Standard SRAM, 64KX8, 70ns, CMOS, PDIP32, 0.600 INCH, PLASTIC, DIP-32
厂商名称:Winbond(华邦电子)
厂商官网:http://www.winbond.com.tw
下载文档型号 | W24512-70L | W24512-55LL | W24512S-55LL | W24512S-70L | W24512-70LL | W24512S-70LL |
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描述 | Standard SRAM, 64KX8, 70ns, CMOS, PDIP32, 0.600 INCH, PLASTIC, DIP-32 | Standard SRAM, 64KX8, 55ns, CMOS, PDIP32, 0.600 INCH, PLASTIC, DIP-32 | Standard SRAM, 64KX8, 55ns, CMOS, PDSO32, 0.450 INCH, SOP-32 | Standard SRAM, 64KX8, 70ns, CMOS, PDSO32, 0.450 INCH, SOP-32 | Standard SRAM, 64KX8, 70ns, CMOS, PDIP32, 0.600 INCH, PLASTIC, DIP-32 | Standard SRAM, 64KX8, 70ns, CMOS, PDSO32, 0.450 INCH, SOP-32 |
零件包装代码 | DIP | DIP | SOIC | SOIC | DIP | SOIC |
包装说明 | DIP, | DIP, | SOP, | SOP, | DIP, | SOP, |
针数 | 32 | 32 | 32 | 32 | 32 | 32 |
Reach Compliance Code | unknown | unknown | unknown | unknown | unknown | unknown |
ECCN代码 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 |
最长访问时间 | 70 ns | 55 ns | 55 ns | 70 ns | 70 ns | 70 ns |
JESD-30 代码 | R-PDIP-T32 | R-PDIP-T32 | R-PDSO-G32 | R-PDSO-G32 | R-PDIP-T32 | R-PDSO-G32 |
长度 | 41.91 mm | 41.91 mm | 20.45 mm | 20.45 mm | 41.91 mm | 20.45 mm |
内存密度 | 524288 bit | 524288 bit | 524288 bit | 524288 bit | 524288 bit | 524288 bit |
内存集成电路类型 | STANDARD SRAM | STANDARD SRAM | STANDARD SRAM | STANDARD SRAM | STANDARD SRAM | STANDARD SRAM |
内存宽度 | 8 | 8 | 8 | 8 | 8 | 8 |
功能数量 | 1 | 1 | 1 | 1 | 1 | 1 |
端口数量 | 1 | 1 | 1 | 1 | 1 | 1 |
端子数量 | 32 | 32 | 32 | 32 | 32 | 32 |
字数 | 65536 words | 65536 words | 65536 words | 65536 words | 65536 words | 65536 words |
字数代码 | 64000 | 64000 | 64000 | 64000 | 64000 | 64000 |
工作模式 | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS |
最高工作温度 | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C |
组织 | 64KX8 | 64KX8 | 64KX8 | 64KX8 | 64KX8 | 64KX8 |
输出特性 | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE |
可输出 | YES | YES | YES | YES | YES | YES |
封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
封装代码 | DIP | DIP | SOP | SOP | DIP | SOP |
封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
封装形式 | IN-LINE | IN-LINE | SMALL OUTLINE | SMALL OUTLINE | IN-LINE | SMALL OUTLINE |
并行/串行 | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL |
认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
座面最大高度 | 5.33 mm | 5.33 mm | 3 mm | 3 mm | 5.33 mm | 3 mm |
最小待机电流 | 2 V | 2 V | 2 V | 2 V | 2 V | 2 V |
最大供电电压 (Vsup) | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V |
最小供电电压 (Vsup) | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V |
标称供电电压 (Vsup) | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
表面贴装 | NO | NO | YES | YES | NO | YES |
技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
温度等级 | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL |
端子形式 | THROUGH-HOLE | THROUGH-HOLE | GULL WING | GULL WING | THROUGH-HOLE | GULL WING |
端子节距 | 2.54 mm | 2.54 mm | 1.27 mm | 1.27 mm | 2.54 mm | 1.27 mm |
端子位置 | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL |
宽度 | 15.24 mm | 15.24 mm | 11.3 mm | 11.3 mm | 15.24 mm | 11.3 mm |
Base Number Matches | 1 | 1 | 1 | 1 | - | - |