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W49F201T-45B

128K X 16 CMOS FLASH MEMORY

器件类别:存储    存储   

厂商名称:Winbond(华邦电子)

厂商官网:http://www.winbond.com.tw

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器件参数
参数名称
属性值
是否Rohs认证
不符合
厂商名称
Winbond(华邦电子)
零件包装代码
TSOP
包装说明
12 X 20 MM, TSOP-48
针数
48
Reach Compliance Code
_compli
ECCN代码
EAR99
最长访问时间
45 ns
启动块
BOTTOM
命令用户界面
YES
数据轮询
YES
JESD-30 代码
R-PDSO-G48
JESD-609代码
e0
长度
18.4 mm
内存密度
2097152 bi
内存集成电路类型
FLASH
内存宽度
16
功能数量
1
部门数/规模
3,1
端子数量
48
字数
131072 words
字数代码
128000
工作模式
ASYNCHRONOUS
最高工作温度
70 °C
最低工作温度
组织
128KX16
封装主体材料
PLASTIC/EPOXY
封装代码
TSOP1
封装等效代码
TSSOP48,.8,20
封装形状
RECTANGULAR
封装形式
SMALL OUTLINE, THIN PROFILE
并行/串行
PARALLEL
峰值回流温度(摄氏度)
NOT SPECIFIED
电源
5 V
编程电压
5 V
认证状态
Not Qualified
座面最大高度
1.2 mm
部门规模
8K,104K
最大待机电流
0.0001 A
最大压摆率
0.05 mA
最大供电电压 (Vsup)
5.5 V
最小供电电压 (Vsup)
4.5 V
标称供电电压 (Vsup)
5 V
表面贴装
YES
技术
CMOS
温度等级
COMMERCIAL
端子面层
Tin/Lead (Sn/Pb)
端子形式
GULL WING
端子节距
0.5 mm
端子位置
DUAL
处于峰值回流温度下的最长时间
NOT SPECIFIED
切换位
YES
类型
NOR TYPE
宽度
12 mm
文档预览
Preliminary W49F201
128K
×
16 CMOS FLASH MEMORY
GENERAL DESCRIPTION
The W49F201 is a 2-megabit, 5-volt only CMOS flash memory organized as 128K
×
16 bits. The
device can be programmed and erased in-system with a standard 5V power supply. A 12-volt V
PP
is
not required. The unique cell architecture of the W49F201 results in fast program/erase operations
with extremely low current consumption (compared to other comparable 5-volt flash memory
products). The device can also be programmed and erased using standard EPROM programmers.
FEATURES
Single 5-volt operations:
5-volt Read/Erase/Program
Fast Program operation:
Word-by-Word programming: 50
µS
(max.)
Fast Erase operation: 60 mS (typ.)
Fast Read access time: 45/55 nS
Endurance: 1K/10K cycles (typ.)
Ten-year data retention
Hardware data protection
Sector configuration
One 8K words boot block with lockout
protection
Two 8K words parameter blocks
One 104K words (208K bytes) Main Memory
Array Blocks
Low power consumption
Active current: 25 mA (typ.)
Standby current: 20
µA
(typ.)
Automatic program and erase timing with
internal V
PP
generation
End of program or erase detection
Toggle bit
Data polling
Latched address and data
TTL compatible I/O
JEDEC standard word-wide pinouts
Available packages: 44-pin SOP, 48-pin TSOP
-1-
Publication Release Date: June 1999
Revision A1
Preliminary W49F201
PIN CONFIGURATIONS
BLOCK DIAGRAM
V
DD
V
SS
NC
NC
NC
A7
A6
A5
A4
A3
A2
A1
A0
CE
GND
OE
DQ0
DQ8
DQ1
DQ9
DQ2
DQ10
DQ3
DQ11
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
44
43
42
41
40
39
38
37
36
35
34
33
32
31
30
29
28
27
26
25
24
23
44-pin
SOP
RESET
WE
A8
A9
A10
A11
A12
A13
A14
A15
A16
NC
GND
DQ15
DQ7
DQ14
DQ6
DQ13
DQ5
DQ12
DQ4
V
CC
CE
OE
WE
RESET
CONTROL
OUTPUT
BUFFER
DQ0
.
.
DQ15
A0
.
.
