型号
- 型号
- 关键词
IC 128K X 32 CACHE SRAM, 4 ns, PQFP100, 14 X 20 MM, 1.60 MM HEIGHT, 0.65 MM PITCH, PLASTIC, LQFP-100, Static RAM
厂商名称：Toshiba(东芝)
厂商官网：http://toshiba-semicon-storage.com/
下载文档| 型号 | TC55V4316FF-167 | TC55V4316FF-150 | TC55V4316FF-133 |
|---|---|---|---|
| 描述 | IC 128K X 32 CACHE SRAM, 4 ns, PQFP100, 14 X 20 MM, 1.60 MM HEIGHT, 0.65 MM PITCH, PLASTIC, LQFP-100, Static RAM | IC 128K X 32 CACHE SRAM, 4.4 ns, PQFP100, 14 X 20 MM, 1.60 MM HEIGHT, 0.65 MM PITCH, PLASTIC, LQFP-100, Static RAM | IC 128K X 32 CACHE SRAM, 5 ns, PQFP100, 14 X 20 MM, 1.60 MM HEIGHT, 0.65 MM PITCH, PLASTIC, LQFP-100, Static RAM |
| 是否Rohs认证 | 不符合 | 不符合 | 不符合 |
| 厂商名称 | Toshiba(东芝) | Toshiba(东芝) | Toshiba(东芝) |
| 零件包装代码 | QFP | QFP | QFP |
| 包装说明 | LQFP, QFP100,.63X.87 | LQFP, QFP100,.63X.87 | LQFP, QFP100,.63X.87 |
| 针数 | 100 | 100 | 100 |
| Reach Compliance Code | unknown | unknown | unknown |
| ECCN代码 | 3A991.B.2.A | 3A991.B.2.A | 3A991.B.2.A |
| 最长访问时间 | 4 ns | 4.4 ns | 5 ns |
| 其他特性 | PIPELINED ARCHITECTURE | PIPELINED ARCHITECTURE | PIPELINED ARCHITECTURE |
| 最大时钟频率 (fCLK) | 167 MHz | 150 MHz | 133 MHz |
| I/O 类型 | COMMON | COMMON | COMMON |
| JESD-30 代码 | R-PQFP-G100 | R-PQFP-G100 | R-PQFP-G100 |
| JESD-609代码 | e0 | e0 | e0 |
| 长度 | 20 mm | 20 mm | 20 mm |
| 内存密度 | 4194304 bit | 4194304 bit | 4194304 bit |
| 内存集成电路类型 | CACHE SRAM | CACHE SRAM | CACHE SRAM |
| 内存宽度 | 32 | 32 | 32 |
| 功能数量 | 1 | 1 | 1 |
| 端子数量 | 100 | 100 | 100 |
| 字数 | 131072 words | 131072 words | 131072 words |
| 字数代码 | 128000 | 128000 | 128000 |
| 工作模式 | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS |
| 最高工作温度 | 70 °C | 70 °C | 70 °C |
| 组织 | 128KX32 | 128KX32 | 128KX32 |
| 输出特性 | 3-STATE | 3-STATE | 3-STATE |
| 封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| 封装代码 | LQFP | LQFP | LQFP |
| 封装等效代码 | QFP100,.63X.87 | QFP100,.63X.87 | QFP100,.63X.87 |
| 封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| 封装形式 | FLATPACK, LOW PROFILE | FLATPACK, LOW PROFILE | FLATPACK, LOW PROFILE |
| 并行/串行 | PARALLEL | PARALLEL | PARALLEL |
| 电源 | 2.5/3.3,3.3 V | 2.5/3.3,3.3 V | 2.5/3.3,3.3 V |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified |
| 座面最大高度 | 1.7 mm | 1.7 mm | 1.7 mm |
| 最大待机电流 | 0.003 A | 0.003 A | 0.003 A |
| 最小待机电流 | 3.1 V | 3.1 V | 3.1 V |
| 最大压摆率 | 0.37 mA | 0.355 mA | 0.33 mA |
| 最大供电电压 (Vsup) | 3.6 V | 3.6 V | 3.6 V |
| 最小供电电压 (Vsup) | 3.1 V | 3.1 V | 3.1 V |
| 标称供电电压 (Vsup) | 3.3 V | 3.3 V | 3.3 V |
| 表面贴装 | YES | YES | YES |
| 技术 | CMOS | CMOS | CMOS |
| 温度等级 | COMMERCIAL | COMMERCIAL | COMMERCIAL |
| 端子面层 | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
| 端子形式 | GULL WING | GULL WING | GULL WING |
| 端子节距 | 0.65 mm | 0.65 mm | 0.65 mm |
| 端子位置 | QUAD | QUAD | QUAD |
| 宽度 | 14 mm | 14 mm | 14 mm |
