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FDD10AN06A0-F085

MOSFET 60V, 50A, 10.5mOhm Power Trench MOSFET

器件类别:分立半导体    晶体管   

厂商名称:ON Semiconductor(安森美)

厂商官网:http://www.onsemi.cn

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器件参数
参数名称
属性值
Brand Name
ON Semiconductor
是否无铅
不含铅
厂商名称
ON Semiconductor(安森美)
包装说明
SMALL OUTLINE, R-PSSO-G2
制造商包装代码
369AS
Reach Compliance Code
not_compliant
Samacsys Description
MOSFET 60V, 50A, 10.5mOhm Power Trench MOSFET
雪崩能效等级(Eas)
429 mJ
外壳连接
DRAIN
配置
SINGLE WITH BUILT-IN DIODE
最小漏源击穿电压
60 V
最大漏极电流 (Abs) (ID)
50 A
最大漏极电流 (ID)
11 A
最大漏源导通电阻
0.0105 Ω
FET 技术
METAL-OXIDE SEMICONDUCTOR
JEDEC-95代码
TO-252AA
JESD-30 代码
R-PSSO-G2
JESD-609代码
e3
湿度敏感等级
1
元件数量
1
端子数量
2
工作模式
ENHANCEMENT MODE
最高工作温度
175 °C
封装主体材料
PLASTIC/EPOXY
封装形状
RECTANGULAR
封装形式
SMALL OUTLINE
峰值回流温度(摄氏度)
NOT SPECIFIED
极性/信道类型
N-CHANNEL
最大功率耗散 (Abs)
135 W
参考标准
AEC-Q101
表面贴装
YES
端子面层
Tin (Sn)
端子形式
GULL WING
端子位置
SINGLE
处于峰值回流温度下的最长时间
NOT SPECIFIED
晶体管应用
SWITCHING
晶体管元件材料
SILICON
文档预览
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www.onsemi.com
Please note: As part of the Fairchild Semiconductor integration, some of the Fairchild orderable part numbers
will need to change in order to meet ON Semiconductor’s system requirements. Since the ON Semiconductor
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www.onsemi.com.
Please
email any questions regarding the system integration to
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FDD10AN06A0_F085 N-Channel PowerTrench
®
MOSFET
Dec 2012
FDD10AN06A0_F085
N-Channel PowerTrench
®
MOSFET
60V, 50A, 10.5mΩ
Features
• r
DS(ON)
= 9.4mΩ (Typ.), V
GS
= 10V, I
D
= 50A
• Q
g
(tot) = 28nC (Typ.), V
GS
= 10V
• Low Miller Charge
• Low Qrr Body Diode
• UIS Capability (Single Pulse and Repetitive Pulse)
• Qualified to AEC Q101
• RoHS Compliant
Formerly developmental type 82560
Applications
• Motor / Body Load Control
• ABS Systems
• Powertrain Management
• Injection Systems
• DC-DC converters and Off-line UPS
• Distributed Power Architectures and VRMs
• Primary Switch for 12V and 24V systems
DRAIN
(FLANGE)
GATE
SOURCE
D
G
S
TO-252AA
FDD SERIES
MOSFET Maximum Ratings
T
C
= 25°C unless otherwise noted
Symbol
V
DSS
V
GS
Drain to Source Voltage
Gate to Source Voltage
Drain Current
I
D
Continuous (T
C
< 115
o
C, V
GS
= 10V)
Continuous (T
amb
= 25 C, V
GS
= 10V, with R
θJA
= 52 C/W)
Pulsed
E
AS
P
D
T
J
, T
STG
Single Pulse Avalanche Energy (Note 1)
Power dissipation
Derate above 25 C
Operating and Storage Temperature
o
o
o
Parameter
Ratings
60
±20
50
11
Figure 4
429
135
0.9
-55 to 175
Units
V
V
A
A
A
mJ
W
W/
o
C
o
C
Thermal Characteristics
R
θJC
R
θJA
R
θJA
Thermal Resistance Junction to Case TO-252