A16
DECODER
1FFFF
MAIN MEMORY
104K WORDS
06000
05FFF
PARAMETER
BLOCK2
8K WORDS
04000
03FFF
PARAMETER
BLOCK1
8K WORDS
02000
BOOT BLOCK
01FFF
8K WORDS
00000
A15
A14
A13
A12
A11
A10
A9
A8
NC
NC
WE
RESET
NC
NC
NC
NC
NC
A7
A6
A5
A4
A3
A2
A1
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
48
47
7
46
45
44
43
42
41
48-pin
TSOP
40
39
38
37
36
35
34
33
32
31
30
29
28
27
26
25
A16
NC
GND
DQ15
DQ7
DQ14
DQ6
DQ13
DQ5
DQ12
DQ4
V
CC
DQ11
DQ3
DQ10
DQ2
DQ9
DQ1
DQ8
DQ0
OE
GND
CE
A0
PIN DESCRIPTION
SYMBOL
RESET
A0−A16
DQ0−DQ15
CE
OE
WE
V
DD
GND
NC
Reset
Address Inputs
Data Inputs/Outputs
Chip Enable
Output Enable
Write Enable
Power Supply
Ground
No Connection
PIN NAME
-2-
Preliminary W49F201
FUNCTIONAL DESCRIPTION
Read Mode
The read operation of the W49F201 is controlled by CE and OE, both of which have to be low for
the host to obtain data from the outputs. CE is used for device selection. When CE is high, the chip
is de-selected and only standby power will be consumed. OE is the output control and is used to gate
data to the output pins. The data bus is in high impedance state when either CE or OE is high. Refer
to the timing waveforms for further details.
Reset Operation
The RESET input pin can be used in some application. When RESET pin is at high state, the device
is in normal operation mode. When RESET pin is driven low for at least a period of T
RP
, it will halts
the device and all outputs are at high impedance state. The device also resets the internal state
machine to read array data. The operation that was interrupted should be reinitiated once the device
is ready to accept another command sequence to assure data integrity. As the high state re-asserted
to the RESET pin, the device will return to read or standby mode, it depends on the control signals.
The system can read data T
RH
after the RESET pin returns to V
IH
. The other function for RESET pin
is temporary reset the boot block. By applying the 12V to RESET pin, the boot block can be
reprogrammed even though the boot block lockout function is enabled.
Boot Block Operation
There is one 8K-word boot block in this device, which can be used to store boot code. It is located in
the first 8K words of the memory with the address range from 0000(hex) to 1FFF(hex).
See Command Codes for Boot Block Lockout Enable for the specific code. Once this feature is set
the data for the designated block cannot be erased or programmed (programming lockout); other
memory locations can be changed by the regular programming method.
There is one condition that the lockout feature can be overrides. Just apply 12V to RESET pin, the
lockout feature will temporary be inactivated and the boot block can be erased/programmed. Once
the RESET pin returns to TTL level, the lockout feature will be activated again.
In order to detect whether the boot block feature is set on the 8K-words block, users can perform
software command sequence: enter the product identification mode (see Command Codes for
Identification/Boot Block Lockout Detection for specific code), and then read from address "0002
hex". If the output data in DQ0 is "1", the boot block programming lockout feature is activated; if the
output data in DQ0 is "0",
the lockout feature is inactivated and the block can be
erased/programmed.
To return to normal operation, perform a three-byte command sequence (or an alternate single-word
command) to exit the identification mode. For the specific code, see Command Codes for
Identification/Boot Block Lockout Detection.
Chip Erase Operation
The chip-erase mode can be initiated by a six-word command sequence. After the command loading
cycle, the device enters the internal chip erase mode, which is automatically timed and will be
Publication Release Date: June 1999
Revision A1
-3-
Preliminary W49F201
completed in a fast 100 mS (typical). The host system is not required to provide any control or timing
during this operation. The entire memory array will be erased to FF(hex). by the chip erase operation
if the boot block programming lockout feature is not activated. Once the boot block lockout feature is
activated, the chip erase function will erase all the sectors except the boot mode.
Sector Erase Operation
The three sectors, main memory and two parameters blocks, can be erased individually by initiating a
six-word command sequence. Sector address is latched on the falling WE edge of the sixth cycle
while the 30(hex) data input command is latched at the rising edge of WE. After the command
loading cycle, the device enters the internal sector erase mode, which is automatically timed and will
be completed in a fast 100 mS (typical). The host system is not required to provide any control or
timing during this operation. The device will automatically return to normal read mode after the erase
operation completed. Data polling and/or Toggle Bits can be used to detect end of erase cycle.
