V73CAG01808RALJI9,V73CAG01808RALJI9 pdf中文资料,V73CAG01808RALJI9引脚图,V73CAG01808RALJI9电路-Datasheet-电子工程世界

器件参数

参数名称

属性值

厂商名称

ProMOS Technologies Inc

零件包装代码

BGA

包装说明

TFBGA,

针数

Reach Compliance Code

compliant

ECCN代码

EAR99

访问模式

MULTI BANK PAGE BURST

最长访问时间

255 ns

其他特性

AUTO/SELF REFRESH

JESD-30 代码

R-PBGA-B78

长度

10.6 mm

内存密度

1073741824 bit

内存集成电路类型

DDR DRAM

内存宽度

功能数量

端口数量

端子数量

字数

134217728 words

字数代码

128000000

工作模式

SYNCHRONOUS

组织

128MX8

封装主体材料

PLASTIC/EPOXY

封装代码

TFBGA

封装形状

RECTANGULAR

封装形式

GRID ARRAY, THIN PROFILE, FINE PITCH

认证状态

Not Qualified

座面最大高度

1.2 mm

自我刷新

YES

最大供电电压 (Vsup)

1.575 V

最小供电电压 (Vsup)

1.425 V

标称供电电压 (Vsup)

1.5 V

表面贴装

YES

技术

CMOS

端子形式

BALL

端子节距

0.8 mm

端子位置

BOTTOM

宽度

7.5 mm

参数对比

与V73CAG01808RALJI9相近的元器件有：V73CAG01808RALJI9I、V73CAG01808RAUJI9、V73CAG01808RALJH7、V73CAG01808RALJH7I、V73CAG01808RAUJH7I、V73CAG01808RAUJH7、V73CAG01808RAUJI9I。描述及对比如下：

