IC 32-BIT, 500 MHz, RISC PROCESSOR, PBGA324, GREEN, PLASTIC, NFBGA-324, Microprocessor
器件类别:嵌入式处理器和控制器 微控制器和处理器
敬请期待型号 | XAM3359ZCZA50 | XAM3359ZCZD50 | XAM3358ZCEA50 | XAM3358ZCED50 | XAM3359ZCZ50 | XAM3358ZCE50 |
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描述 | IC 32-BIT, 500 MHz, RISC PROCESSOR, PBGA324, GREEN, PLASTIC, NFBGA-324, Microprocessor | IC 32-BIT, 500 MHz, RISC PROCESSOR, PBGA324, GREEN, PLASTIC, NFBGA-324, Microprocessor | IC 32-BIT, 500 MHz, RISC PROCESSOR, PBGA298, GREEN, PLASTIC, NFBGA-298, Microprocessor | IC 32-BIT, 500 MHz, RISC PROCESSOR, PBGA298, GREEN, PLASTIC, NFBGA-298, Microprocessor | IC 32-BIT, 500 MHz, RISC PROCESSOR, PBGA324, GREEN, PLASTIC, NFBGA-324, Microprocessor | IC 32-BIT, 500 MHz, RISC PROCESSOR, PBGA298, GREEN, PLASTIC, NFBGA-298, Microprocessor |
厂商名称 | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) |
零件包装代码 | BGA | BGA | BGA | BGA | BGA | BGA |
包装说明 | LFBGA, | LFBGA, | LFBGA, | LFBGA, | LFBGA, | LFBGA, |
针数 | 324 | 324 | 298 | 298 | 324 | 298 |
Reach Compliance Code | unknown | unknown | unknown | unknown | unknown | unknown |
ECCN代码 | 3A991.A.2 | 3A991.A.2 | 3A991.A.2 | 3A991.A.2 | 3A991.A.2 | 3A991.A.2 |
位大小 | 32 | 32 | 32 | 32 | 32 | 32 |
边界扫描 | YES | YES | YES | YES | YES | YES |
最大时钟频率 | 26 MHz | 26 MHz | 26 MHz | 26 MHz | 26 MHz | 26 MHz |
格式 | FIXED POINT | FIXED POINT | FIXED POINT | FIXED POINT | FIXED POINT | FIXED POINT |
集成缓存 | YES | YES | YES | YES | YES | YES |
JESD-30 代码 | S-PBGA-B324 | S-PBGA-B324 | S-PBGA-B298 | S-PBGA-B298 | S-PBGA-B324 | S-PBGA-B298 |
JESD-609代码 | e1 | e1 | e1 | e1 | e1 | e1 |
长度 | 15 mm | 15 mm | 13 mm | 13 mm | 15 mm | 13 mm |
低功率模式 | YES | YES | YES | YES | YES | YES |
端子数量 | 324 | 324 | 298 | 298 | 324 | 298 |
最高工作温度 | 105 °C | 90 °C | 105 °C | 90 °C | 90 °C | 90 °C |
最低工作温度 | -40 °C | -40 °C | -40 °C | -40 °C | - | - |
封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
封装代码 | LFBGA | LFBGA | LFBGA | LFBGA | LFBGA | LFBGA |
封装形状 | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE |
封装形式 | GRID ARRAY, LOW PROFILE, FINE PITCH | GRID ARRAY, LOW PROFILE, FINE PITCH | GRID ARRAY, LOW PROFILE, FINE PITCH | GRID ARRAY, LOW PROFILE, FINE PITCH | GRID ARRAY, LOW PROFILE, FINE PITCH | GRID ARRAY, LOW PROFILE, FINE PITCH |
座面最大高度 | 1.4 mm | 1.4 mm | 1.3 mm | 1.3 mm | 1.4 mm | 1.3 mm |
速度 | 500 MHz | 500 MHz | 500 MHz | 500 MHz | 500 MHz | 500 MHz |
最大供电电压 | 1.15 V | 1.15 V | 1.15 V | 1.15 V | 1.15 V | 1.15 V |
最小供电电压 | 1.06 V | 1.06 V | 1.06 V | 1.06 V | 1.06 V | 1.06 V |
标称供电电压 | 1.1 V | 1.1 V | 1.1 V | 1.1 V | 1.1 V | 1.1 V |
表面贴装 | YES | YES | YES | YES | YES | YES |
技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
温度等级 | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | OTHER | OTHER |
端子面层 | TIN SILVER COPPER | TIN SILVER COPPER | TIN SILVER COPPER | TIN SILVER COPPER | TIN SILVER COPPER | TIN SILVER COPPER |
端子形式 | BALL | BALL | BALL | BALL | BALL | BALL |
端子节距 | 0.8 mm | 0.8 mm | 0.65 mm | 0.65 mm | 0.8 mm | 0.65 mm |
端子位置 | BOTTOM | BOTTOM | BOTTOM | BOTTOM | BOTTOM | BOTTOM |
宽度 | 15 mm | 15 mm | 13 mm | 13 mm | 15 mm | 13 mm |
uPs/uCs/外围集成电路类型 | MICROPROCESSOR, RISC | MICROPROCESSOR, RISC | MICROPROCESSOR, RISC | MICROPROCESSOR, RISC | MICROPROCESSOR, RISC | MICROPROCESSOR, RISC |