AXE1/AXE2
Narrow pitch connectors
(0.4mm pitch)
A4US
Series
3. “
”
ensures high resistance to various
environments in lieu of its space-
saving footprint.
Ni barrier
construction
(Against solder rise!)
FEATURES
1. Mated width: 2.2 mm and Mated
height: 0.8 mm, 1.0 mm and 1.5 mm
When mated, the footprint is reduced by
approx. 12% from A4S series (50 pin
contacts), contributing to the functionality
enhancement and size reduction of end
equipment.
Soldering terminals
at each corner
Suction face: 0.6mm*
2.
2m
m
New
Mated height 1.0mm and 1.5mm are added.
Bellows contact
construction
(Against dropping!)
Porosity treatment
ts
tac
on
c
)
Socket
1.
(Against corrosive gases!)
8m
m
Header
.5
12
mm
pin
(50
Mated height 0.8mm
2.
2m
m
Socket
Soldering terminals
at each corner
Suction face: 0.7mm*
V notch and Double contact constructions
(Against foreign particles and flux!)
Socket
Header
pin
(50
c
tac
on
ts)
RoHS compliant
1.
8m
m
.8
11
mm
4. Simple lock structure provides
tactile feedback to ensure excellent
mating/unmating operation feel.
5. Soldering terminals at each corner
enhance mounting strength.
6. Gull-wing-shaped terminals to
facilitate visual inspections.
APPLICATIONS
Suitable for board-to-FPC connections
in mobile equipment that requires size
and thickness reduction and
functionality enhancement.
* Suction face size for the 1.0 mm/1.5 mm mated
height type: Socket — 0.64 mm, Header — 0.76 mm
2. Improves degree of design freedom
(Mated height of 0.8 mm, 1.0 mm, or
1.5 mm with the same foot pattern)
AXE
1: Socket
2: Header
Number of pins (2 digits)
Mated height
<Socket>
1: 0.8 mm
2: 1.0 mm/1.5 mm
<Header>
1: 0.8 mm
2: 1.0 mm
3: 1.5 mm
Functions
2: Without positioning bosses
2
4
D
Surface treatment (Contact portion / Terminal portion)
<Socket>
4: Base: Ni plating, Surface: Au plating (for Ni barrier available)
<Header>
4: Base: Ni plating, Surface: Au plating
Package
D: Embossed packaging (4 mm pitch)
ACCTB4E 201204-T
Panasonic Corporation
Automation Controls Business Unit
industrial.panasonic.com/ac/e/
33
Information
ORDERING INFORMATION
MIPTEC
Header
FPC connectors
Micro coaxial connectors
Narrow-pitch connectors
For board-to-FPC
2.
2m
m
1.
8m
m
AXE1/AXE2
Narrow-pitch connectors
PRODUCT TYPES
Mated height
Number of pins
10
14
18
20
24
30
34
36
40
50
60
70
80
10
20
34
40
60
80
20
60
80
Part number
Socket
AXE110124D
AXE114124D
AXE118124D
AXE120124D
AXE124124D
AXE130124D
AXE134124D
AXE136124D
AXE140124D
AXE150124D
AXE160124D
AXE170124D
AXE180124D
AXE110224D
AXE120224D
AXE134224D
AXE140224D
AXE160224D
AXE180224D
AXE120224D
AXE160224D
AXE180224D
Header
AXE210124D
AXE214124D
AXE218124D
AXE220124D
AXE224124D
AXE230124D
AXE234124D
AXE236124D
AXE240124D
AXE250124D
AXE260124D
AXE270124D
AXE280124D
AXE210224D
AXE220224D
AXE234224D
AXE240224D
AXE260224D
AXE280224D
AXE220324D
AXE260324D
AXE280324D
Inner carton (1-reel)
Packing
Outer carton
0.8mm
Micro coaxial connectors
10,000 pieces
20,000 pieces
1.0mm
FPC connectors
1.5mm
Notes: 1. Order unit:
For volume production: 1-inner carton (1-reel) units
Samples for mounting check: 50-connector units. Please contact our sales office.
