DUAL OP-AMP, 6500uV OFFSET-MAX, 3.5MHz BAND WIDTH, PDSO8, MICRO, PLASTIC, SO-8
厂商名称:ST(意法半导体)
厂商官网:http://www.st.com/
器件标准:
下载文档型号 | TS272AMD | TS272AIP | TS272AMP | TS272BCP | TS272BMP | TS272ACP | TS272BIP |
---|---|---|---|---|---|---|---|
描述 | DUAL OP-AMP, 6500uV OFFSET-MAX, 3.5MHz BAND WIDTH, PDSO8, MICRO, PLASTIC, SO-8 | DUAL OP-AMP, 6500uV OFFSET-MAX, 3.5MHz BAND WIDTH, PDSO8, TSSOP-8 | DUAL OP-AMP, 6500uV OFFSET-MAX, 3.5MHz BAND WIDTH, PDSO8, TSSOP-8 | DUAL OP-AMP, 3000uV OFFSET-MAX, 3.5MHz BAND WIDTH, PDSO8, TSSOP-8 | DUAL OP-AMP, 3000uV OFFSET-MAX, 3.5MHz BAND WIDTH, PDSO8, TSSOP-8 | DUAL OP-AMP, 6500uV OFFSET-MAX, 3.5MHz BAND WIDTH, PDSO8, TSSOP-8 | DUAL OP-AMP, 3000uV OFFSET-MAX, 3.5MHz BAND WIDTH, PDSO8, TSSOP-8 |
是否无铅 | 不含铅 | 含铅 | 含铅 | 含铅 | 含铅 | 含铅 | 含铅 |
是否Rohs认证 | 符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 |
厂商名称 | ST(意法半导体) | ST(意法半导体) | ST(意法半导体) | ST(意法半导体) | ST(意法半导体) | ST(意法半导体) | ST(意法半导体) |
零件包装代码 | SOIC | SOIC | SOIC | SOIC | SOIC | SOIC | SOIC |
包装说明 | SOP, SOP8,.25 | TSSOP, TSSOP8,.25 | TSSOP, TSSOP8,.25 | TSSOP, TSSOP8,.25 | TSSOP, TSSOP8,.25 | TSSOP, TSSOP8,.25 | TSSOP, TSSOP8,.25 |
针数 | 8 | 8 | 8 | 8 | 8 | 8 | 8 |
Reach Compliance Code | compliant | not_compliant | not_compliant | not_compliant | not_compliant | _compli | _compli |
ECCN代码 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 |
放大器类型 | OPERATIONAL AMPLIFIER | OPERATIONAL AMPLIFIER | OPERATIONAL AMPLIFIER | OPERATIONAL AMPLIFIER | OPERATIONAL AMPLIFIER | OPERATIONAL AMPLIFIER | OPERATIONAL AMPLIFIER |
架构 | VOLTAGE-FEEDBACK | VOLTAGE-FEEDBACK | VOLTAGE-FEEDBACK | VOLTAGE-FEEDBACK | VOLTAGE-FEEDBACK | VOLTAGE-FEEDBACK | VOLTAGE-FEEDBACK |
最大平均偏置电流 (IIB) | 0.0003 µA | 0.0003 µA | 0.0003 µA | 0.00015 µA | 0.0003 µA | 0.00015 µA | 0.0003 µA |
标称共模抑制比 | 80 dB | 80 dB | 80 dB | 80 dB | 80 dB | 80 dB | 80 dB |
频率补偿 | YES | YES | YES | YES | YES | YES | YES |
最大输入失调电压 | 6500 µV | 6500 µV | 6500 µV | 3000 µV | 3000 µV | 6500 µV | 3000 µV |
JESD-30 代码 | R-PDSO-G8 | R-PDSO-G8 | R-PDSO-G8 | R-PDSO-G8 | R-PDSO-G8 | R-PDSO-G8 | R-PDSO-G8 |
JESD-609代码 | e4 | e0 | e0 | e0 | e0 | e0 | e0 |
长度 | 4.9 mm | 4.4 mm | 4.4 mm | 4.4 mm | 4.4 mm | 4.4 mm | 4.4 mm |
低-偏置 | YES | YES | YES | YES | YES | YES | YES |
低-失调 | NO | NO | NO | NO | NO | NO | NO |
微功率 | NO | NO | NO | NO | NO | NO | NO |
功能数量 | 2 | 2 | 2 | 2 | 2 | 2 | 2 |
端子数量 | 8 | 8 | 8 | 8 | 8 | 8 | 8 |
最高工作温度 | 125 °C | 125 °C | 125 °C | 70 °C | 125 °C | 70 °C | 125 °C |
最低工作温度 | -55 °C | -40 °C | -55 °C | - | -55 °C | - | -40 °C |
封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
封装代码 | SOP | TSSOP | TSSOP | TSSOP | TSSOP | TSSOP | TSSOP |
封装等效代码 | SOP8,.25 | TSSOP8,.25 | TSSOP8,.25 | TSSOP8,.25 | TSSOP8,.25 | TSSOP8,.25 | TSSOP8,.25 |
封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
封装形式 | SMALL OUTLINE | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
峰值回流温度(摄氏度) | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
功率 | NO | NO | NO | NO | NO | NO | NO |
电源 | 10 V | 10 V | 10 V | 10 V | 10 V | 10 V | 10 V |
可编程功率 | NO | NO | NO | NO | NO | NO | NO |
认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
座面最大高度 | 1.75 mm | 1.2 mm | 1.2 mm | 1.2 mm | 1.2 mm | 1.2 mm | 1.2 mm |
标称压摆率 | 5.5 V/us | 5.5 V/us | 5.5 V/us | 5.5 V/us | 5.5 V/us | 5.5 V/us | 5.5 V/us |
最大压摆率 | 3.4 mA | 3.4 mA | 3.4 mA | 3.2 mA | 3.4 mA | 3.2 mA | 3.4 mA |
供电电压上限 | 18 V | 18 V | 18 V | 18 V | 18 V | 18 V | 18 V |
标称供电电压 (Vsup) | 10 V | 10 V | 10 V | 10 V | 10 V | 10 V | 10 V |
表面贴装 | YES | YES | YES | YES | YES | YES | YES |
技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
温度等级 | MILITARY | AUTOMOTIVE | MILITARY | COMMERCIAL | MILITARY | COMMERCIAL | AUTOMOTIVE |
端子面层 | Nickel/Palladium/Gold (Ni/Pd/Au) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
端子形式 | GULL WING | GULL WING | GULL WING | GULL WING | GULL WING | GULL WING | GULL WING |
端子节距 | 1.27 mm | 0.65 mm | 0.65 mm | 0.65 mm | 0.65 mm | 0.65 mm | 0.65 mm |
端子位置 | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL |
处于峰值回流温度下的最长时间 | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
标称均一增益带宽 | 3500 kHz | 3500 kHz | 3500 kHz | 3500 kHz | 3500 kHz | 3500 kHz | 3500 kHz |
最小电压增益 | 6000 | 6000 | 6000 | 7000 | 6000 | 7000 | 6000 |
宽带 | NO | NO | NO | NO | NO | NO | NO |
宽度 | 3.9 mm | 3 mm | 3 mm | 3 mm | 3 mm | 3 mm | 3 mm |