型号	V73CAG01808RALJI9	V73CAG01808RALJI9I	V73CAG01808RAUJI9	V73CAG01808RALJH7	V73CAG01808RALJH7I	V73CAG01808RAUJH7I	V73CAG01808RAUJH7	V73CAG01808RAUJI9I
描述	DDR DRAM, 128MX8, 255ns, CMOS, PBGA78, GREEN, FBGA-78	DDR DRAM, 128MX8, 255ns, CMOS, PBGA78, GREEN, FBGA-78	DDR DRAM, 128MX8, 255ns, CMOS, PBGA78, GREEN, FBGA-78	DDR DRAM, 128MX8, 300ns, CMOS, PBGA78, GREEN, FBGA-78	DDR DRAM, 128MX8, 300ns, CMOS, PBGA78, GREEN, FBGA-78	DDR DRAM, 128MX8, 300ns, CMOS, PBGA78, GREEN, FBGA-78	DDR DRAM, 128MX8, 300ns, CMOS, PBGA78, GREEN, FBGA-78	DDR DRAM, 128MX8, 255ns, CMOS, PBGA78, GREEN, FBGA-78
零件包装代码	BGA	BGA	BGA	BGA	BGA	BGA	BGA	BGA
包装说明	TFBGA,	TFBGA,	TFBGA,	TFBGA,	TFBGA,	TFBGA,	TFBGA,	TFBGA,
针数	78	78	78	78	78	78	78	78
Reach Compliance Code	compliant	compliant	unknown	compliant	compliant	unknown	unknown	unknown
ECCN代码	EAR99	EAR99	EAR99	EAR99	EAR99	EAR99	EAR99	EAR99
访问模式	MULTI BANK PAGE BURST	MULTI BANK PAGE BURST	MULTI BANK PAGE BURST	MULTI BANK PAGE BURST	MULTI BANK PAGE BURST	MULTI BANK PAGE BURST	MULTI BANK PAGE BURST	MULTI BANK PAGE BURST
最长访问时间	255 ns	255 ns	255 ns	300 ns	300 ns	300 ns	300 ns	255 ns
其他特性	AUTO/SELF REFRESH	AUTO/SELF REFRESH	AUTO/SELF REFRESH	AUTO/SELF REFRESH	AUTO/SELF REFRESH	AUTO/SELF REFRESH	AUTO/SELF REFRESH	AUTO/SELF REFRESH
JESD-30 代码	R-PBGA-B78	R-PBGA-B78	R-PBGA-B78	R-PBGA-B78	R-PBGA-B78	R-PBGA-B78	R-PBGA-B78	R-PBGA-B78
长度	10.6 mm	10.6 mm	10.6 mm	10.6 mm	10.6 mm	10.6 mm	10.6 mm	10.6 mm
内存密度	1073741824 bit	1073741824 bit	1073741824 bit	1073741824 bit	1073741824 bit	1073741824 bit	1073741824 bit	1073741824 bit
内存集成电路类型	DDR DRAM	DDR DRAM	DDR DRAM	DDR DRAM	DDR DRAM	DDR DRAM	DDR DRAM	DDR DRAM
内存宽度	8	8	8	8	8	8	8	8
功能数量	1	1	1	1	1	1	1	1
端口数量	1	1	1	1	1	1	1	1
端子数量	78	78	78	78	78	78	78	78
字数	134217728 words	134217728 words	134217728 words	134217728 words	134217728 words	134217728 words	134217728 words	134217728 words
字数代码	128000000	128000000	128000000	128000000	128000000	128000000	128000000	128000000
工作模式	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS
组织	128MX8	128MX8	128MX8	128MX8	128MX8	128MX8	128MX8	128MX8
封装主体材料	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY
封装代码	TFBGA	TFBGA	TFBGA	TFBGA	TFBGA	TFBGA	TFBGA	TFBGA
封装形状	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR
封装形式	GRID ARRAY, THIN PROFILE, FINE PITCH	GRID ARRAY, THIN PROFILE, FINE PITCH	GRID ARRAY, THIN PROFILE, FINE PITCH	GRID ARRAY, THIN PROFILE, FINE PITCH	GRID ARRAY, THIN PROFILE, FINE PITCH	GRID ARRAY, THIN PROFILE, FINE PITCH	GRID ARRAY, THIN PROFILE, FINE PITCH	GRID ARRAY, THIN PROFILE, FINE PITCH
认证状态	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified
座面最大高度	1.2 mm	1.2 mm	1.2 mm	1.2 mm	1.2 mm	1.2 mm	1.2 mm	1.2 mm
自我刷新	YES	YES	YES	YES	YES	YES	YES	YES
最大供电电压 (Vsup)	1.575 V	1.575 V	1.575 V	1.575 V	1.575 V	1.575 V	1.575 V	1.575 V
最小供电电压 (Vsup)	1.425 V	1.425 V	1.425 V	1.425 V	1.425 V	1.425 V	1.425 V	1.425 V
标称供电电压 (Vsup)	1.5 V	1.5 V	1.5 V	1.5 V	1.5 V	1.5 V	1.5 V	1.5 V
表面贴装	YES	YES	YES	YES	YES	YES	YES	YES
技术	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS
端子形式	BALL	BALL	BALL	BALL	BALL	BALL	BALL	BALL
端子节距	0.8 mm	0.8 mm	0.8 mm	0.8 mm	0.8 mm	0.8 mm	0.8 mm	0.8 mm
端子位置	BOTTOM	BOTTOM	BOTTOM	BOTTOM	BOTTOM	BOTTOM	BOTTOM	BOTTOM
宽度	7.5 mm	7.5 mm	7.5 mm	7.5 mm	7.5 mm	7.5 mm	7.5 mm	7.5 mm
厂商名称	ProMOS Technologies Inc	-	-	ProMOS Technologies Inc	ProMOS Technologies Inc	ProMOS Technologies Inc	-	ProMOS Technologies Inc
Base Number Matches	-	1	1	1	1	1	1	-