2. Please contact us for connectors having a number of pins other than those listed above.
SPECIFICATIONS
1. Characteristics
MIPTEC
Item
Rated current
Rated voltage
Electrical
characteristics
Breakdown voltage
Insulation resistance
Contact resistance
Composite insertion force
Composite removal force
Contact holding force
(Socket contact)
Ambient temperature
Soldering heat resistance
Storage temperature
Specifications
0.30A/pin contact (Max. 5 A at total pin contacts)
60V AC/DC
150V AC for 1 min.
Min. 1,000MΩ (initial)
Max. 90mΩ
Max. 0.981N/pin contacts
×
pin contacts (initial)
Min. 0.165N/pin contacts
×
pin contacts
Min. 0.20N/pin contacts
–55°C to +85°C
Peak temperature: 260°C or less (on the surface of
the PC board around the connector terminals)
300°C within 5 sec. 350°C within 3 sec.
–55°C to +85°C (product only)
–40°C to +50°C (emboss packing)
Measuring the maximum force.
As the contact is axially pull out.
No freezing at low temperatures. No dew condensation.
Infrared reflow soldering
Soldering iron
No freezing at low temperatures. No dew condensation.
Conformed to MIL-STD-202F, method 107G
Order Temperature (°C)
0
1
–55
−3
2
3
85
+3
0
4
0
–55
−3
Time (minutes)
30
Max. 5
30
Max. 5
Conditions
No short-circuiting or damage at a detection current of 1 mA
when the specified voltage is applied for one minute.
Using 250V DC megger (applied for 1 min.)
Based on the contact resistance measurement method
specified by JIS C 5402.
Mechanical
characteristics
Information
Environmental
characteristics
Thermal shock resistance
(header and socket mated)
5 cycles,
insulation resistance min. 100MΩ,
contact resistance max. 90mΩ
Humidity resistance
(header and socket mated)
Saltwater spray resistance
(header and socket mated)
H
2
S resistance
(header and socket mated)
Lifetime
characteristics
Unit weight
Insertion and removal life
120 hours, insulation resistance min. 100MΩ,
contact resistance max. 90mΩ
24 hours, insulation resistance min. 100MΩ,
contact resistance max. 90mΩ
48 hours, contact resistance max. 90mΩ
Bath temperature 40±2°C,
humidity 90 to 95% R.H.
Bath temperature 35±2°C,
saltwater concentration 5±1%
Bath temperature 40±2°C, gas concentration 3±1 ppm,
humidity 75 to 80% R.H.
Repeated insertion and removal speed of max. 200 times/
30 times
hours
60 pin contacts Socket (h = 0.8mm: 0.03g, h = 1.0/1.5mm: 0.04g)
Header (h = 0.8mm: 0.02g, h = 1.0mm: 0.02g, h = 1.5mm: 0.03g)
34
Panasonic Corporation
Automation Controls Business Unit
industrial.panasonic.com/ac/e/
ACCTB4E 201204-T
AXE1/AXE2
Part name
Molded
portion
Contact and
Post
Material
LCP resin
(UL94V-0)
Surface treatment
—
Contact portion: Base: Ni plating, Surface: Au plating
Terminal portion: Base: Ni plating, Surface: Au plating (except the terminal tips)
The socket terminals close to the portion to be soldered have nickel barriers (exposed nickel portions).
