1.5 A 2 CHANNEL, BUF OR INV BASED MOSFET DRIVER, PDSO8, 0.150 INCH, PLASTIC, MS-012, SOIC-8
厂商名称:Microchip(微芯科技)
厂商官网:https://www.microchip.com
器件标准:
下载文档型号 | TC4427COAG | TC4426COA713G | TC4426CPAG | TC4426EOAG | TC4426EOA713G | TC4427COA713G | TC4427VOAG | TC4428COA713G | TC4427EOAG |
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描述 | 1.5 A 2 CHANNEL, BUF OR INV BASED MOSFET DRIVER, PDSO8, 0.150 INCH, PLASTIC, MS-012, SOIC-8 | 1.5 A 2 CHANNEL, BUF OR INV BASED MOSFET DRIVER, PDSO8, 0.150 INCH, PLASTIC, MS-012, SOIC-8 | 1.5 A 2 CHANNEL, BUF OR INV BASED MOSFET DRIVER, PDIP8, 0.300 INCH, PLASTIC, MS-001, DIP-8 | 1.5 A 2 CHANNEL, BUF OR INV BASED MOSFET DRIVER, PDSO8, 0.150 INCH, PLASTIC, MS-012, SOIC-8 | 1.5 A 2 CHANNEL, BUF OR INV BASED MOSFET DRIVER, PDSO8, 0.150 INCH, PLASTIC, MS-012, SOIC-8 | 1.5 A 2 CHANNEL, BUF OR INV BASED MOSFET DRIVER, PDSO8, 0.150 INCH, PLASTIC, MS-012, SOIC-8 | IC,DUAL MOSFET DRIVER,CMOS,SOP,8PIN,PLASTIC | 1.5 A 2 CHANNEL, BUF OR INV BASED MOSFET DRIVER, PDSO8, 0.150 INCH, PLASTIC, MS-012, SOIC-8 | 1.5 A 2 CHANNEL, BUF OR INV BASED MOSFET DRIVER, PDSO8, 0.150 INCH, PLASTIC, MS-012, SOIC-8 |
是否无铅 | 不含铅 | 不含铅 | 不含铅 | 不含铅 | 不含铅 | 不含铅 | 不含铅 | 不含铅 | 不含铅 |
是否Rohs认证 | 符合 | 符合 | 符合 | 符合 | 符合 | 符合 | 符合 | 符合 | 符合 |
包装说明 | SOP, SOP8,.25 | 0.150 INCH, PLASTIC, MS-012, SOIC-8 | 0.300 INCH, PLASTIC, MS-001, DIP-8 | 0.150 INCH, PLASTIC, MS-012, SOIC-8 | 0.150 INCH, PLASTIC, MS-012, SOIC-8 | SOP, SOP8,.25 | SOP, SOP8,.25 | 0.150 INCH, PLASTIC, MS-012, SOIC-8 | SOP, SOP8,.25 |
Reach Compliance Code | compliant | compliant | compliant | compliant | compliant | compliant | compliant | compliant | compliant |
JESD-30 代码 | R-PDSO-G8 | R-PDSO-G8 | R-PDIP-T8 | R-PDSO-G8 | R-PDSO-G8 | R-PDSO-G8 | R-PDSO-G8 | R-PDSO-G8 | R-PDSO-G8 |
JESD-609代码 | e3 | e3 | e3 | e3 | e3 | e3 | e3 | e3 | e3 |
端子数量 | 8 | 8 | 8 | 8 | 8 | 8 | 8 | 8 | 8 |
最高工作温度 | 70 °C | 70 °C | 70 °C | 85 °C | 85 °C | 70 °C | 125 °C | 70 °C | 85 °C |
封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
封装代码 | SOP | SOP | DIP | SOP | SOP | SOP | SOP | SOP | SOP |
封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
封装形式 | SMALL OUTLINE | SMALL OUTLINE | IN-LINE | SMALL OUTLINE | SMALL OUTLINE | SMALL OUTLINE | SMALL OUTLINE | SMALL OUTLINE | SMALL OUTLINE |
认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
表面贴装 | YES | YES | NO | YES | YES | YES | YES | YES | YES |
温度等级 | COMMERCIAL | COMMERCIAL | COMMERCIAL | INDUSTRIAL | INDUSTRIAL | COMMERCIAL | AUTOMOTIVE | COMMERCIAL | INDUSTRIAL |
