描述 |
USB Interface IC EZ USB FX2LP Battery App High COM |
Fixed Resistor, Metal Film, 0.2W, 402ohm, 150V, 0.05% +/-Tol, 50ppm/Cel, 1209, |
USB Interface IC USB HS Controller |
USB Interface IC EZ USB FX2LP LO PWR LO COM |
USB Interface IC EZ USB FX2LP LO PWR LO IND |
RESISTOR, METAL FILM, 2 W, 0.1 %, 25 ppm, 88700 ohm, THROUGH HOLE MOUNT, AXIAL LEADED |
USB Interface IC EZ USB FX2LP Battery PWR LO COM |
USB Interface IC USB HS Controller |
是否Rohs认证 |
- |
符合 |
符合 |
符合 |
符合 |
不符合 |
符合 |
符合 |
Reach Compliance Code |
- |
compliant |
compliant |
unknown |
unknown |
compliant |
unknown |
compliant |
ECCN代码 |
- |
EAR99 |
3A991.A.3 |
3A991.A.3 |
- |
EAR99 |
- |
3A991.A.3 |
JESD-609代码 |
- |
e3 |
e3 |
e3 |
e3 |
e0 |
e1 |
e3 |
端子数量 |
- |
2 |
56 |
56 |
56 |
2 |
56 |
56 |
最高工作温度 |
- |
125 °C |
70 °C |
70 °C |
105 °C |
230 °C |
70 °C |
70 °C |
封装形式 |
- |
SMT |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
Axial |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
技术 |
- |
METAL FILM |
CMOS |
CMOS |
CMOS |
METAL FILM |
CMOS |
CMOS |
端子面层 |
- |
Matte Tin (Sn) - with Nickel (Ni) barrier |
Matte Tin (Sn) |
Matte Tin (Sn) |
Matte Tin (Sn) |
Tin/Lead (Sn/Pb) |
Tin/Silver/Copper (Sn/Ag/Cu) |
Matte Tin (Sn) |
包装说明 |
- |
- |
HVQCCN, LCC56,.31SQ,20 |
QFN-56 |
HVQCCN, LCC56,.31SQ,20 |
Axial, |
VFBGA, BGA56,8X8,20 |
HVQCCN, LCC56,.31SQ,20 |
总线兼容性 |
- |
- |
I2C; UART; USB |
I2C; UART; USB |
I2C; UART; USB |
- |
I2C; UART; USB |
I2C; UART; USB |
最大时钟频率 |
- |
- |
24 MHz |
24 MHz |
24 MHz |
- |
24 MHz |
24 MHz |
最大数据传输速率 |
- |
- |
60 MBps |
60 MBps |
60 MBps |
- |
60 MBps |
60 MBps |
JESD-30 代码 |
- |
- |
S-XQCC-N56 |
S-XQCC-N56 |
S-XQCC-N56 |
- |
S-PBGA-B56 |
S-XQCC-N56 |
长度 |
- |
- |
8 mm |
8 mm |
8 mm |
- |
5 mm |
8 mm |
湿度敏感等级 |
- |
- |
3 |
3 |
3 |
- |
3 |
3 |
封装主体材料 |
- |
- |
UNSPECIFIED |
UNSPECIFIED |
UNSPECIFIED |
- |
PLASTIC/EPOXY |
UNSPECIFIED |
封装代码 |
- |
- |
HVQCCN |
HVQCCN |
HVQCCN |
- |
VFBGA |
HVQCCN |
封装等效代码 |
- |
- |
LCC56,.31SQ,20 |
LCC56,.31SQ,20 |
LCC56,.31SQ,20 |
- |
BGA56,8X8,20 |
LCC56,.31SQ,20 |
封装形状 |
- |
- |
SQUARE |
SQUARE |
SQUARE |
TUBULAR PACKAGE |
SQUARE |
SQUARE |
座面最大高度 |
- |
- |
1 mm |
1 mm |
1 mm |
- |
1 mm |
1 mm |
最大压摆率 |
- |
- |
85 mA |
85 mA |
85 mA |
- |
85 mA |
85 mA |
最大供电电压 |
- |
- |
3.6 V |
3.6 V |
3.6 V |
- |
3.6 V |
3.6 V |
最小供电电压 |
- |
- |
3 V |
3 V |
3 V |
- |
3 V |
3 V |
标称供电电压 |
- |
- |
3.3 V |
3.3 V |
3.3 V |
- |
3.3 V |
3.3 V |
表面贴装 |
- |
- |
YES |
YES |
YES |
NO |
YES |
YES |
温度等级 |
- |
- |
COMMERCIAL |
COMMERCIAL |
INDUSTRIAL |
- |
COMMERCIAL |
COMMERCIAL |
端子形式 |
- |
- |
NO LEAD |
NO LEAD |
NO LEAD |
- |
BALL |
NO LEAD |
端子节距 |
- |
- |
0.5 mm |
0.5 mm |
0.5 mm |
- |
0.5 mm |
0.5 mm |
端子位置 |
- |
- |
QUAD |
QUAD |
QUAD |
- |
BOTTOM |
QUAD |
宽度 |
- |
- |
8 mm |
8 mm |
8 mm |
- |
5 mm |
8 mm |
uPs/uCs/外围集成电路类型 |
- |
- |
BUS CONTROLLER, UNIVERSAL SERIAL BUS |
BUS CONTROLLER, UNIVERSAL SERIAL BUS |
BUS CONTROLLER, UNIVERSAL SERIAL BUS |
- |
BUS CONTROLLER, UNIVERSAL SERIAL BUS |
BUS CONTROLLER, UNIVERSAL SERIAL BUS |