Soldering terminals: Sockets: Base: Ni plating, Surface: Pd+Au flash plating (except the terminal tips)
Headers: Base: Ni plating, Surface: Au plating (except the terminal tips)
Copper alloy
DIMENSIONS
(Unit: mm)
Socket (Mated height: 0.8 mm)
0.60 (Suction face)
A
B±0.1
0.40±0.05
0.15±0.03
1.90
Terminal coplanarity
0.77
0.08
(Contact and
soldering terminals)
Dimension table (mm)
Number of pins/
dimension
10
14
18
20
24
30
34
36
40
50
60
70
80
2.20
A
4.5
5.3
6.1
6.5
7.3
8.5
9.3
9.7
10.5
12.5
14.5
16.5
18.5
B
1.6
2.4
3.2
3.6
4.4
5.6
6.4
6.8
7.6
9.6
11.6
13.6
15.6
C
3.6
4.4
5.2
5.6
6.4
7.6
8.4
8.8
9.6
11.6
13.6
15.6
17.6
(0.80)
Y (Note)
0.30±0.03
C±0.1
1.24
Z (Note)
General tolerance:
±0.2
Note: Since soldering terminals are built into the body, the Y and Z parts are connected electrically.
Header (Mated height: 0.8 mm)
0.70 (Suction face)
1.28
A
B±0.1
0.40±0.05
0.15±0.03
Terminal coplanarity
0.65
0.08
(Post and
soldering terminals)
Number of pins/
dimension
10
14
18
20
24
30
34
36
40
50
60
70
80
A
3.8
4.6
5.4
5.8
6.6
7.8
8.6
9.0
9.8
11.8
13.8
15.8
17.8
B
1.6
2.4
3.2
3.6
4.4
5.6
6.4
6.8
7.6
9.6
11.6
13.6
15.6
C
3.2
4.0
4.8
5.2
6.0
7.2
8.0
8.4
9.2
11.2
13.2
15.2
17.2
Soldering terminals
0.15±0.03
C±0.1
(0.54)
(0.72)
1.80
(Soldering terminals portion)
General tolerance:
±0.2
ACCTB4E 201204-T
Panasonic Corporation
Automation Controls Business Unit
industrial.panasonic.com/ac/e/
35
Information
Dimension table (mm)
MIPTEC
FPC connectors
Micro coaxial connectors
Narrow-pitch connectors
2. Material and surface treatment
AXE1/AXE2
Narrow-pitch connectors
Socket (Mated height: 1.0 mm and 1.5 mm)
0.64
(Suction face)
A
B±0.1
0.40±0.05
0.15±0.03
1.96
Terminal coplanarity
0.97
0.08
(Contact and
soldering terminals)
Micro coaxial connectors
Dimension table (mm)
(0.80)
Y (Note)
2.20
Number of pins/
dimension
10
20
34
40
60
80
A
4.5
6.5
9.3
10.5
14.5
18.5
B
1.6
3.6
6.4
7.6
11.6
15.6
C
3.6
5.6
8.4
9.6
13.6
17.6
0.30±0.03
C±0.1
1.30
Z (Note)
General tolerance:
±0.2
Note: Since soldering terminals are built into the body, the Y and Z parts are connected electrically.
FPC connectors
Header (Mated height: 1.0 mm)
0.76
(Suction face)
A
B±0.1
0.40±0.05
0.15±0.03
Terminal coplanarity
0.85
0.08
(Post and
soldering terminals)
(0.515)
1.36
(0.77)
1.80
(Soldering terminals portion)
Dimension table (mm)
Number of pins/
dimension
10
20
34
40
60
80
A
3.8
5.8
8.6
9.8
13.8
17.8
B
1.6
3.6
6.4
7.6
11.6
15.6
C
3.2
5.2
8.0
9.2
13.2
17.2
Soldering terminals
MIPTEC
0.15±0.03
C±0.1
General tolerance:
±0.2
Header (Mated height: 1.5 mm)
Information
0.76
(Suction face)
A
B±0.1
0.40±0.05
0.15±0.03
Terminal coplanarity
1.35
0.08
(Post and
soldering terminals)
Soldering terminals
(0.50)
(0.80)
1.80
(Soldering terminals portion)
1.36
Dimension table (mm)
Number of pins/
dimension
20
60
80
A
5.8
13.8
17.8
B
3.6
11.6
15.6
C
5.2
13.2
17.2
0.15±0.03
C±0.1
General tolerance:
±0.2
Socket and Header are mated
0.80±0.1
1.00±0.1
1.50±0.1
Header
Socket
Header
Header
Socket
Socket
36
Panasonic Corporation
Automation Controls Business Unit
industrial.panasonic.com/ac/e/
ACCTB4E 201204-T
AXE1/AXE2
• Specifications for taping
(In accordance with JIS C 0806-3:1999. However, not applied to
the mounting-hole pitch of some connectors.)