Thermal Resistance Junction to Ambient TO-252
Thermal Resistance Junction to Ambient TO-252, 1in
2
copper pad area
1.11
100
52
o
o
o
C/W
C/W
C/W
This product has been designed to meet the extreme test conditions and environment demanded by the automotive industry. For a
copy of the requirements, see AEC Q101 at: http://www.aecouncil.com/
Reliability data can be found at: http://www.fairchildsemi.com/products/discrete/reliability/index.html.
All Fairchild Semiconductor products are manufactured, assembled and tested under ISO9000 and QS9000 quality systems
certification.
©2012 Fairchild Semiconductor Corporation
FDD10AN06A0_F085 Rev. C1
FDD10AN06A0_F085 N-Channel PowerTrench
®
MOSFET
Package Marking and Ordering Information
Device Marking
FDD10AN06A0
Device
FDD10AN06A0_F085
Package
TO-252AA
Reel Size
330mm
Tape Width
16mm
Quantity
2500 units
Electrical Characteristics
T
C
= 25°C unless otherwise noted
Symbol
Parameter
Test Conditions
Min
Typ
Max
Units
Off Characteristics
B
VDSS
I
DSS
I
GSS
Drain to Source Breakdown Voltage
Zero Gate Voltage Drain Current
Gate to Source Leakage Current
I
D
= 250µA, V
GS
= 0V
V
DS
= 50V
V
GS
= 0V
V
GS
=
±20V
T
C
= 150 C
o
60
-
-
-
-
-
-
-
-
1
250
±100
V
µA
nA
On Characteristics
V
GS(TH)
r
DS(ON)
Gate to Source Threshold Voltage
Drain to Source On Resistance
V
GS
= V
DS
, I
D
= 250µA
I
D
= 50A, V
GS
= 10V
I
D
= 50A, V
GS
= 10V,
T
J
= 175
o
C
2
-
-
-
4
V
0.0094 0.0105
0.020
0.023
Dynamic Characteristics
C
ISS
C
OSS
C
RSS
Q
g(TOT)
Q
g(TH)
Q
gs
Q
gs2
Q
gd
Input Capacitance
Output Capacitance
Reverse Transfer Capacitance
Total Gate Charge at 10V
Threshold Gate Charge
Gate to Source Gate Charge
Gate Charge Threshold to Plateau
Gate to Drain “Miller” Charge
V
DS
= 25V, V
GS
= 0V,
f = 1MHz
V
GS
= 0V to 10V
V
GS
= 0V to 2V
V
DD
= 30V
I
D
= 50A
I
g
= 1.0mA
-
-
-
-
-
-
-
1840
340
110
28
3.5
9.8
6.4
7.8
-
-
-
37
4.6
-
-
-
pF
pF
pF
nC
nC
nC
nC
nC
Switching Characteristics
(V
GS
= 10V)
t
ON
t
d(ON)
t
r
t
d(OFF)
t
f
t
OFF
Turn-On Time
Turn-On Delay Time
Rise Time
Turn-Off Delay Time
Fall Time
Turn-Off Time
V
DD
= 30V, I
D
= 50A
V
GS
= 10V, R
GS
= 10Ω
-
-
-
-
-
-
-
8
79
32
32
-
131
-
-
-
-
97
ns
ns
ns
ns
ns
ns
Drain-Source Diode Characteristics
V
SD
t
rr
Q
RR
Source to Drain Diode Voltage
Reverse Recovery Time
Reverse Recovered Charge
I
SD
= 50A
I
SD
= 25A
I
SD
= 50A, dI
SD
/dt = 100A/µs
I
SD
= 50A, dI
SD
/dt = 100A/µs
-
-
-
-
-
-
-
-
1.25
1.0
27
23
V
V
ns
nC
Notes:
1:
Starting T
J
= 25°C, L = 8.58mH, I
AS
= 10A.
©2012 Fairchild Semiconductor Corporation
FDD10AN06A0_F085 Rev. C1
FDD10AN06A0_F085 N-Channel PowerTrench
®
MOSFET
Typical Characteristics
T
C
= 25°C unless otherwise noted
1.2
80
CURRENT LIMITED
BY PACKAGE
POWER DISSIPATION MULTIPLIER
1.0
I
D
, DRAIN CURRENT (A)