When the boot block lockout feature is inactivated, the boot block and the main memory block will be
erased together. Once the boot block is locked, only the main memory block will be erased by the
execution of sector erase operation.
Program Operation
The W49F201 is programmed on a word-by-word basis. Program operation can only change logical
data "1" to logical data "0" The erase operation (changed entire data in main memory and/or boot
block from "0" to "1" is needed before programming.
The program operation is initiated by a 4-word command cycle (see Command Codes for Word
Programming). The device will internally enter the program operation immediately after the word-
program command is entered. The internal program timer will automatically time-out (50
µS
max. -
T
BP
) once completed and return to normal read mode. Data polling and/or Toggle Bits can be used to
detect end of program cycle.
Hardware Data Protection
The integrity of the data stored in the W49F201 is also hardware protected in the following ways:
(1) Noise/Glitch Protection: A WE pulse of less than 15 nS in duration will not initiate a write cycle.
(2) V
DD
Power Up/Down Detection: The programming operation is inhibited when V
DD
is less than
2.5V typical.
(3) Write Inhibit Mode: Forcing OE low, CE high, or WE high will inhibit the write operation. This
prevents inadvertent writes during power-up or power-down periods.
(4) V
DD
power-on delay: When V
DD
has reached its sense level, the device will automatically time-out
5 mS before any write (erase/program) operation.
Data Polling (DQ
7
)- Write Status Detection
The W49F201 includes a data polling feature to indicate the end of a program or erase cycle. When
the W49F201 is in the internal program or erase cycle, any attempt to read DQ
7
of the last word
loaded will receive the complement of the true data. Once the program or erase cycle is completed,
DQ
7
will show the true data. Note that DQ
7
will show logical "0" during the erase cycle, and become
logical "1" or true data when the erase cycle has been completed.
-4-
Preliminary W49F201
Toggle Bit (DQ
6
)- Write Status Detection
In addition to data polling, the W49F201 provides another method for determining the end of a
program cycle. During the internal program or erase cycle, any consecutive attempts to read DQ
6
will
produce alternating 0's and 1's. When the program or erase cycle is completed, this toggling between
0's and 1's will stop. The device is then ready for the next operation.
Product Identification
The product ID operation outputs the manufacturer code and device code. Programming equipment
automatically matches the device with its proper erase and programming algorithms.
The manufacturer and device codes can be accessed by software or hardware operation. In the
software access mode, a six-word (or JEDEC 3-word) command sequence can be used to access the
product ID. A read from address 0000H outputs the manufacturer code, 00DA(hex). A read from
address 0001(hex) outputs the device code, 00AE(hex). The product ID operation can be terminated
by a three-word command sequence or an alternative one-word command sequence (see Command
Definition table).
In the hardware access mode, access to the product ID is activated by forcing CE and OE low, WE
high, and raising A9 to 12 volts.
TABLE OF OPERATING MODES
Operating Mode Selection
(V
HH
= 12V
±5 %)
MODE
CE
Read
Erase/Program
Standby
Erase/Program
Inhibit
Output Disable
Product ID
V
IL
V
IL
V
IH
X
X
X
V
IL
V
IL
Reset
X
OE
V
IL
V
IH
X
V
IL
X
V
IH
V
IL
V
IL
X
WE
V
IH
V
IL
X
X
V
IH
X
V
IH
V
IH
X
RESET
PINS
ADDRESS
A
IN
A
IN
X
X
X
X
A0 = V
IL
;
A1−A15 = V
IL
; A9 = V
HH
A0 = V
IH
;
A1−A15 = V
IL
; A9 = V
HH
X
Dout
Din
High Z
High Z/D
OUT
High Z/D
OUT
High Z
Manufacturer Code
00DA (Hex)
Device Code
00AE (Hex)
High Z
DQ.
