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INMP441ACEZ-R0

描述：
MEMS麦克风 Omnidirectional Microphone with Bottom Port and I S Digital Output
分类：
传感器    音频传感器    MEMS麦克风   
文件大小：
347KB，共15页
制造商：
TDK(株式会社)
厂商官网：
http://www.tdk.com
标准：
概述
MEMS麦克风 Omnidirectional Microphone with Bottom Port and I S Digital Output
器件参数
参数名称
属性值
厂商名称
TDK(株式会社)
产品种类
MEMS麦克风
灵敏度
- 26 dB
SNR – 信噪比
61 dB
频率范围
60 Hz to 15 kHz
工作电源电流
2.2 mA
工作电源电压
3.3 V
最小工作温度
- 40 C
最大工作温度
+ 85 C
输出类型
Digital
端口类型
Bottom
长度
4.72 mm
宽度
3.76 mm
深度
1 mm
封装
Cut Tape
封装
Reel
方向性
Omnidirectional
封装 / 箱体
LGA-9
声压级
160 dB
端接类型
SMD/SMT
类型
Omnidirectional Microphone
安装风格
SMD/SMT
形状
Rectangular
工厂包装数量
4500
电源电压-最大
3.63 V
电源电压-最小
1.62 V
文档预览
INMP401
Omnidirectional Microphone with Bottom Port and Analog Output
The INMP401 is a high-quality, high-performance, low-
power, analog-output bottom-ported omnidirectional MEMS
microphone. The INMP401 consists of a MEMS microphone
element, an impedance converter, and an output amplifier.
The INMP401 sensitivity specification makes it an excellent
choice for near-field applications. The INMP401 has a
wideband frequency response, resulting in natural sound with
high intelligibility. The specially designed low frequency cutoff
reduces wind noise. Its low current consumption enables long
battery life for portable applications.
The INMP401 complies with the TIA-920
Telecommunications
Telephone Terminal Equipment Transmission Requirements
for Wideband Digital Wireline Telephones
standard.
The INMP401 is available in a 4.72 × 3.76 × 1.00 mm surface-
mount package. It is reflow solder compatible with no
sensitivity degradation. The INMP401 is halide free.
*Protected by U.S. Patents 7,449,356; 7,825,484; 7,885,423; and 7,961,897.
Other patents are pending.
GENERAL DESCRIPTION
*
APPLICATIONS
•
•
•
•
•
Mobile Devices
Teleconferencing Systems
Headsets
Security Panels
Intercom Devices
FEATURES
•
•
•
•
•
•
•
•
•
4.72 × 3.76 × 1.00 mm Surface-Mount Package
SNR of 62 dBA
Sensitivity
of −42
dBV
Flat Frequency Response from 60 Hz to 15 kHz
Low Current Consumption: <250 µA
Single-Ended Analog Output
High PSR of 70 dB
Compatible with Sn/Pb and Pb-Free Solder Processes
RoHS/WEEE Compliant
FUNCTIONAL BLOCK DIAGRAM
ORDERING INFORMATION
PART
TEMP RANGE
−40°C to +85°C
−40°C to +85°C
—
—
INMP401ACEZ-R0*
INMP401ACEZ-R7†
EV_INMP401
EV_INMP401-FX
OUTPUT
AMPLIFIER
OUTPUT
* – 13” Tape and Reel
INMP401
POWER
† – 7” Tape and reel to be discontinued. Contact
sales@invensense.com
for availability.
VDD
GND
InvenSense reserves the right to change the detail
specifications as may be required to permit
improvements in the design of its products.
InvenSense Inc.
