型号
- 型号
- 关键词
| 型号 | HYB25D256800CT-5 | HYB25D256160CF-5 | HYB25D256400CT-7 | HYB25D256800CC-6 | HYB25D256800CF-5 | HYB25D256400CC-5 | HYB25D256400CE-5 |
|---|---|---|---|---|---|---|---|
| 描述 | DDR DRAM, 32MX8, 0.5ns, CMOS, PDSO66, PLASTIC, TSOP2-66 | DDR DRAM, 16MX16, 0.5ns, CMOS, PBGA60, 8 X 12 MM, GREEN, PLASTIC, TFBGA-60 | DDR DRAM, 64MX4, 0.75ns, CMOS, PDSO66, PLASTIC, TSOP2-66 | DDR DRAM, 32MX8, 0.7ns, CMOS, PBGA60, 8 X 12 MM, PLASTIC, TFBGA-60 | DDR DRAM, 32MX8, 0.5ns, CMOS, PBGA60, 8 X 12 MM, GREEN, PLASTIC, TFBGA-60 | DDR DRAM, 64MX4, 0.5ns, CMOS, PBGA60, 8 X 12 MM, PLASTIC, TFBGA-60 | DDR DRAM, 64MX4, 0.5ns, CMOS, PDSO66, PLASTIC, TSOP2-66 |
| 是否Rohs认证 | 不符合 | 符合 | 不符合 | 不符合 | 符合 | 不符合 | 符合 |
| 零件包装代码 | TSOP2 | BGA | TSOP2 | BGA | BGA | BGA | TSOP2 |
| 包装说明 | TSSOP, TSSOP66,.46 | TBGA, BGA60,8X12,40/32 | TSSOP, TSSOP66,.46 | TBGA, BGA60,9X12,40/32 | TBGA, BGA60,9X12,40/32 | TBGA, BGA60,9X12,40/32 | TSSOP, TSSOP66,.46 |
| 针数 | 66 | 60 | 66 | 60 | 60 | 60 | 66 |
| Reach Compliance Code | unknown | unknown | unknown | unknown | unknown | unknown | unknown |
| ECCN代码 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 |
| 访问模式 | FOUR BANK PAGE BURST | FOUR BANK PAGE BURST | FOUR BANK PAGE BURST | FOUR BANK PAGE BURST | FOUR BANK PAGE BURST | FOUR BANK PAGE BURST | FOUR BANK PAGE BURST |
| 最长访问时间 | 0.5 ns | 0.5 ns | 0.75 ns | 0.7 ns | 0.5 ns | 0.5 ns | 0.5 ns |
| 其他特性 | AUTO/SELF REFRESH | AUTO/SELF REFRESH | AUTO/SELF REFRESH | AUTO/SELF REFRESH | AUTO/SELF REFRESH | AUTO/SELF REFRESH | AUTO/SELF REFRESH |
| 最大时钟频率 (fCLK) | 200 MHz | 200 MHz | 133 MHz | 166 MHz | 200 MHz | 200 MHz | 200 MHz |
| I/O 类型 | COMMON | COMMON | COMMON | COMMON | COMMON | COMMON | COMMON |
| 交错的突发长度 | 2,4,8 | 2,4,8 | 2,4,8 | 2,4,8 | 2,4,8 | 2,4,8 | 2,4,8 |
| JESD-30 代码 | R-PDSO-G66 | R-PBGA-B60 | R-PDSO-G66 | R-PBGA-B60 | R-PBGA-B60 | R-PBGA-B60 | R-PDSO-G66 |
| 长度 | 22.22 mm | 12 mm | 22.22 mm | 12 mm | 12 mm | 12 mm | 22.22 mm |
| 内存密度 | 268435456 bit | 268435456 bit | 268435456 bit | 268435456 bit | 268435456 bit | 268435456 bit | 268435456 bit |
| 内存集成电路类型 | DDR DRAM | DDR DRAM | DDR DRAM | DDR DRAM | DDR DRAM | DDR DRAM | DDR DRAM |
| 内存宽度 | 8 | 16 | 4 | 8 | 8 | 4 | 4 |
| 功能数量 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
| 端口数量 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
| 端子数量 | 66 | 60 | 66 | 60 | 60 | 60 | 66 |
| 字数 | 33554432 words | 16777216 words | 67108864 words | 33554432 words | 33554432 words | 67108864 words | 67108864 words |