V
IH
V
IH
V
IH
V
IH
V
IH
V
IH
V
IH
V
IH
V
IL
-5-
Publication Release Date: June 1999
Revision A1
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参数对比
与W49F201T-45B相近的元器件有:W49F201T-55B、W49F201T-55、W49F201T-45、W49F201。描述及对比如下:
型号 W49F201T-45B W49F201T-55B W49F201T-55 W49F201T-45 W49F201
描述 128K X 16 CMOS FLASH MEMORY 128K X 16 CMOS FLASH MEMORY 128K X 16 CMOS FLASH MEMORY 128K X 16 CMOS FLASH MEMORY 128K X 16 CMOS FLASH MEMORY
是否Rohs认证 不符合 - 不符合 不符合 -
厂商名称 Winbond(华邦电子) Winbond(华邦电子) Winbond(华邦电子) Winbond(华邦电子) -
零件包装代码 TSOP TSOP TSOP TSOP -
包装说明 12 X 20 MM, TSOP-48 TSOP1, TSSOP48,.8,20 12 X 20 MM, TSOP-48 12 X 20 MM, TSOP-48 -
针数 48 48 48 48 -
Reach Compliance Code _compli unknow _compli _compli -
ECCN代码 EAR99 EAR99 EAR99 EAR99 -
最长访问时间 45 ns 55 ns 55 ns 45 ns -
启动块 BOTTOM BOTTOM BOTTOM BOTTOM -
命令用户界面 YES YES YES YES -
数据轮询 YES YES YES YES -
JESD-30 代码 R-PDSO-G48 R-PDSO-G48 R-PDSO-G48 R-PDSO-G48 -
JESD-609代码 e0 e3 e0 e0 -
长度 18.4 mm 18.4 mm 18.4 mm 18.4 mm -
内存密度 2097152 bi 2097152 bi 2097152 bi 2097152 bi -
内存集成电路类型 FLASH FLASH FLASH FLASH -
内存宽度 16 16 16 16 -
功能数量 1 1 1 1 -
部门数/规模 3,1 3,1 3,1 3,1 -
端子数量 48 48 48 48 -
字数 131072 words 131072 words 131072 words 131072 words -
字数代码 128000 128000 128000 128000 -
工作模式 ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS -
最高工作温度 70 °C 70 °C 70 °C 70 °C -
组织 128KX16 128KX16 128KX16 128KX16 -
封装主体材料 PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY -
封装代码 TSOP1 TSOP1 TSOP1 TSOP1 -
封装等效代码 TSSOP48,.8,20 TSSOP48,.8,20 TSSOP48,.8,20 TSSOP48,.8,20 -
封装形状 RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR -
封装形式 SMALL OUTLINE, THIN PROFILE SMALL OUTLINE, THIN PROFILE SMALL OUTLINE, THIN PROFILE SMALL OUTLINE, THIN PROFILE -
并行/串行 PARALLEL PARALLEL PARALLEL PARALLEL -
峰值回流温度(摄氏度) NOT SPECIFIED - NOT SPECIFIED NOT SPECIFIED -
电源 5 V 5 V 5 V 5 V -
编程电压 5 V 5 V 5 V 5 V -
认证状态 Not Qualified Not Qualified Not Qualified Not Qualified -
座面最大高度 1.2 mm 1.2 mm 1.2 mm 1.2 mm -
部门规模 8K,104K 8K,104K 8K,104K 8K,104K -
最大待机电流 0.0001 A 0.0001 A 0.0001 A 0.0001 A -
最大压摆率 0.05 mA 0.05 mA 0.05 mA 0.05 mA -
最大供电电压 (Vsup) 5.5 V 5.5 V 5.5 V 5.5 V -
最小供电电压 (Vsup) 4.5 V 4.5 V 4.5 V 4.5 V -
标称供电电压 (Vsup) 5 V 5 V 5 V 5 V -
表面贴装 YES YES YES YES -
技术 CMOS CMOS CMOS CMOS -
温度等级 COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL -
端子面层 Tin/Lead (Sn/Pb) MATTE TIN Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) -
端子形式 GULL WING GULL WING GULL WING GULL WING -
端子节距 0.5 mm 0.5 mm 0.5 mm 0.5 mm -
端子位置 DUAL DUAL DUAL DUAL -
处于峰值回流温度下的最长时间 NOT SPECIFIED - NOT SPECIFIED NOT SPECIFIED -
切换位 YES YES YES YES -
类型 NOR TYPE NOR TYPE NOR TYPE NOR TYPE -
宽度 12 mm 12 mm 12 mm 12 mm -
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