端子面层 | Matte Tin (Sn) | Matte Tin (Sn) - annealed | Matte Tin (Sn) | Matte Tin (Sn) | Matte Tin (Sn) | Matte Tin (Sn) | Matte Tin (Sn) | Matte Tin (Sn) | Matte Tin (Sn) |
端子形式 | GULL WING | GULL WING | THROUGH-HOLE | GULL WING | GULL WING | GULL WING | GULL WING | GULL WING | GULL WING |
端子节距 | 1.27 mm | 1.27 mm | 2.54 mm | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm |
端子位置 | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL |
厂商名称 | Microchip(微芯科技) | Microchip(微芯科技) | Microchip(微芯科技) | Microchip(微芯科技) | Microchip(微芯科技) | - | Microchip(微芯科技) | Microchip(微芯科技) | Microchip(微芯科技) |
零件包装代码 | SOIC | SOIC | DIP | SOIC | SOIC | SOIC | - | SOIC | SOIC |
针数 | 8 | 8 | 8 | 8 | 8 | 8 | - | 8 | 8 |
ECCN代码 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | - | EAR99 | EAR99 |
高边驱动器 | YES | YES | YES | YES | YES | YES | - | YES | YES |
接口集成电路类型 | BUFFER OR INVERTER BASED MOSFET DRIVER | BUFFER OR INVERTER BASED MOSFET DRIVER | BUFFER OR INVERTER BASED MOSFET DRIVER | BUFFER OR INVERTER BASED MOSFET DRIVER | BUFFER OR INVERTER BASED MOSFET DRIVER | BUFFER OR INVERTER BASED MOSFET DRIVER | - | BUFFER OR INVERTER BASED MOSFET DRIVER | BUFFER OR INVERTER BASED MOSFET DRIVER |
长度 | 4.9 mm | 4.9 mm | 9.46 mm | 4.9 mm | 4.9 mm | 4.9 mm | - | 4.9 mm | 4.9 mm |
湿度敏感等级 | 1 | 1 | - | 1 | 1 | 1 | - | 1 | 1 |
功能数量 | 2 | 2 | 2 | 2 | 2 | 2 | - | 2 | 2 |
标称输出峰值电流 | 1.5 A | 1.5 A | 1.5 A | 1.5 A | 1.5 A | 1.5 A | - | 1.5 A | 1.5 A |
封装等效代码 | SOP8,.25 | SOP8,.25 | DIP8,.3 | SOP8,.25 | SOP8,.25 | SOP8,.25 | SOP8,.25 | - | SOP8,.25 |
峰值回流温度(摄氏度) | 260 | 260 | NOT SPECIFIED | 260 | 260 | 260 | - | 260 | 260 |
电源 | 4.5/18 V | 4.5/18 V | 4.5/18 V | 4.5/18 V | 4.5/18 V | 4.5/18 V | 4.5/18 V | - | 4.5/18 V |
座面最大高度 | 1.75 mm | 1.75 mm | 4.32 mm | 1.75 mm | 1.75 mm | 1.75 mm | - | 1.75 mm | 1.75 mm |
最大供电电压 | 18 V | 18 V | 18 V | 18 V | 18 V | 18 V | - | 18 V | 18 V |
最小供电电压 | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | - | 4.5 V | 4.5 V |
技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | - | CMOS |
处于峰值回流温度下的最长时间 | 40 | 40 | NOT SPECIFIED | 40 | 40 | 40 | - | 40 | 40 |
断开时间 | 0.06 µs | 0.06 µs | 0.06 µs | 0.06 µs | 0.06 µs | 0.06 µs | - | 0.06 µs | 0.06 µs |
接通时间 | 0.04 µs | 0.04 µs | 0.04 µs | 0.04 µs | 0.04 µs | 0.04 µs | - | 0.04 µs | 0.04 µs |
宽度 | 3.91 mm | 3.91 mm | 7.62 mm | 3.91 mm | 3.91 mm | 3.91 mm | - | 3.91 mm | 3.91 mm |
Base Number Matches | - | 1 | 1 | 1 | 1 | 1 | 1 | - | - |