型号
- 型号
- 关键词
| 型号 | TLC5510AINS | TLC5510AINSG4 | TLC5510INSG4 | TLC5510IPWR | TLC5510INS |
|---|---|---|---|---|---|
| 描述 | 8-Bit, 20-MSPS Analog-to-Digital Converter (ADC) 24-SO -20 to 75 | Analog to Digital Converters - ADC 8bit High Speed ADC | Analog to Digital Converters - ADC 8bit 20Msps 1ch 5V | 8-Bit, 20-MSPS Analog-to-Digital Converter (ADC) 24-TSSOP -20 to 75 | 8-Bit, 20-MSPS Analog-to-Digital Converter (ADC) 24-SO -20 to 75 |
| Brand Name | Texas Instruments | Texas Instruments | Texas Instruments | Texas Instruments | Texas Instruments |
| 是否无铅 | 不含铅 | 不含铅 | 不含铅 | 不含铅 | 不含铅 |
| 是否Rohs认证 | 符合 | 符合 | 符合 | 符合 | 符合 |
| 零件包装代码 | SOIC | SOIC | SOIC | TSSOP | SOIC |
| 包装说明 | SOP-24 | SOP, SOP24,.3 | SOP, SOP24,.3 | TSSOP, TSSOP24,.25 | SOP, SOP24,.3 |
| 针数 | 24 | 24 | 24 | 24 | 24 |
| Reach Compliance Code | compliant | compli | compli | compli | compli |
| ECCN代码 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 |
| 最大模拟输入电压 | 4 V | 4 V | 2 V | 2 V | 2 V |
| 转换器类型 | ADC, FLASH METHOD | ADC, FLASH METHOD | ADC, FLASH METHOD | ADC, FLASH METHOD | ADC, FLASH METHOD |
| JESD-30 代码 | R-PDSO-G24 | R-PDSO-G24 | R-PDSO-G24 | R-PDSO-G24 | R-PDSO-G24 |
| JESD-609代码 | e4 | e4 | e4 | e4 | e4 |
| 长度 | 15 mm | 15 mm | 15 mm | 7.8 mm | 15 mm |
| 最大线性误差 (EL) | 0.3906% | 0.3906% | 0.3906% | 0.3906% | 0.3906% |
| 湿度敏感等级 | 1 | 1 | 1 | 2 | 1 |
| 模拟输入通道数量 | 1 | 1 | 1 | 1 | 1 |
| 位数 | 8 | 8 | 8 | 8 | 8 |
| 功能数量 | 1 | 1 | 1 | 1 | 1 |
| 端子数量 | 24 | 24 | 24 | 24 | 24 |
| 最高工作温度 | 75 °C | 75 °C | 75 °C | 75 °C | 75 °C |
| 最低工作温度 | -20 °C | -20 °C | -20 °C | -20 °C | -20 °C |
| 输出位码 | BINARY | BINARY | BINARY | BINARY | BINARY |
| 输出格式 | PARALLEL, 8 BITS | PARALLEL, 8 BITS | PARALLEL, 8 BITS | PARALLEL, 8 BITS | PARALLEL, 8 BITS |
| 封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| 封装代码 | SOP | SOP | SOP | TSSOP | SOP |
| 封装等效代码 | SOP24,.3 | SOP24,.3 | SOP24,.3 | TSSOP24,.25 | SOP24,.3 |
| 封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| 封装形式 | SMALL OUTLINE | SMALL OUTLINE | SMALL OUTLINE | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE |
| 峰值回流温度（摄氏度） | 260 | 260 | 260 | 260 | 260 |
| 电源 | 5 V | 5 V | 5 V | 5 V | 5 V |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 采样速率 | 20 MHz | 20 MHz | 20 MHz | 20 MHz | 20 MHz |
| 采样并保持/跟踪并保持 | SAMPLE | SAMPLE | SAMPLE | SAMPLE | SAMPLE |
| 座面最大高度 | 2 mm | 2 mm | 2 mm | 1.2 mm | 2 mm |
| 标称供电电压 | 5 V | 5 V | 5 V | 5 V | 5 V |
| 表面贴装 | YES | YES | YES | YES | YES |
| 技术 | CMOS | CMOS | CMOS | CMOS | CMOS |
| 温度等级 | COMMERCIAL EXTENDED | COMMERCIAL EXTENDED | COMMERCIAL EXTENDED | COMMERCIAL EXTENDED | COMMERCIAL EXTENDED |
| 端子面层 | Nickel/Palladium/Gold (Ni/Pd/Au) | Nickel/Palladium/Gold (Ni/Pd/Au) | Nickel/Palladium/Gold (Ni/Pd/Au) | Nickel/Palladium/Gold (Ni/Pd/Au) | Nickel/Palladium/Gold (Ni/Pd/Au) |
| 端子形式 | GULL WING | GULL WING | GULL WING | GULL WING | GULL WING |
| 端子节距 | 1.27 mm | 1.27 mm | 1.27 mm | 0.65 mm | 1.27 mm |
| 端子位置 | DUAL | DUAL | DUAL | DUAL | DUAL |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
| 宽度 | 5.3 mm | 5.3 mm | 5.3 mm | 4.4 mm | 5.3 mm |
| 厂商名称 | Texas Instruments(德州仪器) | - | Texas Instruments(德州仪器) | - | Texas Instruments(德州仪器) |
| 最大压摆率 | 27 mA | - | - | 27 mA | 27 mA |
| Base Number Matches | 1 | 1 | - | 1 | - |
嵌入式系统
测试/测量
嵌入式系统
嵌入式系统
DSP 与 ARM 处理器
NXP MCU
