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W29GL032C

32M-BIT

3.0-VOLT PARALLEL FLASH MEMORY WITH

PAGE MODE

Publication Release Date: August 2, 2013

Revision H

BLANK

W29GL032C

Table of Contents

GENERAL DESCRIPTION ......................................................................................................... 1

FEATURES ................................................................................................................................. 1

PIN CONFIGURATIONS ............................................................................................................. 2

BLOCK DIAGRAM ...................................................................................................................... 3

PIN DESCRIPTION ..................................................................................................................... 3

ARRAY ARCHITECTURE ........................................................................................................... 4

6.1

H/L Sector Address Table ............................................................................................... 4

6.2

Top Sector Address Table .............................................................................................. 4

6.3

Bottom Sector Address Table ......................................................................................... 4

FUNCTIONAL DESCRIPTION.................................................................................................... 5

7.1

Device Bus Operation ..................................................................................................... 5

7.2

Instruction Definitions...................................................................................................... 6

7.2.1

7.2.2

7.2.3

7.2.4

7.2.5

7.2.6

7.2.7

7.2.8

7.2.9

7.2.10

7.2.11

7.2.12

7.2.13

7.2.14

7.2.15

7.2.16

7.2.17

7.2.18

7.2.19

7.2.20

7.2.21

7.2.22

7.2.23

Reading Array Data .......................................................................................................... 6

Page Mode Read .............................................................................................................. 6

Device Reset Operation .................................................................................................... 7

Standby Mode ................................................................................................................... 7

Output Disable Mode ........................................................................................................ 7

Write Operation ................................................................................................................. 7

Byte/Word Selection ......................................................................................................... 8

Automatic Programming of the Memory Array .................................................................. 8

Erasing the Memory Array ................................................................................................ 9

Erase Suspend/Resume ............................................................................................... 10

Sector Erase Resume ................................................................................................... 10

Program Suspend/Resume ........................................................................................... 11

Program Resume .......................................................................................................... 11

Programming Operation ................................................................................................ 11

Buffer Write Abort ......................................................................................................... 12

Accelerated Programming Operation ............................................................................ 12

Automatic Select Bus Operation ................................................................................... 12

Automatic Select Operations......................................................................................... 13

Automatic Select Instruction Sequence ........................................................................ 13

Enhanced Variable IO (EVIO) Control .......................................................................... 14

Hardware Data Protection Options ............................................................................... 14

Inherent Data Protection ............................................................................................... 14

Power Supply Decoupling ............................................................................................. 14

Lock Register .................................................................................................................. 16

Individual (Non-Volatile) Protection Mode ....................................................................... 17

Factory Locked: Security Sector Programmed and Protected at factory ......................... 20

Customer Lockable: Security Sector Not Programmed or Protected .............................. 20

7.3

Enhanced Sector Protect/Un-protect ............................................................................ 15

7.3.1

7.3.2

7.4

Security Sector Flash Memory Region ......................................................................... 20

7.4.1

7.4.2

7.5

Instruction Definition Tables ......................................................................................... 21

Publication Release Date: August 2, 2013

Revision H

W29GL032C

7.6

Common Flash Memory Interface (CFI) Mode ............................................................. 25

7.6.1

Query Instruction and Common Flash memory Interface (CFI) Mode ............................. 25

ELECTRICAL CHARACTERISTICS ......................................................................................... 29

8.1

Absolute Maximum Stress Ratings ............................................................................... 29

8.2

Operating Temperature and Voltage ............................................................................ 29

8.3

DC Characteristics ........................................................................................................ 30

8.4

Switching Test Circuits.................................................................................................. 31

8.4.1

Switching Test Waveform ............................................................................................... 31

Instruction Write Operation ............................................................................................. 33

Read / Reset Operation .................................................................................................. 34

Erase/Program Operation ............................................................................................... 36

Write Operation Status .................................................................................................... 46

WORD/BYTE CONFIGURATION (#BYTE)..................................................................... 50

DEEP POWER DOWN MODE ........................................................................................ 52

WRITE BUFFER PROGRAM.......................................................................................... 52

At Device Power-up ........................................................................................................ 53