| 字数代码 | 32000000 | 16000000 | 64000000 | 32000000 | 32000000 | 64000000 | 64000000 |
| 工作模式 | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS |
| 最高工作温度 | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C |
| 组织 | 32MX8 | 16MX16 | 64MX4 | 32MX8 | 32MX8 | 64MX4 | 64MX4 |
| 输出特性 | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE |
| 封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| 封装代码 | TSSOP | TBGA | TSSOP | TBGA | TBGA | TBGA | TSSOP |
| 封装等效代码 | TSSOP66,.46 | BGA60,8X12,40/32 | TSSOP66,.46 | BGA60,9X12,40/32 | BGA60,9X12,40/32 | BGA60,9X12,40/32 | TSSOP66,.46 |
| 封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| 封装形式 | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | GRID ARRAY, THIN PROFILE | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | GRID ARRAY, THIN PROFILE | GRID ARRAY, THIN PROFILE | GRID ARRAY, THIN PROFILE | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
| 峰值回流温度（摄氏度） | 245 | 260 | 260 | 260 | 260 | 260 | 260 |
| 电源 | 2.6 V | 2.6 V | 2.5 V | 2.5 V | 2.6 V | 2.6 V | 2.6 V |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 刷新周期 | 8192 | 8192 | 8192 | 8192 | 8192 | 8192 | 8192 |
| 座面最大高度 | 1.2 mm | 1.2 mm | 1.2 mm | 1.2 mm | 1.2 mm | 1.2 mm | 1.2 mm |
| 自我刷新 | YES | YES | YES | YES | YES | YES | YES |
| 连续突发长度 | 2,4,8 | 2,4,8 | 2,4,8 | 2,4,8 | 2,4,8 | 2,4,8 | 2,4,8 |
| 最大待机电流 | 0.005 A | 0.005 A | 0.004 A | 0.005 A | 0.005 A | 0.005 A | 0.005 A |
| 最大压摆率 | 0.25 mA | 0.25 mA | 0.17 mA | 0.215 mA | 0.25 mA | 0.25 mA | 0.25 mA |
| 最大供电电压 (Vsup) | 2.7 V | 2.7 V | 2.7 V | 2.7 V | 2.7 V | 2.7 V | 2.7 V |
| 最小供电电压 (Vsup) | 2.5 V | 2.5 V | 2.3 V | 2.3 V | 2.5 V | 2.5 V | 2.5 V |
| 标称供电电压 (Vsup) | 2.6 V | 2.6 V | 2.5 V | 2.5 V | 2.6 V | 2.6 V | 2.6 V |
| 表面贴装 | YES | YES | YES | YES | YES | YES | YES |
| 技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
| 温度等级 | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL |
| 端子形式 | GULL WING | BALL | GULL WING | BALL | BALL | BALL | GULL WING |
| 端子节距 | 0.65 mm | 1 mm | 0.65 mm | 1 mm | 1 mm | 1 mm | 0.65 mm |
| 端子位置 | DUAL | BOTTOM | DUAL | BOTTOM | BOTTOM | BOTTOM | DUAL |
| 处于峰值回流温度下的最长时间 | 20 | 40 | 40 | 40 | 40 | 40 | 40 |
| 宽度 | 10.16 mm | 8 mm | 10.16 mm | 8 mm | 8 mm | 8 mm | 10.16 mm |
| Base Number Matches | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
| JESD-609代码 | e0 | - | e0 | e0 | - | e0 | e3 |
| 湿度敏感等级 | 1 | 3 | 1 | 3 | 3 | 3 | - |
| 端子面层 | Tin/Lead (Sn/Pb) | - | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | - | Tin/Lead (Sn/Pb) | Matte Tin (Sn) |