型号
- 型号
- 关键词
| 型号 | TMS320C6202BGNY300 | TMS320C6202BGNY250 | TMS320C6202GJL200 | TMS320C6202GJL250 | TMS320C6202GJL250X | TMS320C6202GJLA200 | TMS320C6202GJLA233 | TMS320C6202GLS250 | TMS320C6202GLS250X |
|---|---|---|---|---|---|---|---|---|---|
| 描述 | Fixed-Point Digital Signal Processor 384-FC/CSP | Fixed-Point Digital Signal Processor 384-FC/CSP | Fixed-Point Digital Signal Processor 352-FCBGA | Fixed-Point Digital Signal Processor 352-FCBGA | Digital Signal Processors & Controllers - DSP, DSC Fixed-Pt Dig Signal Proc | Fixed-Point Digital Signal Processor 352-FCBGA 0 to 0 | Fixed-Point Digital Signal Processor 352-FCBGA | Fixed-Point Digital Signal Processor | Digital Signal Processors & Controllers - DSP, DSC Fixed-Pt Dig Signal Proc |
| Brand Name | Texas Instruments | Texas Instruments | Texas Instruments | Texas Instruments | Texas Instruments | Texas Instruments | Texas Instruments | Texas Instruments | Texas Instruments |
| 零件包装代码 | BGA | BGA | BGA | BGA | BGA | BGA | BGA | BGA | BGA |
| 包装说明 | FBGA, BGA384,22X22,32 | FBGA, BGA384,22X22,32 | HBGA, BGA352,26X26,40 | HBGA, BGA352,26X26,40 | HBGA, BGA352,26X26,40 | HBGA, BGA352,26X26,40 | HBGA, BGA352,26X26,40 | HFBGA, BGA384,22X22,32 | HFBGA, BGA384,22X22,32 |
| 针数 | 384 | 384 | 352 | 352 | 352 | 352 | 352 | 384 | 384 |
| Reach Compliance Code | _compli | _compli | _compli | _compli | not_compliant | _compli | _compli | _compli | not_compliant |
| ECCN代码 | 3A001.A.3 | 3A001.A.3 | 3A001.A.3 | 3A001.A.3 | 3A001.A.3 | 3A001.A.3 | 3A001.A.3 | 3A001.A.3 | 3A001.A.3 |
| 其他特性 | ALSO REQUIRES 3.3V SUPPLY | ALSO REQUIRES 3.3V SUPPLY | ALSO REQUIRES 3.3V SUPPLY | ALSO REQUIRES 3.3V SUPPLY | ALSO REQUIRES 3.3V SUPPLY | ALSO REQUIRES 3.3V SUPPLY | ALSO REQUIRES 3.3V SUPPLY | ALSO REQUIRES 3.3V SUPPLY | ALSO REQUIRES 3.3V SUPPLY |
| 地址总线宽度 | 22 | 22 | 22 | 22 | 22 | 22 | 22 | 22 | 22 |
| 桶式移位器 | NO | NO | NO | NO | NO | NO | NO | NO | NO |
| 位大小 | 32 | 32 | 32 | 32 | 32 | 32 | 32 | 32 | 32 |
| 边界扫描 | YES | YES | YES | YES | YES | YES | YES | YES | YES |
| 最大时钟频率 | 300 MHz | 250 MHz | 200 MHz | 250 MHz | 250 MHz | 200 MHz | 233 MHz | 250 MHz | 250 MHz |
| 外部数据总线宽度 | 32 | 32 | 32 | 32 | 32 | 32 | 32 | 32 | 32 |
| 格式 | FIXED POINT | FIXED POINT | FIXED POINT | FIXED POINT | FIXED POINT | FIXED POINT | FIXED POINT | FIXED POINT | FIXED POINT |
| 内部总线架构 | MULTIPLE | MULTIPLE | MULTIPLE | MULTIPLE | MULTIPLE | MULTIPLE | MULTIPLE | MULTIPLE | MULTIPLE |
| JESD-30 代码 | S-PBGA-B384 | S-PBGA-B384 | S-PBGA-B352 | S-PBGA-B352 | S-PBGA-B352 | S-PBGA-B352 | S-PBGA-B352 | S-PBGA-B384 | S-PBGA-B384 |
| 长度 | 18 mm | 18 mm | 27 mm | 27 mm | 27 mm | 27 mm | 27 mm | 18 mm | 18 mm |
| 低功率模式 | YES | YES | YES | YES | YES | YES | YES | YES | YES |
| 端子数量 | 384 | 384 | 352 | 352 | 352 | 352 | 352 | 384 | 384 |
| 封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| 封装代码 | FBGA | FBGA | HBGA | HBGA | HBGA | HBGA | HBGA | HFBGA | HFBGA |
| 封装等效代码 | BGA384,22X22,32 | BGA384,22X22,32 | BGA352,26X26,40 | BGA352,26X26,40 | BGA352,26X26,40 | BGA352,26X26,40 | BGA352,26X26,40 | BGA384,22X22,32 | BGA384,22X22,32 |