8.5

AC Characteristics ........................................................................................................ 32

8.5.1

8.5.2

8.5.3

8.5.4

8.5.5

8.5.6

8.5.7

8.6

Recommended Operating Conditions ........................................................................... 53

8.6.1

8.7

Erase and Programming Performance ......................................................................... 54

8.8

Data Retention .............................................................................................................. 54

8.9

Latch-up Characteristics ............................................................................................... 54

8.10 Pin Capacitance ............................................................................................................ 54

PACKAGE DIMENSIONS ......................................................................................................... 55

9.1

TSOP 48-pin 12x20mm ................................................................................................ 55

9.2

TSOP 56-pin 14x20mm ................................................................................................ 56

9.3

Low-Profile Fine-Pitch Ball Grid Array, 64-ball 11x13mm (LFBGA64) ......................... 57

9.4

Thin & Fine-Pitch Ball Grid Array, 6x8 mm

, pitch: 0.8 mm,

=0.4mm

(TFBGA48) .... 58

ORDERING INFORMATION ..................................................................................................... 59

10.1 Ordering Part Number Definitions ................................................................................. 59

10.2 Valid Part Numbers and Top Side Marking .................................................................. 60

HISTORY .................................................................................................................................. 61

W29GL032C

List of Figures

Figure 3-1

Figure 3-2

Figure 3-3

Figure 3-4

Figure 4-1

Figure 7-1

Figure 7-2

Figure 7-3

Figure 8-1

Figure 8-2

Figure 8-3

Figure 8-4

Figure 8-5

Figure 8-6

Figure 8-7

Figure 8-8

Figure 8-9

Figure 8-10

Figure 8-11

Figure 8-12

Figure 8-13

Figure 8-14

Figure 8-15

Figure 8-16

Figure 8-17

Figure 8-18

Figure 8-19

Figure 8-20

Figure 8-21

Figure 8-22

Figure 8-23

Figure 8-24

Figure 8-25

Figure 8-26

Figure 8-27

Figure 8-28

Figure 9-1

Figure 9-2

Figure 9-3

Figure 9-4

Figure 10-1

LFBGA64 TOP VIEW (FACE DOWN) ........................................................................... 2

56-PIN STANDARD TSOP (TOP VIEW) ........................................................................ 2

TFBGA48 TOP VIEW (FACE DOWN) ............................................................................ 2

48-PIN STANDARD TSOP (TOP VIEW) ........................................................................ 2

Block Diagram ................................................................................................................. 3

Enhanced Sector Protect/Un-protect IPB Program Algorithm ...................................... 15

Lock Register Program Algorithm ................................................................................. 16

IPB Program Algorithm ................................................................................................. 18

Maximum Negative Overshoot ..................................................................................... 29

Maximum Positive Overshoot ....................................................................................... 29

Switch Test Circuit ........................................................................................................ 31

Switching Test Waveform ............................................................................................. 31

Instruction Write Operation Waveform .......................................................................... 33

Read Timing Waveform ................................................................................................ 34

#RESET Timing Waveform ........................................................................................... 35

Automatic Chip Erase Timing Waveform ...................................................................... 36

Automatic Chip Erase Algorithm Flowchart .................................................................. 37

Automatic Sector Erase Timing Waveform ................................................................... 38

Automatic Sector Erase Algorithm Flowchart ............................................................... 39

Erase Suspend/Resume Flowchart .............................................................................. 40

Automatic Program Timing Waveform .......................................................................... 41

Accelerated Program Timing Waveform ....................................................................... 41

#CE Controlled Write Timing Waveform ....................................................................... 42

#WE Controlled Write Timing Waveform ...................................................................... 43

Automatic Programming Algorithm Flowchart .............................................................. 44

Silicon ID Read Timing Waveform ................................................................................ 45

Data# Polling Timing Waveform (During Automatic Algorithms) .................................. 46

Status Polling for Word Programming/Erase ................................................................ 47

Status Polling for Write Buffer Program Flowchart ....................................................... 48

Toggling Bit Timing Waveform (During Automatic Algorithms) .................................... 49

Toggle Bit Algorithm...................................................................................................... 50

#BYTE Timing Waveform For Read operations ........................................................... 51

