SRAM Module, 512KX8, 25ns, CMOS, 0.600 INCH, CERAMIC, DIP-32
厂商名称:Mercury Systems Inc
下载文档型号 | WS512K8-25CMA | WS512K8-20CMA | WS512K8-20CIA | WS512K8-45CMA | WS512K8-35CIA | WS512K8-35CMA | WS512K8-25CIA | WS512K8-45CIA |
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描述 | SRAM Module, 512KX8, 25ns, CMOS, 0.600 INCH, CERAMIC, DIP-32 | SRAM Module, 512KX8, 20ns, CMOS, 0.600 INCH, CERAMIC, DIP-32 | SRAM Module, 512KX8, 20ns, CMOS, 0.600 INCH, CERAMIC, DIP-32 | SRAM Module, 512KX8, 45ns, CMOS, 0.600 INCH, CERAMIC, DIP-32 | SRAM Module, 512KX8, 35ns, CMOS, 0.600 INCH, CERAMIC, DIP-32 | SRAM Module, 512KX8, 35ns, CMOS, 0.600 INCH, CERAMIC, DIP-32 | SRAM Module, 512KX8, 25ns, CMOS, 0.600 INCH, CERAMIC, DIP-32 | SRAM Module, 512KX8, 45ns, CMOS, 0.600 INCH, CERAMIC, DIP-32 |
是否Rohs认证 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 |
Reach Compliance Code | unknown | unknown | unknown | unknown | unknown | unknown | unknown | unknown |
ECCN代码 | 3A001.A.2.C | 3A001.A.2.C | 3A991.B.2.A | 3A001.A.2.C | 3A991.B.2.A | 3A001.A.2.C | 3A991.B.2.A | 3A991.B.2.A |
最长访问时间 | 25 ns | 20 ns | 20 ns | 45 ns | 35 ns | 35 ns | 25 ns | 45 ns |
JESD-30 代码 | R-XDMA-T32 | R-XDMA-T32 | R-XDMA-T32 | R-XDMA-T32 | R-XDMA-T32 | R-XDMA-T32 | R-XDMA-T32 | R-XDMA-T32 |
JESD-609代码 | e0 | e0 | e0 | e0 | e0 | e0 | e0 | e0 |
内存密度 | 4194304 bit | 4194304 bit | 4194304 bit | 4194304 bit | 4194304 bit | 4194304 bit | 4194304 bit | 4194304 bit |
内存集成电路类型 | SRAM MODULE | SRAM MODULE | SRAM MODULE | SRAM MODULE | SRAM MODULE | SRAM MODULE | SRAM MODULE | SRAM MODULE |
内存宽度 | 8 | 8 | 8 | 8 | 8 | 8 | 8 | 8 |
功能数量 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
端子数量 | 32 | 32 | 32 | 32 | 32 | 32 | 32 | 32 |
字数 | 524288 words | 524288 words | 524288 words | 524288 words | 524288 words | 524288 words | 524288 words | 524288 words |
字数代码 | 512000 | 512000 | 512000 | 512000 | 512000 | 512000 | 512000 | 512000 |
工作模式 | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS |
最高工作温度 | 125 °C | 125 °C | 85 °C | 125 °C | 85 °C | 125 °C | 85 °C | 85 °C |
最低工作温度 | -55 °C | -55 °C | -40 °C | -55 °C | -40 °C | -55 °C | -40 °C | -40 °C |
组织 | 512KX8 | 512KX8 | 512KX8 | 512KX8 | 512KX8 | 512KX8 | 512KX8 | 512KX8 |
封装主体材料 | UNSPECIFIED | UNSPECIFIED | UNSPECIFIED | UNSPECIFIED | UNSPECIFIED | UNSPECIFIED | UNSPECIFIED | UNSPECIFIED |
封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
封装形式 | MICROELECTRONIC ASSEMBLY | MICROELECTRONIC ASSEMBLY | MICROELECTRONIC ASSEMBLY | MICROELECTRONIC ASSEMBLY | MICROELECTRONIC ASSEMBLY | MICROELECTRONIC ASSEMBLY | MICROELECTRONIC ASSEMBLY | MICROELECTRONIC ASSEMBLY |
并行/串行 | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL |
峰值回流温度(摄氏度) | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
最大供电电压 (Vsup) | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V |
最小供电电压 (Vsup) | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V |
标称供电电压 (Vsup) | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
表面贴装 | NO | NO | NO | NO | NO | NO | NO | NO |
技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
温度等级 | MILITARY | MILITARY | INDUSTRIAL | MILITARY | INDUSTRIAL | MILITARY | INDUSTRIAL | INDUSTRIAL |
端子面层 | TIN LEAD | TIN LEAD | TIN LEAD | TIN LEAD | TIN LEAD | TIN LEAD | TIN LEAD | TIN LEAD |
端子形式 | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE |
端子位置 | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL |
处于峰值回流温度下的最长时间 | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
厂商名称 | Mercury Systems Inc | - | - | Mercury Systems Inc | Mercury Systems Inc | Mercury Systems Inc | Mercury Systems Inc | Mercury Systems Inc |