Tape I
(A
+0.3
)
−0.1
(C)
(1.75)
(4.0)
• Specifications for the plastic reel
(In accordance with EIAJ ET-7200B.)
Tape II
(A±0.3)
(B)
(C)
(1.75)
(4.0)
380 dia.
(D±1)
Top cover tape
Embossed carrier tape
Leading direction after packaging
(2.0)
(2.0)
Embossed mounting-hole
Taping reel
1.
5
+0
0 .1
1.
a.
5
di
+0
0 .1
di
a
.
• Dimension table
(Unit: mm)
Type/Mated height
Common for sockets and headers:
0.8mm, 1.0mm and 1.5mm
Number of pins
Max. 24
30 to 60
70, 80
Type of taping
Tape I
Tape I
Tape II
A
16.0
24.0
32.0
B
—
—
28.4
C
7.5
11.5
14.2
D
17.4
25.4
33.4
Quantity per reel
• Connector orientation with respect to embossed tape feeding direction
Type
Direction
of tape progress
Socket
Common for A4US
Header
Note: There is no indication on this product regarding top-bottom or left-right orientation.
NOTES
1. Design of PC board patterns
Conduct the recommended foot pattern
design, in order to preserve the
mechanical strength of terminal solder
areas.
2. Recommended PC board and metal
mask patterns
Connectors are mounted with high pitch
density, intervals of 0.35 mm, 0.4 mm or
0.5 mm.
In order to reduce solder bridges and
other issues make sure the proper levels
of solder is used.
The figures to the right are recommended
metal mask patterns. Please use them as
a reference.
3. See the common “NOTES FOR
USE” on the next page for other points
to be noted.
• Socket (Mated height: 0.8 mm, 1.0
mm and 1.5 mm)
Recommended PC board pattern (TOP VIEW)
2.60±0.03
1.04±0.03
0.20±0.03
1.60±0.03
(0.78)
(0.50)
0.40±0.03
0.23±0.03
• Header (Mated height: 0.8 mm, 1.0
mm and 1.5 mm)
Recommended PC board pattern (TOP VIEW)
2.20±0.03
0.50±0.03
0.90±0.03
0.40±0.03
(0.85)
0.23±0.03
(0.65)
2.20±0.03
0.80±0.03
1.45±0.03
: Insulatin area
0.28±0.03
0.80±0.03
Recommended metal mask opening pattern
Metal mask thickness: When 120µm
(Terminal opening ratio: 70%)
(Metal-part opening ratio: 100%)
1.70±0.01
2.50±0.01
Recommended metal mask opening pattern
Metal mask thickness: When 120µm
(Terminal opening ratio: 70%)
(Metal-part opening ratio: 73%)
2.07±0.01
0.55±0.01
0.20±0.01
1.03±0.01
2.07±0.01
0.40±0.01
(0.76)
(0.52)
2.60±0.01
1.04±0.01
(0.78)
0.80±0.01
1.45±0.01
(0.40)
0.40±0.01
0.20±0.01
0.23±0.01
0.80±0.01
Regarding general notes, please refer
to page 166.
For other details, please verify with the
product specification sheets.
ACCTB4E 201204-T
Panasonic Corporation
Automation Controls Business Unit
industrial.panasonic.com/ac/e/
37
Information
MIPTEC
FPC connectors
10,000
10,000
10,000
Micro coaxial connectors
4.0
4.0
Narrow-pitch connectors
EMBOSSED TAPE DIMENSIONS
(Unit: mm)
C
0.
30
C
30
0.