Page Read Timing Waveform ....................................................................................... 51

Deep Power Down mode Waveform ............................................................................ 52

Write Buffer Program Flowchart ................................................................................... 52

AC Timing at Device Power-Up .................................................................................... 53

TSOP 48-pin 12x20mm ................................................................................................ 55

TSOP 56-pin 14x20mm ................................................................................................ 56

LFBGA 64-ball 11x13mm ............................................................................................. 57

TFBGA 48-Ball 6x8mm ................................................................................................. 58

Ordering Part Numbering .............................................................................................. 59

iii

Publication Release Date: August 2, 2013

Revision H

参数对比

与W29GL032CT7S相近的元器件有：W29GL032C、W29GL032CB7A、W29GL032CB7B、W29GL032CH7B、W29GL032CH7T、W29GL032CL7B、W29GL032CL7T、W29GL032CT7A、W29GL032CT7B。描述及对比如下：

型号	W29GL032CT7S	W29GL032C	W29GL032CB7A	W29GL032CB7B	W29GL032CH7B	W29GL032CH7T	W29GL032CL7B	W29GL032CL7T	W29GL032CT7A	W29GL032CT7B
描述	32M X 1 FLASH 3V PROM, 70 ns, PDSO48	32M X 1 FLASH 3V PROM, 70 ns, PDSO48	32M X 1 FLASH 3V PROM, 70 ns, PDSO48	Flash, 32MX1, 70ns, PBGA64, LFBGA-64	32M X 1 FLASH 3V PROM, 70 ns, PDSO48	Flash, 32MX1, 70ns, PDSO56, TSOP-56	32M X 1 FLASH 3V PROM, 70 ns, PDSO48	32M X 1 FLASH 3V PROM, 70 ns, PDSO48	Flash, 32MX1, 70ns, PBGA48, TFBGA-48	32M X 1 FLASH 3V PROM, 70 ns, PDSO48
内存宽度	1	1	1	1	1	1	1	1	1	1
功能数量	1	1	1	1	1	1	1	1	1	1
端子数量	48	48	48	64	64	56	64	48	48	48
组织	32MX1	32M X 1	32M X 1	32MX1	32MX1	32MX1	32MX1	32M X 1	32MX1	32M X 1
表面贴装	YES	Yes	Yes	YES	YES	YES	YES	Yes	YES	Yes
温度等级	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL
端子形式	GULL WING	GULL WING	GULL WING	BALL	BALL	GULL WING	BALL	GULL WING	BALL	GULL WING
端子位置	DUAL	DUAL	DUAL	BOTTOM	BOTTOM	DUAL	BOTTOM	DUAL	BOTTOM	DUAL
是否无铅	不含铅	-	-	不含铅	不含铅	不含铅	不含铅	-	不含铅	-
是否Rohs认证	符合	-	-	符合	符合	符合	符合	-	符合	-
零件包装代码	TSOP	-	-	BGA	BGA	TSOP	BGA	-	BGA	-
包装说明	TSOP-48	-	-	LFBGA-64	LFBGA-64	TSOP-56	LFBGA-64	-	TFBGA-48	-
针数	48	-	-	64	64	56	64	-	48	-
Reach Compliance Code	compli	-	-	compliant	compli	compliant	compliant	-	compliant	-
ECCN代码	3A991.B.1.A	-	-	EAR99	3A991.B.1.A	EAR99	3A991.B.1.A	-	EAR99	-
