EE PLD, 25ns, 24-Cell, CMOS, PDIP40, 0.600 INCH, PLASTIC, DIP-40
厂商名称:Atmel (Microchip)
下载文档型号 | ATF2500CQ-25PI | ATF2500CQL-30GM/883 | ATF2500CQL-30KM/883 | ATF2500CQL-30NM/883 | ATF2500CQ-25GM/883 | ATF2500CQ-25KM/883 | ATF2500CQ-25JI | ATF2500CQ-25JC | ATF2500CQ-25NM/883 | ATF2500CQ-25PC |
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描述 | EE PLD, 25ns, 24-Cell, CMOS, PDIP40, 0.600 INCH, PLASTIC, DIP-40 | EE PLD, 30ns, 24-Cell, CMOS, CDIP40, 0.600 INCH, CERDIP-40 | EE PLD, 30ns, 24-Cell, CMOS, CQCC44, CERAMIC, LCC-44 | EE PLD, 30ns, 24-Cell, CMOS, CQCC44, 0.600 INCH, CERAMIC, LCC-44 | EE PLD, 25ns, 24-Cell, CMOS, CDIP40, 0.600 INCH, CERDIP-40 | EE PLD, 25ns, 24-Cell, CMOS, CQCC44, CERAMIC, LCC-44 | EE PLD, 25ns, 24-Cell, CMOS, PQCC44, PLASTIC, MS-018AC, LCC-44 | EE PLD, 25ns, 24-Cell, CMOS, PQCC44, PLASTIC, MS-018AC, LCC-44 | EE PLD, 25ns, 24-Cell, CMOS, CQCC44, 0.600 INCH, CERAMIC, LCC-44 | EE PLD, 25ns, 24-Cell, CMOS, PDIP40, 0.600 INCH, PLASTIC, DIP-40 |
是否Rohs认证 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 |
零件包装代码 | DIP | DIP | LCC | LCC | DIP | LCC | LPCC | LPCC | LCC | DIP |
包装说明 | 0.600 INCH, PLASTIC, DIP-40 | 0.600 INCH, CERDIP-40 | QCCJ, LDCC44,.7SQ | QCCN, LCC44,.65SQ | 0.600 INCH, CERDIP-40 | QCCJ, LDCC44,.7SQ | PLASTIC, MS-018AC, LCC-44 | PLASTIC, MS-018AC, LCC-44 | QCCN, LCC44,.65SQ | 0.600 INCH, PLASTIC, DIP-40 |
针数 | 40 | 40 | 44 | 44 | 40 | 44 | 44 | 44 | 44 | 40 |
Reach Compliance Code | not_compliant | not_compliant | compliant | compliant | not_compliant | compliant | not_compliant | not_compliant | compliant | not_compliant |
其他特性 | NO | NO | NO | NO | NO | NO | NO | NO | NO | NO |
最大时钟频率 | 27 MHz | 23 MHz | 23 MHz | 23 MHz | 27 MHz | 27 MHz | 27 MHz | 27 MHz | 27 MHz | 27 MHz |
系统内可编程 | NO | NO | NO | NO | NO | NO | NO | NO | NO | NO |
JESD-30 代码 | R-PDIP-T40 | R-GDIP-T40 | S-CQCC-J44 | S-CQCC-N44 | R-GDIP-T40 | S-CQCC-J44 | S-PQCC-J44 | S-PQCC-J44 | S-CQCC-N44 | R-PDIP-T40 |
JESD-609代码 | e0 | e0 | e0 | e0 | e0 | e0 | e0 | e0 | e0 | e0 |
JTAG BST | NO | NO | NO | NO | NO | NO | NO | NO | NO | NO |
长度 | 52.2 mm | 52.45 mm | 16.65 mm | 16.55 mm | 52.45 mm | 16.65 mm | 16.5862 mm | 16.5862 mm | 16.55 mm | 52.2 mm |
专用输入次数 | 14 | 14 | 14 | 14 | 14 | 14 | 14 | 14 | 14 | 14 |
I/O 线路数量 | 24 | 24 | 24 | 24 | 24 | 24 | 24 | 24 | 24 | 24 |
宏单元数 | 24 | 24 | 24 | 24 | 24 | 24 | 24 | 24 | 24 | 24 |
端子数量 | 40 | 40 | 44 | 44 | 40 | 44 | 44 | 44 | 44 | 40 |
最高工作温度 | 85 °C | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C | 85 °C | 70 °C | 125 °C | 70 °C |
最低工作温度 | -40 °C | -55 °C | -55 °C | -55 °C | -55 °C | -55 °C | -40 °C | - | -55 °C | - |
组织 | 14 DEDICATED INPUTS, 24 I/O | 14 DEDICATED INPUTS, 24 I/O | 14 DEDICATED INPUTS, 24 I/O | 14 DEDICATED INPUTS, 24 I/O | 14 DEDICATED INPUTS, 24 I/O | 14 DEDICATED INPUTS, 24 I/O | 14 DEDICATED INPUTS, 24 I/O | 14 DEDICATED INPUTS, 24 I/O | 14 DEDICATED INPUTS, 24 I/O | 14 DEDICATED INPUTS, 24 I/O |
