IDT71V67603S150PFI8,IDT71V67603S150PFI8 pdf中文资料,IDT71V67603S150PFI8引脚图,IDT71V67603S150PFI8电路-Datasheet-电子工程世界

器件参数

参数名称

属性值

是否Rohs认证

不符合

厂商名称

IDT (Integrated Device Technology)

零件包装代码

QFP

包装说明

14 X 20 MM, 1.40 MM HEIGHT, PLASTIC, TQFP-100

针数

100

Reach Compliance Code

not_compliant

ECCN代码

3A991.B.2.A

最长访问时间

3.8 ns

其他特性

PIPELINED ARCHITECTURE

最大时钟频率 (fCLK)

150 MHz

I/O 类型

COMMON

JESD-30 代码

R-PQFP-G100

JESD-609代码

长度

20 mm

内存密度

9437184 bit

内存集成电路类型

CACHE SRAM

内存宽度

湿度敏感等级

功能数量

端子数量

100

字数

262144 words

字数代码

256000

工作模式

SYNCHRONOUS

最高工作温度

85 °C

最低工作温度

-40 °C

组织

256KX36

输出特性

3-STATE

封装主体材料

PLASTIC/EPOXY

封装代码

LQFP

封装等效代码

QFP100,.63X.87

封装形状

RECTANGULAR

封装形式

FLATPACK, LOW PROFILE

并行/串行

PARALLEL

峰值回流温度（摄氏度）

240

电源

3.3 V

认证状态

Not Qualified

座面最大高度

1.6 mm

最大待机电流

0.07 A

最小待机电流

3.14 V

最大压摆率

0.325 mA

最大供电电压 (Vsup)

3.465 V

最小供电电压 (Vsup)

3.135 V

标称供电电压 (Vsup)

3.3 V

表面贴装

YES

技术

CMOS

温度等级

INDUSTRIAL

端子面层

Tin/Lead (Sn85Pb15)

端子形式

GULL WING

端子节距

0.65 mm

端子位置

QUAD

处于峰值回流温度下的最长时间

宽度

14 mm

Base Number Matches

参数对比

与IDT71V67603S150PFI8相近的元器件有：IDT71V67803S166PFG8、IDT71V67803S166PF8、IDT71V67603S166PFG8、IDT71V67603S166PF8、IDT71V67803S150PFGI8、IDT71V67603S150PF8、IDT71V67603S150PFG8、IDT71V67603S150PFGI8、IDT71V67803S150PFG8。描述及对比如下：