最长访问时间	70 ns	-	-	70 ns	70 ns	70 ns	70 ns	-	70 ns	-
备用内存宽度	8	-	-	8	8	8	8	-	8	-
命令用户界面	YES	-	-	YES	YES	YES	YES	-	YES	-
通用闪存接口	YES	-	-	YES	YES	YES	YES	-	YES	-
数据轮询	YES	-	-	YES	YES	YES	YES	-	YES	-
JESD-30 代码	R-PDSO-G48	-	-	R-PBGA-B64	R-PBGA-B64	R-PDSO-G56	R-PBGA-B64	-	R-PBGA-B48	-
JESD-609代码	e3	-	-	e1	e1	e3	e1	-	e1	-
长度	18.4 mm	-	-	13 mm	13 mm	18.4 mm	13 mm	-	8 mm	-
内存密度	33554432 bi	-	-	33554432 bit	33554432 bi	33554432 bit	33554432 bit	-	33554432 bit	-
内存集成电路类型	FLASH	-	-	FLASH	FLASH	FLASH	FLASH	-	FLASH	-
部门数/规模	8,63	-	-	8,63	64	64	64	-	8,63	-
字数	33554432 words	-	-	33554432 words	33554432 words	33554432 words	33554432 words	-	33554432 words	-
字数代码	32000000	-	-	32000000	32000000	32000000	32000000	-	32000000	-
工作模式	ASYNCHRONOUS	-	-	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	-	ASYNCHRONOUS	-
最高工作温度	85 °C	-	-	85 °C	85 °C	85 °C	85 °C	-	85 °C	-
最低工作温度	-40 °C	-	-	-40 °C	-40 °C	-40 °C	-40 °C	-	-40 °C	-
封装主体材料	PLASTIC/EPOXY	-	-	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	-	PLASTIC/EPOXY	-
封装代码	TSOP1	-	-	LBGA	LBGA	TSOP1	LBGA	-	TFBGA	-
封装等效代码	TSSOP48,.8,20	-	-	BGA64,8X8,40	BGA64,8X8,40	TSSOP56,.8,20	BGA64,8X8,40	-	BGA48,6X8,32	-
封装形状	RECTANGULAR	-	-	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	-	RECTANGULAR	-
封装形式	SMALL OUTLINE, THIN PROFILE	-	-	GRID ARRAY, LOW PROFILE	GRID ARRAY, LOW PROFILE	SMALL OUTLINE, THIN PROFILE	GRID ARRAY, LOW PROFILE	-	GRID ARRAY, THIN PROFILE, FINE PITCH	-
页面大小	8/16 words	-	-	8/16 words	8/16 words	8/16 words	8/16 words	-	8/16 words	-
并行/串行	PARALLEL	-	-	PARALLEL	PARALLEL	PARALLEL	PARALLEL	-	PARALLEL	-
编程电压	3 V	-	-	3 V	3 V	3 V	3 V	-	3 V	-
认证状态	Not Qualified	-	-	Not Qualified	Not Qualified	Not Qualified	Not Qualified	-	Not Qualified	-
就绪/忙碌	YES	-	-	YES	YES	YES	YES	-	YES	-
座面最大高度	1.2 mm	-	-	1.4 mm	1.4 mm	1.2 mm	1.4 mm	-	1.2 mm	-
部门规模	8K,64K	-	-	8K,64K	64K	64K	64K	-	8K,64K	-
最大待机电流	0.000005 A	-	-	0.000005 A	0.000005 A	0.000005 A	0.000005 A	-	0.000005 A	-
最大压摆率	0.055 mA	-	-	0.055 mA	0.055 mA	0.055 mA	0.055 mA	-	0.055 mA	-
最大供电电压 (Vsup)	3.6 V	-	-	3.6 V	3.6 V	3.6 V	3.6 V	-	3.6 V	-
最小供电电压 (Vsup)	2.7 V	-	-	2.7 V	2.7 V	2.7 V	2.7 V	-	2.7 V	-
标称供电电压 (Vsup)	3 V	-	-	3 V	3 V	3 V	3 V	-	3 V	-
技术	CMOS	-	-	CMOS	CMOS	CMOS	CMOS	-	CMOS	-
端子面层	Matte Tin (Sn)	-	-	TIN SILVER COPPER	TIN SILVER COPPER	MATTE TIN	TIN SILVER COPPER	-	TIN SILVER COPPER	-
端子节距	0.5 mm	-	-	1 mm	1 mm	0.5 mm	1 mm	-	0.8 mm	-
切换位	YES	-	-	YES	YES	YES	YES	-	YES	-
类型	NOR TYPE	-	-	NOR TYPE	NOR TYPE	NOR TYPE	NOR TYPE	-	NOR TYPE	-
宽度	12 mm	-	-	11 mm	11 mm	14 mm	11 mm	-	6 mm	-

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