V53C832HQ30,V53C832HQ30 pdf中文资料,V53C832HQ30引脚图,V53C832HQ30电路-Datasheet-电子工程世界

参数对比

与V53C832HQ30相近的元器件有：V53C832HU50、V53C832HU45、V53C832HU35、V53C832HQ45、V53C832HQ35、V53C832HQ40、V53C832HU30、V53C832HQ50、V53C832HU40。描述及对比如下：

型号	V53C832HQ30	V53C832HU50	V53C832HU45	V53C832HU35	V53C832HQ45	V53C832HQ35	V53C832HQ40	V53C832HU30	V53C832HQ50	V53C832HU40
描述	EDO DRAM, 256KX32, 30ns, CMOS, PQFP100, PLASTIC, QFP-100	EDO DRAM, 256KX32, 50ns, CMOS, PQFP100, TQFP-100	EDO DRAM, 256KX32, 45ns, CMOS, PQFP100, TQFP-100	EDO DRAM, 256KX32, 35ns, CMOS, PQFP100, TQFP-100	EDO DRAM, 256KX32, 45ns, CMOS, PQFP100, PLASTIC, QFP-100	EDO DRAM, 256KX32, 35ns, CMOS, PQFP100, PLASTIC, QFP-100	EDO DRAM, 256KX32, 40ns, CMOS, PQFP100, PLASTIC, QFP-100	EDO DRAM, 256KX32, 30ns, CMOS, PQFP100, TQFP-100	EDO DRAM, 256KX32, 50ns, CMOS, PQFP100, PLASTIC, QFP-100	EDO DRAM, 256KX32, 40ns, CMOS, PQFP100, TQFP-100
是否Rohs认证	不符合	不符合	不符合	不符合	不符合	不符合	不符合	不符合	不符合	不符合
厂商名称	Mosel Vitelic Corporation ( MVC )	Mosel Vitelic Corporation ( MVC )	Mosel Vitelic Corporation ( MVC )	Mosel Vitelic Corporation ( MVC )	Mosel Vitelic Corporation ( MVC )	Mosel Vitelic Corporation ( MVC )	Mosel Vitelic Corporation ( MVC )	Mosel Vitelic Corporation ( MVC )	Mosel Vitelic Corporation ( MVC )	Mosel Vitelic Corporation ( MVC )
零件包装代码	QFP	QFP	QFP	QFP	QFP	QFP	QFP	QFP	QFP	QFP
包装说明	QFP, QFP100,.7X.9	LQFP, QFP100,.63X.87	LQFP, QFP100,.63X.87	LQFP, QFP100,.63X.87	QFP, QFP100,.7X.9	QFP, QFP100,.7X.9	QFP, QFP100,.7X.9	LQFP, QFP100,.63X.87	QFP, QFP100,.7X.9	LQFP, QFP100,.63X.87
针数	100	100	100	100	100	100	100	100	100	100
Reach Compliance Code	unknown	unknown	unknown	unknown	unknown	unknown	unknown	unknown	unknown	unknown
ECCN代码	EAR99	EAR99	EAR99	EAR99	EAR99	EAR99	EAR99	EAR99	EAR99	EAR99
访问模式	FAST PAGE WITH EDO	FAST PAGE WITH EDO	FAST PAGE WITH EDO	FAST PAGE WITH EDO	FAST PAGE WITH EDO	FAST PAGE WITH EDO	FAST PAGE WITH EDO	FAST PAGE WITH EDO	FAST PAGE WITH EDO	FAST PAGE WITH EDO
最长访问时间	30 ns	50 ns	45 ns	35 ns	45 ns	35 ns	40 ns	30 ns	50 ns	40 ns
其他特性	RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH	RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH	RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH	RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH	RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH	RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH	RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH	RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH	RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH	RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH
I/O 类型	COMMON	COMMON	COMMON	COMMON	COMMON	COMMON	COMMON	COMMON	COMMON	COMMON