0
25
50
75
100
125
o
60
0.8
0.6
40
0.4
20
0.2
0
150
175
0
25
50
75
100
125
150
175
T
C
, CASE TEMPERATURE ( C)
T
C
, CASE TEMPERATURE (
o
C)
Figure 1. Normalized Power Dissipation vs
Ambient Temperature
2
1
DUTY CYCLE - DESCENDING ORDER
0.5
0.2
0.1
0.05
0.02
0.01
Figure 2. Maximum Continuous Drain Current vs
Case Temperature
Z
θJC
, NORMALIZED
THERMAL IMPEDANCE
P
DM
0.1
t
1
t
2
NOTES:
DUTY FACTOR: D = t
1
/t
2
PEAK T
J
= P
DM
x Z
θJC
x R
θJC
+ T
C
10
-3
10
-2
t , RECTANGULAR PULSE DURATION (s)
10
-1
10
0
10
1
SINGLE PULSE
0.01
10
-5
10
-4
Figure 3. Normalized Maximum Transient Thermal Impedance
1000
TRANSCONDUCTANCE
MAY LIMIT CURRENT
IN THIS REGION
T
C
= 25
o
C
FOR TEMPERATURES
ABOVE 25
o
C DERATE PEAK
CURRENT AS FOLLOWS:
I = I
25
V
GS
= 10V
175 - T
C
150
I
DM
, PEAK CURRENT (A)
100
40
10
-5
10
-4
10
-3
10
-2
t , PULSE WIDTH (s)
10
-1
10
0
10
1
Figure 4. Peak Current Capability
©2012 Fairchild Semiconductor Corporation
FDD10AN06A0_F085 Rev. C1
FDD10AN06A0_F085 N-Channel PowerTrench
®
MOSFET
Typical Characteristics
T
C
= 25°C unless otherwise noted
500
10µs
100
I
D
, DRAIN CURRENT (A)
100µs
I
AS
, AVALANCHE CURRENT (A)
100
500
If R = 0
t
AV
= (L)(I
AS
)/(1.3*RATED BV
DSS
- V
DD
)
If R
0
t
AV
= (L/R)ln[(I
AS
*R)/(1.3*RATED BV
DSS
- V
DD
) +1]
10
OPERATION IN THIS
AREA MAY BE
LIMITED BY r
DS(ON)
DC
1ms
10ms
STARTING T
J
= 25
o
C
10
1
SINGLE PULSE
T
J
= MAX RATED
T
C
= 25
o
C
0.1
1
10
V
DS
, DRAIN TO SOURCE VOLTAGE (V)
100
STARTING T
J
= 150
o
C
1
0.01
0.1
1
10
t
AV
, TIME IN AVALANCHE (ms)
Figure 5. Forward Bias Safe Operating Area
NOTE: Refer to Fairchild Application Notes AN7514 and AN7515
Figure 6. Unclamped Inductive Switching
Capability
100
100
PULSE DURATION = 80µs
DUTY CYCLE = 0.5% MAX
V
DD
= 15V
I
D
, DRAIN CURRENT (A)
I
D
, DRAIN CURRENT (A)
75
V
GS
= 10V
75
V
GS
= 7V
V
GS
= 6V
50
50
T
J
= 25
o
C
25
T
J
= 175
o
C
0
3
5
6
V
GS
, GATE TO SOURCE VOLTAGE (V)
4
7
T
J
= -55
o
C
25
T
C
= 25
o
C
0
0
0.5
1.0
1.5
V
GS
= 5V
PULSE DURATION = 80µs
DUTY CYCLE = 0.5% MAX
2.0
V
DS
, DRAIN TO SOURCE VOLTAGE (V)
Figure 7. Transfer Characteristics
18
DRAIN TO SOURCE ON RESISTANCE(mΩ)
NORMALIZED DRAIN TO SOURCE
ON RESISTANCE
PULSE DURATION = 80µs
DUTY CYCLE = 0.5% MAX
16
Figure 8. Saturation Characteristics
2.5
PULSE DURATION = 80µs
DUTY CYCLE = 0.5% MAX
2.0
14
V
GS
= 6V
1.5
12
V
GS
= 10V
10
1.0
V
GS
= 10V, I
D
= 50A
8
0
10
20
30
40
50
I
D
, DRAIN CURRENT (A)
0.5
-80
-40
0
40
80
120
160
T
J
, JUNCTION TEMPERATURE (
o
C)
200
Figure 9. Drain to Source On Resistance vs Drain
Current
Figure 10. Normalized Drain to Source On
Resistance vs Junction Temperature
©2012 Fairchild Semiconductor Corporation
FDD10AN06A0_F085 Rev. C1
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