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54242-803-08-XXX

Board Connector, 8 Contact(s), 2 Row(s), Male, Straight, 0.1 inch Pitch, Surface Mount Terminal, Black Insulator, Receptacle

器件类别:连接器    连接器   

厂商名称:Amphenol(安费诺)

厂商官网:http://www.amphenol.com/

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器件参数
参数名称
属性值
是否Rohs认证
不符合
厂商名称
Amphenol(安费诺)
Reach Compliance Code
compliant
ECCN代码
EAR99
其他特性
STACK HT=BRD SPACING - RCPT HT
主体宽度
0.19 inch
主体长度
0.4 inch
主体/外壳类型
RECEPTACLE
连接器类型
BOARD CONNECTOR
联系完成配合
GOLD (15) OVER NICKEL (50)
联系完成终止
Tin/Lead (Sn/Pb) - with Nickel (Ni) barrier
触点性别
MALE
触点材料
PHOSPHOR BRONZE
触点模式
RECTANGULAR
触点样式
SQ PIN-SKT
介电耐压
1500VAC V
绝缘电阻
5000000000 Ω
绝缘体颜色
BLACK
绝缘体材料
THERMOPLASTIC
JESD-609代码
e0
制造商序列号
54242
插接触点节距
0.1 inch
匹配触点行间距
0.1 inch
安装方式
STRAIGHT
安装类型
BOARD
连接器数
ONE
PCB行数
2
装载的行数
2
最高工作温度
125 °C
最低工作温度
-65 °C
PCB接触模式
RECTANGULAR
PCB触点行间距
5.969 mm
电镀厚度
15u inch
额定电流(信号)
3 A
参考标准
UL, CSA
可靠性
COMMERCIAL
端子长度
端子节距
2.54 mm
端接类型
SURFACE MOUNT
触点总数
8
文档预览
BergStik
®
Unshrouded Stacking Headers
2.54 mm
s
Wide variety of stack heights
in 0.5 mm increments
s
High temperature plastic
s
Selective plating
Technical Data
Physical
Housing: High temperature,
black thermoplastic
Flammability rating: UL 94 V-0
Pin: Phosphor-bronze
Plating: Gold or tin-lead over 1.27 µm nickel
Mating Data
Operating Temperature Range
-65°C to +125°C
s
Dubox™ Vertical receptacles
Page
24
s
Dubox™ Low profile vertical receptacles 26, 28
Packaging
Standard: Bags
Processing Information
Compatible with wave, vapor-phase, and
IR reflow soldering processes
Reference Information
File no. E66906
File no. LR46923
Product drawing: By 5-digit base part number
Product specification: BUS-12-114
Specifications subject to change without notice.
Electrical Performance
Current rating: 3 A continuous
Insulation resistance: 5000 MΩ min.
Dielectric withstanding voltage: 1500 V
Mechanical Performance
Pin retention to housing:
9 N min.
Typical Applications
Receptacle
mating side
mating side
Board
Space
OAL
Stack
Height
OAL
Stack
Height
OAL
solder side
solder side
Technical / Application Support / Drawings / Specifications / Samples:
www.fciconnect.com/basics
12
BergStik
®
Unshrouded Stacking Headers
2.54 mm
Part Number
5
4
Lead
Solder
Side
Option
Row
Option
Plating
Pin Style
Total
Positions
Stack Height
1
= Through Hole (TMT)
2
= Surface Mount (SMT)
1
= Single Row (TMT only)
2
= Double Row
01
to
36
single row (TMT)
04
to
72
double row (TMT)
04
to
50
double row (SMT
1
= 2.41
2
= 3.05
4
= SMT (double row only)
1
= 0.76 µm gold on mating area, tin-lead on solder side
4
= 3.81 µm tin-lead
8
= 0.38 µm gold on mating area, tin-lead on solder side
Pin
Style
01
02
03
04
05
06
07
08
09
10
11
12
OAL (TMT)
mm
OAL (SMT)
mm
12.20
13.50
15.90
16.76
17.65
18.91
20.96
23.50
26.04
28.58
31.12
33.66
10.42
11.72
14.12
14.98
15.87
17.13
19.18
21.72
24.26
26.80
29.34
31.88
XX.XX
= mm
Specify mm
(i.e. 08.50 = 8.50 mm
in 0.50 mm increments
08.00 min. - 25.00 max.)
Step-by-Step Design
1. Determine desired board spacing (0.50 mm increments)
2. Select Dubox™ receptacle and calculate stack height
Stack Height = Board Spacing – Receptacle Height
3. Find the insertion depth from the chart below.
Calculate max./ min. OAL
OAL = Stack Height + solder side + Insertion Depth
4. Select the Pin Style with OAL between max.
and min. values
Height
Insertion Depth (max.)
Insertion Depth (min.)
Dubox™ RECEPTACLES
Low Profile
Vertical
7.00
8.50
6.10
6.10
3.86
4.34
Recommended PCB Layout
Example:
1. Application requires a board spacing of 22.50
2. Select the Dubox™ Low Profile Receptacle
with height of 7.00
The Header Stack Height is 22.50 - 7.00 = 15.50
3. For standard board applications, the
3.05 solder side is selected
OAL (max.) = 15.50 + 3.05 + 6.10 = 24.65
OAL (min.) = 15.50 + 3.05 + 3.86 = 22.41
4. Select Pin Style 08 with OAL = 23.50
5. Part Number is 54122-108-72-1550
Dimensions in mm
Technical / Application Support / Drawings / Specifications / Samples:
www.fciconnect.com/basics
13
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