JESD-30 代码	R-PQFP-G100	R-PQFP-G100	R-PQFP-G100	R-PQFP-G100	R-PQFP-G100	R-PQFP-G100	R-PQFP-G100	R-PQFP-G100	R-PQFP-G100	R-PQFP-G100
JESD-609代码	e0	e0	e0	e0	e0	e0	e0	e0	e0	e0
长度	20 mm	20 mm	20 mm	20 mm	20 mm	20 mm	20 mm	20 mm	20 mm	20 mm
内存密度	8388608 bit	8388608 bit	8388608 bit	8388608 bit	8388608 bit	8388608 bit	8388608 bit	8388608 bit	8388608 bit	8388608 bit
内存集成电路类型	EDO DRAM	EDO DRAM	EDO DRAM	EDO DRAM	EDO DRAM	EDO DRAM	EDO DRAM	EDO DRAM	EDO DRAM	EDO DRAM
内存宽度	32	32	32	32	32	32	32	32	32	32
功能数量	1	1	1	1	1	1	1	1	1	1
端口数量	1	1	1	1	1	1	1	1	1	1
端子数量	100	100	100	100	100	100	100	100	100	100
字数	262144 words	262144 words	262144 words	262144 words	262144 words	262144 words	262144 words	262144 words	262144 words	262144 words
字数代码	256000	256000	256000	256000	256000	256000	256000	256000	256000	256000
工作模式	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS
最高工作温度	70 °C	70 °C	70 °C	70 °C	70 °C	70 °C	70 °C	70 °C	70 °C	70 °C
组织	256KX32	256KX32	256KX32	256KX32	256KX32	256KX32	256KX32	256KX32	256KX32	256KX32
输出特性	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE
封装主体材料	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY
封装代码	QFP	LQFP	LQFP	LQFP	QFP	QFP	QFP	LQFP	QFP	LQFP
封装等效代码	QFP100,.7X.9	QFP100,.63X.87	QFP100,.63X.87	QFP100,.63X.87	QFP100,.7X.9	QFP100,.7X.9	QFP100,.7X.9	QFP100,.63X.87	QFP100,.7X.9	QFP100,.63X.87
封装形状	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR
封装形式	FLATPACK	FLATPACK, LOW PROFILE	FLATPACK, LOW PROFILE	FLATPACK, LOW PROFILE	FLATPACK	FLATPACK	FLATPACK	FLATPACK, LOW PROFILE	FLATPACK	FLATPACK, LOW PROFILE
电源	5 V	5 V	5 V	5 V	5 V	5 V	5 V	5 V	5 V	5 V
认证状态	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified
刷新周期	512	512	512	512	512	512	512	512	512	512
座面最大高度	3.404 mm	1.6 mm	1.6 mm	1.6 mm	3.404 mm	3.404 mm	3.404 mm	1.6 mm	3.404 mm	1.6 mm
最大待机电流	0.002 A	0.002 A	0.002 A	0.002 A	0.002 A	0.002 A	0.002 A	0.002 A	0.002 A	0.002 A
最大压摆率	0.31 mA	0.24 mA	0.26 mA	0.295 mA	0.26 mA	0.295 mA	0.27 mA	0.31 mA	0.24 mA	0.27 mA
最大供电电压 (Vsup)	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V
最小供电电压 (Vsup)	4.5 V	4.5 V	4.5 V	4.5 V	4.5 V	4.5 V	4.5 V	4.5 V	4.5 V	4.5 V
标称供电电压 (Vsup)	5 V	5 V	5 V	5 V	5 V	5 V	5 V	5 V	5 V	5 V
表面贴装	YES	YES	YES	YES	YES	YES	YES	YES	YES	YES
技术	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS
温度等级	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL
端子面层	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)
端子形式	GULL WING	GULL WING	GULL WING	GULL WING	GULL WING	GULL WING	GULL WING	GULL WING	GULL WING	GULL WING
端子节距	0.65 mm	0.65 mm	0.65 mm	0.65 mm	0.65 mm	0.65 mm	0.65 mm	0.65 mm	0.65 mm	0.65 mm
端子位置	QUAD	QUAD	QUAD	QUAD	QUAD	QUAD	QUAD	QUAD	QUAD	QUAD
宽度	14 mm	14 mm	14 mm	14 mm	14 mm	14 mm	14 mm	14 mm	14 mm	14 mm