| 封装形状 | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE |
| 封装形式 | GRID ARRAY, FINE PITCH | GRID ARRAY, FINE PITCH | GRID ARRAY, HEAT SINK/SLUG | GRID ARRAY, HEAT SINK/SLUG | GRID ARRAY, HEAT SINK/SLUG | GRID ARRAY, HEAT SINK/SLUG | GRID ARRAY, HEAT SINK/SLUG | GRID ARRAY, HEAT SINK/SLUG, FINE PITCH | GRID ARRAY, HEAT SINK/SLUG, FINE PITCH |
| 峰值回流温度（摄氏度） | 220 | 220 | 220 | 220 | 220 | 220 | 220 | 220 | NOT SPECIFIED |
| 电源 | 1.5,3.3 V | 1.5,3.3 V | 1.8,3.3 V | 1.8,3.3 V | 1.8,3.3 V | 1.8,3.3 V | 1.8,3.3 V | 1.8,3.3 V | 1.8,3.3 V |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| RAM（字数） | 32768 | 32768 | 32768 | 32768 | 32768 | 32768 | 32768 | 32768 | 32768 |
| 座面最大高度 | 2.35 mm | 2.35 mm | 3.8 mm | 3.8 mm | 3.8 mm | 3.8 mm | 3.8 mm | 2.8 mm | 2.8 mm |
| 最大供电电压 | 1.57 V | 1.57 V | 1.89 V | 1.89 V | 1.89 V | 1.89 V | 1.89 V | 1.89 V | 1.89 V |
| 最小供电电压 | 1.43 V | 1.43 V | 1.71 V | 1.71 V | 1.71 V | 1.71 V | 1.71 V | 1.71 V | 1.71 V |
| 标称供电电压 | 1.5 V | 1.5 V | 1.8 V | 1.8 V | 1.8 V | 1.8 V | 1.8 V | 1.8 V | 1.8 V |
| 表面贴装 | YES | YES | YES | YES | YES | YES | YES | YES | YES |
| 技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
| 端子形式 | BALL | BALL | BALL | BALL | BALL | BALL | BALL | BALL | BALL |
| 端子节距 | 0.8 mm | 0.8 mm | 1 mm | 1 mm | 1 mm | 1 mm | 1 mm | 0.8 mm | 0.8 mm |
| 端子位置 | BOTTOM | BOTTOM | BOTTOM | BOTTOM | BOTTOM | BOTTOM | BOTTOM | BOTTOM | BOTTOM |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
| 宽度 | 18 mm | 18 mm | 27 mm | 27 mm | 27 mm | 27 mm | 27 mm | 18 mm | 18 mm |
| uPs/uCs/外围集成电路类型 | DIGITAL SIGNAL PROCESSOR, OTHER | DIGITAL SIGNAL PROCESSOR, OTHER | DIGITAL SIGNAL PROCESSOR, OTHER | DIGITAL SIGNAL PROCESSOR, OTHER | DIGITAL SIGNAL PROCESSOR, OTHER | DIGITAL SIGNAL PROCESSOR, OTHER | DIGITAL SIGNAL PROCESSOR, OTHER | DIGITAL SIGNAL PROCESSOR, OTHER | DIGITAL SIGNAL PROCESSOR, OTHER |
| 是否Rohs认证 | 不符合 | 不符合 | - | 不符合 | 不符合 | - | 不符合 | 不符合 | 不符合 |
| 厂商名称 | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | - | - | Texas Instruments(德州仪器) | - | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) |
| Factory Lead Time | 12 weeks | 1 week | 1 week | - | 1 week | - | 1 week | 1 week | - |
| 集成缓存 | YES | YES | YES | - | - | YES | YES | YES | - |
| JESD-609代码 | e0 | e0 | e0 | e0 | e0 | e0 | e0 | e0 | - |
| 湿度敏感等级 | 4 | 4 | 4 | 4 | 4 | 4 | 4 | 4 | - |
| DMA 通道数量 | 4 | 4 | 4 | - | - | 4 | 4 | 4 | - |
| 外部中断装置数量 | 4 | 4 | 4 | - | - | 4 | 4 | 4 | - |
| 计时器数量 | 2 | 2 | 2 | - | - | 2 | 2 | 2 | - |
| 片上数据RAM宽度 | 8 | 8 | 8 | - | - | 8 | 8 | 8 | - |
| 片上程序ROM宽度 | 8 | 8 | 8 | - | - | 8 | 8 | 8 | - |
| 最高工作温度 | 90 °C | 90 °C | 90 °C | - | - | 105 °C | 105 °C | 90 °C | - |
| ROM可编程性 | MROM | MROM | MROM | - | - | MROM | MROM | MROM | - |
| 温度等级 | OTHER | OTHER | OTHER | - | - | INDUSTRIAL | INDUSTRIAL | OTHER | - |
| 端子面层 | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | - |
| Base Number Matches | - | - | 1 | 1 | 1 | 1 | - | - | 1 |