1745 Technology Drive, San Jose, CA 95110 U.S.A
+1(408) 988–7339
www.invensense.com
Document Number: DS-INMP401-00
Revision: 1.1
Rev Date: 05/21/2014
INMP401
TABLE OF CONTENTS
General Description ................................................................................................................................................. 1
Applications ............................................................................................................................................................. 1
Features ................................................................................................................................................................... 1
Functional Block Diagram ........................................................................................................................................ 1
Ordering Information ............................................................................................................................................... 1
Table of Contents ............................................................................................................................................................ 2
Specifications .................................................................................................................................................................. 3
Table 1. Electrical Characteristics ............................................................................................................................ 3
Absolute Maximum Ratings ............................................................................................................................................ 4
Table 2. Absolute Maximum Ratings ....................................................................................................................... 4
ESD Caution ............................................................................................................................................................. 4
Soldering Profile....................................................................................................................................................... 5
Table 3. Recommended Soldering Profile*.............................................................................................................. 5
Pin Configurations And Function Descriptions ............................................................................................................... 6
Table 4. Pin Function Descriptions........................................................................................................................... 6
Typical Performance Characteristics............................................................................................................................... 7
Applications Information ................................................................................................................................................ 8
Connecting To Audio Codecs ................................................................................................................................... 8
Supporting Documents ................................................................................................................................................... 9
Evaluation Board User Guide ................................................................................................................................... 9
application Notes (product specific) ........................................................................................................................ 9
Application Notes (general) ..................................................................................................................................... 9
PCB Design And Land Pattern Layout ........................................................................................................................... 10
Handling Instructions .................................................................................................................................................... 11
Pick And Place Equipment ..................................................................................................................................... 11
Reflow Solder ......................................................................................................................................................... 11
Board Wash............................................................................................................................................................ 11
Outline Dimensions ....................................................................................................................................................... 12
Ordering Guide ...................................................................................................................................................... 13
Revision History ..................................................................................................................................................... 13
Compliance Declaration Disclaimer ....................................................................................................................... 14
Document Number: DS-INMP401-00
Revision: 1.1
Page 2 of 14
INMP401
SPECIFICATIONS
(T
A
= −40 to 85°C, V
DD
= 1.5 to 3.3 V, unless otherwise noted. All minimum and maximum specifications are guaranteed across
temperature and voltage, and are specified in Table 1, unless otherwise noted. Typical specifications are not guaranteed.)
PARAMETER
PERFORMANCE
Directionality
Sensitivity
Signal-to-Noise Ratio (SNR)
Equivalent Input Noise (EIN)
Dynamic Range
Frequency Response
Total Harmonic Distortion (THD)
Power-Supply Rejection (PSR)
Maximum Acoustic Input
POWER SUPPLY
Supply Voltage (V
DD
)
Supply Current (I
S
)
OUTPUT CHARACTERISTICS
Output Impedance (Z
OUT
)
Output DC Offset
Output Current Limit
Note 1:
See Figure 3 and Figure 4.
TABLE 1. ELECTRICAL CHARACTERISTICS
CONDITIONS
MIN
TYP
Omni
−42
62
32
MAX
UNITS
NOTES
1 kHz, 94 dB SPL
−45
−39
dBV
dBA
dBA SPL
dB
Hz
kHz
%
dBV
dB SPL
1
Derived from EIN and
maximum acoustic input
Low frequency
−3
dB point
High frequency
−3
dB point
105 dB SPL
217 Hz, 100 mVp-p square
wave superimposed on VDD
= 1.8 V
Peak
1.5
88
60
15
3
−70
120
3.3
250
200
0.8
90
V
µA
Ω
V
µA
Document Number: DS-INMP401-00
Revision: 1.1
Page 3 of 14
INMP401
ABSOLUTE MAXIMUM RATINGS
Stress above those listed as Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only
and functional operation of the device at these conditions is not implied. Exposure to the absolute maximum ratings conditions for
extended periods may affect device reliability.