型号	IDT71V67603S150PFI8	IDT71V67803S166PFG8	IDT71V67803S166PF8	IDT71V67603S166PFG8	IDT71V67603S166PF8	IDT71V67803S150PFGI8	IDT71V67603S150PF8	IDT71V67603S150PFG8	IDT71V67603S150PFGI8	IDT71V67803S150PFG8
描述	Cache SRAM, 256KX36, 3.8ns, CMOS, PQFP100, 14 X 20 MM, 1.40 MM HEIGHT, PLASTIC, TQFP-100	Cache SRAM, 512KX18, 3.5ns, CMOS, PQFP100, 14 X 20 MM, 1.40 MM HEIGHT, PLASTIC, TQFP-100	Cache SRAM, 512KX18, 3.5ns, CMOS, PQFP100, 14 X 20 MM, 1.40 MM HEIGHT, PLASTIC, TQFP-100	Cache SRAM, 256KX36, 3.5ns, CMOS, PQFP100, 14 X 20 MM, 1.40 MM HEIGHT, GREEN, PLASTIC, TQFP-100	Cache SRAM, 256KX36, 3.5ns, CMOS, PQFP100, 14 X 20 MM, 1.40 MM HEIGHT, PLASTIC, TQFP-100	Cache SRAM, 512KX18, 3.8ns, CMOS, PQFP100, 14 X 20 MM, 1.40 MM HEIGHT, PLASTIC, TQFP-100	Cache SRAM, 256KX36, 3.8ns, CMOS, PQFP100, 14 X 20 MM, 1.40 MM HEIGHT, PLASTIC, TQFP-100	Cache SRAM, 256KX36, 3.8ns, CMOS, PQFP100, 14 X 20 MM, 1.40 MM HEIGHT, PLASTIC, TQFP-100	Cache SRAM, 256KX36, 3.8ns, CMOS, PQFP100, 14 X 20 MM, 1.40 MM HEIGHT, GREEN, PLASTIC, TQFP-100	Cache SRAM, 512KX18, 3.8ns, CMOS, PQFP100, 14 X 20 MM, 1.40 MM HEIGHT, PLASTIC, TQFP-100
是否Rohs认证	不符合	符合	不符合	符合	不符合	符合	不符合	符合	符合	符合
零件包装代码	QFP	QFP	QFP	QFP	QFP	QFP	QFP	QFP	QFP	QFP
包装说明	14 X 20 MM, 1.40 MM HEIGHT, PLASTIC, TQFP-100	LQFP, QFP100,.63X.87	14 X 20 MM, 1.40 MM HEIGHT, PLASTIC, TQFP-100	LQFP,	LQFP,	LQFP, QFP100,.63X.87	14 X 20 MM, 1.40 MM HEIGHT, PLASTIC, TQFP-100	LQFP, QFP100,.63X.87	LQFP,	LQFP, QFP100,.63X.87
针数	100	100	100	100	100	100	100	100	100	100
Reach Compliance Code	not_compliant	compliant	not_compliant	compliant	compliant	compliant	not_compliant	compliant	compliant	compliant
ECCN代码	3A991.B.2.A	3A991.B.2.A	3A991.B.2.A	3A991.B.2.A	3A991.B.2.A	3A991.B.2.A	3A991.B.2.A	3A991.B.2.A	3A991.B.2.A	3A991.B.2.A
最长访问时间	3.8 ns	3.5 ns	3.5 ns	3.5 ns	3.5 ns	3.8 ns	3.8 ns	3.8 ns	3.8 ns	3.8 ns
其他特性	PIPELINED ARCHITECTURE	PIPELINED ARCHITECTURE	PIPELINED ARCHITECTURE	PIPELINED ARCHITECTURE	PIPELINED ARCHITECTURE	PIPELINED ARCHITECTURE	PIPELINED ARCHITECTURE	PIPELINED ARCHITECTURE	PIPELINED ARCHITECTURE	PIPELINED ARCHITECTURE
JESD-30 代码	R-PQFP-G100	R-PQFP-G100	R-PQFP-G100	R-PQFP-G100	R-PQFP-G100	R-PQFP-G100	R-PQFP-G100	R-PQFP-G100	R-PQFP-G100	R-PQFP-G100
JESD-609代码	e0	e3	e0	e3	e0	e3	e0	e3	e3	e3
长度	20 mm	20 mm	20 mm	20 mm	20 mm	20 mm	20 mm	20 mm	20 mm	20 mm
内存密度	9437184 bit	9437184 bit	9437184 bit	9437184 bit	9437184 bit	9437184 bit	9437184 bit	9437184 bit	9437184 bit	9437184 bit
内存集成电路类型	CACHE SRAM	CACHE SRAM	CACHE SRAM	CACHE SRAM	CACHE SRAM	CACHE SRAM	CACHE SRAM	CACHE SRAM	CACHE SRAM	CACHE SRAM
内存宽度	36	18	18	36	36	18	36	36	36	18
湿度敏感等级	3	3	3	3	3	3	3	3	3	3
功能数量	1	1	1	1	1	1	1	1	1	1
端子数量	100	100	100	100	100	100	100	100	100	100
字数	262144 words	524288 words	524288 words	262144 words	262144 words	524288 words	262144 words	262144 words	262144 words	524288 words
字数代码	256000	512000	512000	256000	256000	512000	256000	256000	256000	512000
