TMS320C6202GLS250X,TMS320C6202GLS250X pdf中文资料,TMS320C6202GLS250X引脚图,TMS320C6202GLS250X电路-Datasheet-电子工程世界

参数对比

与TMS320C6202GLS250X相近的元器件有：TMS320C6202BGNY250、TMS320C6202BGNY300、TMS320C6202GJL200、TMS320C6202GJL250、TMS320C6202GJL250X、TMS320C6202GJLA200、TMS320C6202GJLA233、TMS320C6202GLS250。描述及对比如下：

型号	TMS320C6202GLS250X	TMS320C6202BGNY250	TMS320C6202BGNY300	TMS320C6202GJL200	TMS320C6202GJL250	TMS320C6202GJL250X	TMS320C6202GJLA200	TMS320C6202GJLA233	TMS320C6202GLS250
描述	Digital Signal Processors & Controllers - DSP, DSC Fixed-Pt Dig Signal Proc	Fixed-Point Digital Signal Processor 384-FC/CSP	Fixed-Point Digital Signal Processor 384-FC/CSP	Fixed-Point Digital Signal Processor 352-FCBGA	Fixed-Point Digital Signal Processor 352-FCBGA	Digital Signal Processors & Controllers - DSP, DSC Fixed-Pt Dig Signal Proc	Fixed-Point Digital Signal Processor 352-FCBGA 0 to 0	Fixed-Point Digital Signal Processor 352-FCBGA	Fixed-Point Digital Signal Processor
Brand Name	Texas Instruments	Texas Instruments	Texas Instruments	Texas Instruments	Texas Instruments	Texas Instruments	Texas Instruments	Texas Instruments	Texas Instruments
零件包装代码	BGA	BGA	BGA	BGA	BGA	BGA	BGA	BGA	BGA
包装说明	HFBGA, BGA384,22X22,32	FBGA, BGA384,22X22,32	FBGA, BGA384,22X22,32	HBGA, BGA352,26X26,40	HBGA, BGA352,26X26,40	HBGA, BGA352,26X26,40	HBGA, BGA352,26X26,40	HBGA, BGA352,26X26,40	HFBGA, BGA384,22X22,32
针数	384	384	384	352	352	352	352	352	384
Reach Compliance Code	not_compliant	_compli	_compli	_compli	_compli	not_compliant	_compli	_compli	_compli
ECCN代码	3A001.A.3	3A001.A.3	3A001.A.3	3A001.A.3	3A001.A.3	3A001.A.3	3A001.A.3	3A001.A.3	3A001.A.3
其他特性	ALSO REQUIRES 3.3V SUPPLY	ALSO REQUIRES 3.3V SUPPLY	ALSO REQUIRES 3.3V SUPPLY	ALSO REQUIRES 3.3V SUPPLY	ALSO REQUIRES 3.3V SUPPLY	ALSO REQUIRES 3.3V SUPPLY	ALSO REQUIRES 3.3V SUPPLY	ALSO REQUIRES 3.3V SUPPLY	ALSO REQUIRES 3.3V SUPPLY
地址总线宽度	22	22	22	22	22	22	22	22	22
桶式移位器	NO	NO	NO	NO	NO	NO	NO	NO	NO
位大小	32	32	32	32	32	32	32	32	32
边界扫描	YES	YES	YES	YES	YES	YES	YES	YES	YES
最大时钟频率	250 MHz	250 MHz	300 MHz	200 MHz	250 MHz	250 MHz	200 MHz	233 MHz	250 MHz
外部数据总线宽度	32	32	32	32	32	32	32	32	32
格式	FIXED POINT	FIXED POINT	FIXED POINT	FIXED POINT	FIXED POINT	FIXED POINT	FIXED POINT	FIXED POINT	FIXED POINT
内部总线架构	MULTIPLE	MULTIPLE	MULTIPLE	MULTIPLE	MULTIPLE	MULTIPLE	MULTIPLE	MULTIPLE	MULTIPLE
JESD-30 代码	S-PBGA-B384	S-PBGA-B384	S-PBGA-B384	S-PBGA-B352	S-PBGA-B352	S-PBGA-B352	S-PBGA-B352	S-PBGA-B352	S-PBGA-B384
长度	18 mm	18 mm	18 mm	27 mm	27 mm	27 mm	27 mm	27 mm	18 mm
低功率模式	YES	YES	YES	YES	YES	YES	YES	YES	YES
端子数量	384	384	384	352	352	352	352	352	384