输出函数 | MACROCELL | MACROCELL | MACROCELL | MACROCELL | MACROCELL | MACROCELL | MACROCELL | MACROCELL | MACROCELL | MACROCELL |
封装主体材料 | PLASTIC/EPOXY | CERAMIC, GLASS-SEALED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, GLASS-SEALED | CERAMIC, METAL-SEALED COFIRED | PLASTIC/EPOXY | PLASTIC/EPOXY | CERAMIC, METAL-SEALED COFIRED | PLASTIC/EPOXY |
封装代码 | DIP | DIP | QCCJ | QCCN | DIP | QCCJ | QCCJ | QCCJ | QCCN | DIP |
封装等效代码 | DIP40,.6 | DIP40,.6 | LDCC44,.7SQ | LCC44,.65SQ | DIP40,.6 | LDCC44,.7SQ | LDCC44,.7SQ | LDCC44,.7SQ | LCC44,.65SQ | DIP40,.6 |
封装形状 | RECTANGULAR | RECTANGULAR | SQUARE | SQUARE | RECTANGULAR | SQUARE | SQUARE | SQUARE | SQUARE | RECTANGULAR |
封装形式 | IN-LINE | IN-LINE | CHIP CARRIER | CHIP CARRIER | IN-LINE | CHIP CARRIER | CHIP CARRIER | CHIP CARRIER | CHIP CARRIER | IN-LINE |
电源 | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
可编程逻辑类型 | EE PLD | EE PLD | EE PLD | EE PLD | EE PLD | EE PLD | EE PLD | EE PLD | EE PLD | EE PLD |
传播延迟 | 25 ns | 30 ns | 30 ns | 30 ns | 25 ns | 25 ns | 25 ns | 25 ns | 25 ns | 25 ns |
认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
座面最大高度 | 5.59 mm | 5.72 mm | 4.57 mm | 2.74 mm | 5.72 mm | 4.57 mm | 4.57 mm | 4.57 mm | 2.74 mm | 5.59 mm |
最大供电电压 | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.25 V | 5.5 V | 5.25 V |
最小供电电压 | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.75 V | 4.5 V | 4.75 V |
标称供电电压 | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
表面贴装 | NO | NO | YES | YES | NO | YES | YES | YES | YES | NO |
技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
温度等级 | INDUSTRIAL | MILITARY | MILITARY | MILITARY | MILITARY | MILITARY | INDUSTRIAL | COMMERCIAL | MILITARY | COMMERCIAL |
端子面层 | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
端子形式 | THROUGH-HOLE | THROUGH-HOLE | J BEND | NO LEAD | THROUGH-HOLE | J BEND | J BEND | J BEND | NO LEAD | THROUGH-HOLE |
端子节距 | 2.54 mm | 2.54 mm | 1.27 mm | 1.27 mm | 2.54 mm | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm | 2.54 mm |
端子位置 | DUAL | DUAL | QUAD | QUAD | DUAL | QUAD | QUAD | QUAD | QUAD | DUAL |
宽度 | 15.24 mm | 15.24 mm | 16.65 mm | 16.55 mm | 15.24 mm | 16.65 mm | 16.5862 mm | 16.5862 mm | 16.55 mm | 15.24 mm |
厂商名称 | Atmel (Microchip) | - | - | - | - | Atmel (Microchip) | Atmel (Microchip) | Atmel (Microchip) | Atmel (Microchip) | Atmel (Microchip) |
峰值回流温度(摄氏度) | NOT SPECIFIED | NOT SPECIFIED | - | 240 | NOT SPECIFIED | 225 | 225 | 225 | 240 | NOT SPECIFIED |
处于峰值回流温度下的最长时间 | NOT SPECIFIED | NOT SPECIFIED | - | 30 | NOT SPECIFIED | 30 | 30 | 30 | 30 | NOT SPECIFIED |
ECCN代码 | - | 3A001.A.2.C | 3A001.A.2.C | 3A001.A.2.C | 3A001.A.2.C | 3A001.A.2.C | - | - | 3A001.A.2.C | - |
筛选级别 | - | MIL-STD-883 Class B | MIL-STD-883 Class B | MIL-STD-883 Class B | MIL-STD-883 Class B | MIL-STD-883 Class B | - | - | MIL-STD-883 Class B | - |