工作模式	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS
最高工作温度	85 °C	70 °C	70 °C	70 °C	70 °C	85 °C	70 °C	70 °C	85 °C	70 °C
组织	256KX36	512KX18	512KX18	256KX36	256KX36	512KX18	256KX36	256KX36	256KX36	512KX18
封装主体材料	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY
封装代码	LQFP	LQFP	LQFP	LQFP	LQFP	LQFP	LQFP	LQFP	LQFP	LQFP
封装形状	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR
封装形式	FLATPACK, LOW PROFILE	FLATPACK, LOW PROFILE	FLATPACK, LOW PROFILE	FLATPACK, LOW PROFILE	FLATPACK, LOW PROFILE	FLATPACK, LOW PROFILE	FLATPACK, LOW PROFILE	FLATPACK, LOW PROFILE	FLATPACK, LOW PROFILE	FLATPACK, LOW PROFILE
并行/串行	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL
峰值回流温度（摄氏度）	240	260	240	260	240	260	240	260	260	260
认证状态	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified
座面最大高度	1.6 mm	1.6 mm	1.6 mm	1.6 mm	1.6 mm	1.6 mm	1.6 mm	1.6 mm	1.6 mm	1.6 mm
最大供电电压 (Vsup)	3.465 V	3.465 V	3.465 V	3.465 V	3.465 V	3.465 V	3.465 V	3.465 V	3.465 V	3.465 V
最小供电电压 (Vsup)	3.135 V	3.135 V	3.135 V	3.135 V	3.135 V	3.135 V	3.135 V	3.135 V	3.135 V	3.135 V
标称供电电压 (Vsup)	3.3 V	3.3 V	3.3 V	3.3 V	3.3 V	3.3 V	3.3 V	3.3 V	3.3 V	3.3 V
表面贴装	YES	YES	YES	YES	YES	YES	YES	YES	YES	YES
技术	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS
温度等级	INDUSTRIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	INDUSTRIAL	COMMERCIAL	COMMERCIAL	INDUSTRIAL	COMMERCIAL
端子面层	Tin/Lead (Sn85Pb15)	Matte Tin (Sn) - annealed	Tin/Lead (Sn85Pb15)	MATTE TIN	TIN LEAD	Matte Tin (Sn) - annealed	Tin/Lead (Sn85Pb15)	Matte Tin (Sn) - annealed	MATTE TIN	Matte Tin (Sn) - annealed
端子形式	GULL WING	GULL WING	GULL WING	GULL WING	GULL WING	GULL WING	GULL WING	GULL WING	GULL WING	GULL WING
端子节距	0.65 mm	0.65 mm	0.65 mm	0.65 mm	0.65 mm	0.65 mm	0.65 mm	0.65 mm	0.65 mm	0.65 mm
端子位置	QUAD	QUAD	QUAD	QUAD	QUAD	QUAD	QUAD	QUAD	QUAD	QUAD
处于峰值回流温度下的最长时间	20	30	20	30	20	30	20	30	30	30
宽度	14 mm	14 mm	14 mm	14 mm	14 mm	14 mm	14 mm	14 mm	14 mm	14 mm
厂商名称	IDT (Integrated Device Technology)	IDT (Integrated Device Technology)	IDT (Integrated Device Technology)	IDT (Integrated Device Technology)	IDT (Integrated Device Technology)	IDT (Integrated Device Technology)	-	IDT (Integrated Device Technology)	IDT (Integrated Device Technology)	IDT (Integrated Device Technology)
最大时钟频率 (fCLK)	150 MHz	166 MHz	166 MHz	-	-	150 MHz	150 MHz	150 MHz	-	150 MHz
I/O 类型	COMMON	COMMON	COMMON	-	-	COMMON	COMMON	COMMON	-	COMMON
输出特性	3-STATE	3-STATE	3-STATE	-	-	3-STATE	3-STATE	3-STATE	-	3-STATE
封装等效代码	QFP100,.63X.87	QFP100,.63X.87	QFP100,.63X.87	-	-	QFP100,.63X.87	QFP100,.63X.87	QFP100,.63X.87	-	QFP100,.63X.87
电源	3.3 V	3.3 V	3.3 V	-	-	3.3 V	3.3 V	3.3 V	-	3.3 V
最大待机电流	0.07 A	0.05 A	0.05 A	-	-	0.07 A	0.05 A	0.05 A	-	0.05 A
最小待机电流	3.14 V	3.14 V	3.14 V	-	-	3.14 V	3.14 V	3.14 V	-	3.14 V
最大压摆率	0.325 mA	0.34 mA	0.34 mA	-	-	0.325 mA	0.305 mA	0.305 mA	-	0.305 mA
Base Number Matches	1	1	1	1	1	1	1	-	-	-
是否无铅	-	不含铅	-	不含铅	-	不含铅	-	不含铅	不含铅	不含铅