TABLE 2. ABSOLUTE MAXIMUM RATINGS
PARAMETER
Supply Voltage (VDD)
Sound Pressure Level (SPL)
Mechanical Shock
Vibration
Temperature Range
RATING
−0.3
V to +3.6 V
160 dB
10,000
g
Per MIL-STD-883 Method 2007, Test Condition B
−40°C to +85°C
ESD CAUTION
ESD (electrostatic discharge) sensitive device.
Charged devices and circuit boards can
discharge without detection. Although this
product features patented or proprietary
protection circuitry, damage may occur on
devices subjected to high energy ESD.
Therefore proper ESD precautions should be
taken to avoid performance degradation or
loss of functionality.
Document Number: DS-INMP401-00
Revision: 1.1
Page 4 of 14
INMP401
SOLDERING PROFILE
T
P
RAMP-UP
TEMPERATURE
t
P
CRITICAL ZONE
T
L
TO T
P
T
L
T
SMAX
T
SMIN
t
L
t
S
PREHEAT
RAMP-DOWN
t
25°C
TO PEAK
TIME
Figure 1. Recommended Soldering Profile Limits
TABLE 3. RECOMMENDED SOLDERING PROFILE*
PROFILE FEATURE
Average Ramp Rate (T
L
to T
P
)
Minimum Temperature
(T
SMIN
)
Minimum Temperature
(T
SMIN
)
Time (T
SMIN
to T
SMAX
), t
S
Sn63/Pb37
1.25°C/sec
max
100°C
150°C
60 sec to 75 sec
1.25°C/sec
45 sec to 75 sec
183°C
215°C +3°C/−3°C
20 sec to 30 sec
3°C/sec
max
5 min max
Pb-Free
1.25°C/sec
max
100°C
200°C
60 sec to 75 sec
1.25°C/sec
~50 sec
217°C
245°C
+0°C/−5°C
20 sec to 30 sec
3°C/sec
max
5 min max
Preheat
Ramp-Up Rate (T
SMAX
to T
L
)
Time Maintained Above Liquidous (t
L
)
Liquidous Temperature (T
L
)
Peak Temperature (T
P
)
Time Within +5°C of Actual Peak
Temperature (t
P
)
Ramp-Down Rate
Time +25°C (t
25°C
) to Peak Temperature
Note:
*The reflow profile in Table 3 is recommended for board manufacturing with InvenSense MEMS microphones. All
microphones are also compatible with the J-STD-020 profile.
Document Number: DS-INMP401-00
Revision: 1.1
Page 5 of 14
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参数对比
与INMP441ACEZ-R0相近的元器件有：INMP421BCEZ-R0。描述及对比如下：
型号 INMP441ACEZ-R0 INMP421BCEZ-R0
描述 MEMS麦克风 Omnidirectional Microphone with Bottom Port and I S Digital Output MEMS麦克风 Omnidirectional Microphone with Bottom Port and PDM Digital Output
厂商名称 TDK(株式会社) TDK(株式会社)
产品种类 MEMS麦克风 MEMS麦克风
灵敏度 - 26 dB - 26 dB
SNR – 信噪比 61 dB 61 dB
频率范围 60 Hz to 15 kHz 100 Hz to 15 kHz
工作电源电流 2.2 mA 650 uA
工作电源电压 3.3 V 1.8 V
最小工作温度 - 40 C - 40 C
最大工作温度 + 85 C + 85 C
输出类型 Digital Digital
端口类型 Bottom Bottom
长度 4.72 mm 4 mm
宽度 3.76 mm 3 mm
深度 1 mm 1 mm
方向性 Omnidirectional Omnidirectional
封装 / 箱体 LGA-9 LGA-5
声压级 160 dB 160 dB
端接类型 SMD/SMT SMD/SMT
类型 Omnidirectional Microphone Omnidirectional Microphone
安装风格 SMD/SMT SMD/SMT
形状 Rectangular Rectangular
工厂包装数量 4500 5000
电源电压-最大 3.63 V 3.63 V
电源电压-最小 1.62 V 1.62 V
封装 Reel Reel
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