内存集成电路类型 | FLASH | FLASH | FLASH | FLASH | FLASH |
内存宽度 | 16 | 16 | 16 | 16 | 16 |
端子数量 | 48 | 48 | 48 | 48 | 48 |
字数 | 1048576 words | 1048576 words | 1048576 words | 1048576 words | 1048576 words |
字数代码 | 1000000 | 1000000 | 1000000 | 1000000 | 1000000 |
最高工作温度 | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C |
最低工作温度 | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C |
组织 | 1MX16 | 1MX16 | 1MX16 | 1MX16 | 1MX16 |
封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
封装代码 | FBGA | TFBGA | TFBGA | VFBGA | VFBGA |
封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
封装形式 | GRID ARRAY, FINE PITCH | GRID ARRAY, THIN PROFILE, FINE PITCH | GRID ARRAY, THIN PROFILE, FINE PITCH | GRID ARRAY, VERY THIN PROFILE, FINE PITCH | GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
并行/串行 | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL |
标称供电电压 (Vsup) | 1.8 V | 1.8 V | 1.8 V | 1.8 V | 1.8 V |
表面贴装 | YES | YES | YES | YES | YES |
技术 | CMOS | CMOS | CMOS | CMOS | CMOS |
温度等级 | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL |
端子形式 | BALL | BALL | BALL | BALL | BALL |
端子节距 | 0.8 mm | 0.8 mm | 0.8 mm | 0.5 mm | 0.5 mm |
端子位置 | BOTTOM | BOTTOM | BOTTOM | BOTTOM | BOTTOM |
是否Rohs认证 | 符合 | 符合 | 符合 | - | - |
厂商名称 | Microchip(微芯科技) | Microchip(微芯科技) | - | - | Microchip(微芯科技) |
筛选级别 | AEC-Q100 | AEC-Q100 | AEC-Q100 | - | - |
包装说明 | - | TFBGA-48 | TFBGA, | VFBGA, | WFBGA-48 |
长度 | - | 8 mm | 8 mm | 6 mm | 6 mm |
功能数量 | - | 1 | 1 | 1 | 1 |
工作模式 | - | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS |
编程电压 | - | 1.8 V | 1.8 V | 1.8 V | 1.8 V |
座面最大高度 | - | 1.2 mm | 1.2 mm | 0.73 mm | 0.73 mm |
最大供电电压 (Vsup) | - | 1.95 V | 1.95 V | 1.95 V | 1.95 V |
最小供电电压 (Vsup) | - | 1.65 V | 1.65 V | 1.65 V | 1.65 V |
宽度 | - | 6 mm | 6 mm | 4 mm | 4 mm |