封装主体材料	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY
封装代码	HFBGA	FBGA	FBGA	HBGA	HBGA	HBGA	HBGA	HBGA	HFBGA
封装等效代码	BGA384,22X22,32	BGA384,22X22,32	BGA384,22X22,32	BGA352,26X26,40	BGA352,26X26,40	BGA352,26X26,40	BGA352,26X26,40	BGA352,26X26,40	BGA384,22X22,32
封装形状	SQUARE	SQUARE	SQUARE	SQUARE	SQUARE	SQUARE	SQUARE	SQUARE	SQUARE
封装形式	GRID ARRAY, HEAT SINK/SLUG, FINE PITCH	GRID ARRAY, FINE PITCH	GRID ARRAY, FINE PITCH	GRID ARRAY, HEAT SINK/SLUG	GRID ARRAY, HEAT SINK/SLUG	GRID ARRAY, HEAT SINK/SLUG	GRID ARRAY, HEAT SINK/SLUG	GRID ARRAY, HEAT SINK/SLUG	GRID ARRAY, HEAT SINK/SLUG, FINE PITCH
峰值回流温度（摄氏度）	NOT SPECIFIED	220	220	220	220	220	220	220	220
电源	1.8,3.3 V	1.5,3.3 V	1.5,3.3 V	1.8,3.3 V	1.8,3.3 V	1.8,3.3 V	1.8,3.3 V	1.8,3.3 V	1.8,3.3 V
认证状态	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified
RAM（字数）	32768	32768	32768	32768	32768	32768	32768	32768	32768
座面最大高度	2.8 mm	2.35 mm	2.35 mm	3.8 mm	3.8 mm	3.8 mm	3.8 mm	3.8 mm	2.8 mm
最大供电电压	1.89 V	1.57 V	1.57 V	1.89 V	1.89 V	1.89 V	1.89 V	1.89 V	1.89 V
最小供电电压	1.71 V	1.43 V	1.43 V	1.71 V	1.71 V	1.71 V	1.71 V	1.71 V	1.71 V
标称供电电压	1.8 V	1.5 V	1.5 V	1.8 V	1.8 V	1.8 V	1.8 V	1.8 V	1.8 V
表面贴装	YES	YES	YES	YES	YES	YES	YES	YES	YES
技术	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS
端子形式	BALL	BALL	BALL	BALL	BALL	BALL	BALL	BALL	BALL
端子节距	0.8 mm	0.8 mm	0.8 mm	1 mm	1 mm	1 mm	1 mm	1 mm	0.8 mm
端子位置	BOTTOM	BOTTOM	BOTTOM	BOTTOM	BOTTOM	BOTTOM	BOTTOM	BOTTOM	BOTTOM
处于峰值回流温度下的最长时间	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED
宽度	18 mm	18 mm	18 mm	27 mm	27 mm	27 mm	27 mm	27 mm	18 mm
uPs/uCs/外围集成电路类型	DIGITAL SIGNAL PROCESSOR, OTHER	DIGITAL SIGNAL PROCESSOR, OTHER	DIGITAL SIGNAL PROCESSOR, OTHER	DIGITAL SIGNAL PROCESSOR, OTHER	DIGITAL SIGNAL PROCESSOR, OTHER	DIGITAL SIGNAL PROCESSOR, OTHER	DIGITAL SIGNAL PROCESSOR, OTHER	DIGITAL SIGNAL PROCESSOR, OTHER	DIGITAL SIGNAL PROCESSOR, OTHER
是否Rohs认证	不符合	不符合	不符合	-	不符合	不符合	-	不符合	不符合
厂商名称	Texas Instruments(德州仪器)	Texas Instruments(德州仪器)	Texas Instruments(德州仪器)	-	-	Texas Instruments(德州仪器)	-	Texas Instruments(德州仪器)	Texas Instruments(德州仪器)
Base Number Matches	1	-	-	1	1	1	1	-	-
Factory Lead Time	-	1 week	12 weeks	1 week	-	1 week	-	1 week	1 week
集成缓存	-	YES	YES	YES	-	-	YES	YES	YES
JESD-609代码	-	e0	e0	e0	e0	e0	e0	e0	e0
湿度敏感等级	-	4	4	4	4	4	4	4	4
DMA 通道数量	-	4	4	4	-	-	4	4	4
外部中断装置数量	-	4	4	4	-	-	4	4	4
计时器数量	-	2	2	2	-	-	2	2	2
片上数据RAM宽度	-	8	8	8	-	-	8	8	8
片上程序ROM宽度	-	8	8	8	-	-	8	8	8
最高工作温度	-	90 °C	90 °C	90 °C	-	-	105 °C	105 °C	90 °C
ROM可编程性	-	MROM	MROM	MROM	-	-	MROM	MROM	MROM
温度等级	-	OTHER	OTHER	OTHER	-	-	INDUSTRIAL	INDUSTRIAL	OTHER
端子面层	-	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)