HC/UH SERIES, PRESCALER, CDIP16, FRIT SEALED, CERAMIC, DIP-16
厂商名称:ST(意法半导体)
厂商官网:http://www.st.com/
下载文档型号 | M74HC294F1 | M74HC292B1N | M74HC292C1 | M74HC292F1 | M74HC292M1 | M74HC294B1N | M74HC294M1 | M74HC294C1 | M54HC292F1 | M54HC294F1 |
---|---|---|---|---|---|---|---|---|---|---|
描述 | HC/UH SERIES, PRESCALER, CDIP16, FRIT SEALED, CERAMIC, DIP-16 | HC/UH SERIES, PRESCALER, PDIP16, PLASTIC, DIP-16 | HC/UH SERIES, PRESCALER, PQCC20, PLASTIC, LCC-20 | HC/UH SERIES, PRESCALER, CDIP16, FRIT SEALED, CERAMIC, DIP-16 | HC/UH SERIES, PRESCALER, PDSO16, MICRO, PLASTIC, SOP-16 | HC/UH SERIES, PRESCALER, PDIP16, PLASTIC, DIP-16 | HC/UH SERIES, PRESCALER, PDSO16, MICRO, PLASTIC, SOP-16 | HC/UH SERIES, PRESCALER, PQCC20, PLASTIC, LCC-20 | HC/UH SERIES, PRESCALER, CDIP16, FRIT SEALED, CERAMIC, DIP-16 | HC/UH SERIES, PRESCALER, CDIP16, FRIT SEALED, CERAMIC, DIP-16 |
是否Rohs认证 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 |
厂商名称 | ST(意法半导体) | ST(意法半导体) | ST(意法半导体) | ST(意法半导体) | ST(意法半导体) | ST(意法半导体) | ST(意法半导体) | ST(意法半导体) | ST(意法半导体) | ST(意法半导体) |
零件包装代码 | DIP | DIP | QLCC | DIP | SOIC | DIP | SOIC | QLCC | DIP | DIP |
包装说明 | FRIT SEALED, CERAMIC, DIP-16 | PLASTIC, DIP-16 | PLASTIC, LCC-20 | FRIT SEALED, CERAMIC, DIP-16 | MICRO, PLASTIC, SOP-16 | PLASTIC, DIP-16 | MICRO, PLASTIC, SOP-16 | PLASTIC, LCC-20 | FRIT SEALED, CERAMIC, DIP-16 | FRIT SEALED, CERAMIC, DIP-16 |
针数 | 16 | 16 | 20 | 16 | 16 | 16 | 16 | 20 | 16 | 16 |
Reach Compliance Code | not_compliant | not_compliant | not_compliant | not_compliant | not_compliant | not_compliant | not_compliant | not_compliant | not_compliant | not_compliant |
系列 | HC/UH | HC/UH | HC/UH | HC/UH | HC/UH | HC/UH | HC/UH | HC/UH | HC/UH | HC/UH |
JESD-30 代码 | R-GDIP-T16 | R-PDIP-T16 | S-PQCC-J20 | R-GDIP-T16 | R-PDSO-G16 | R-PDIP-T16 | R-PDSO-G16 | S-PQCC-J20 | R-GDIP-T16 | R-GDIP-T16 |
JESD-609代码 | e0 | e0 | e0 | e0 | e0 | e0 | e0 | e0 | e0 | e0 |
逻辑集成电路类型 | PRESCALER | PRESCALER | PRESCALER | PRESCALER | PRESCALER | PRESCALER | PRESCALER | PRESCALER | PRESCALER | PRESCALER |
最大频率@ Nom-Sup | 26000000 Hz | 20000000 Hz | 20000000 Hz | 20000000 Hz | 20000000 Hz | 26000000 Hz | 26000000 Hz | 26000000 Hz | 17000000 Hz | 21000000 Hz |
数据/时钟输入次数 | 2 | 2 | 2 | 2 | 2 | 2 | 2 | 2 | 2 | 2 |
功能数量 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
端子数量 | 16 | 16 | 20 | 16 | 16 | 16 | 16 | 20 | 16 | 16 |
最高工作温度 | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C | 125 °C | 125 °C |
最低工作温度 | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | -55 °C | -55 °C |
输出极性 | INVERTED | INVERTED | INVERTED | INVERTED | INVERTED | INVERTED | INVERTED | INVERTED | INVERTED | INVERTED |
封装主体材料 | CERAMIC, GLASS-SEALED | PLASTIC/EPOXY | PLASTIC/EPOXY | CERAMIC, GLASS-SEALED | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | CERAMIC, GLASS-SEALED | CERAMIC, GLASS-SEALED |
封装代码 | DIP | DIP | QCCJ | DIP | SOP | DIP | SOP | QCCJ | DIP | DIP |
封装等效代码 | DIP16,.3 | DIP16,.3 | LDCC20,.4SQ | DIP16,.3 | SOP16,.4 | DIP16,.3 | SOP16,.4 | LDCC20,.4SQ | DIP16,.3 | DIP16,.3 |
封装形状 | RECTANGULAR | RECTANGULAR | SQUARE | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | SQUARE | RECTANGULAR | RECTANGULAR |
封装形式 | IN-LINE | IN-LINE | CHIP CARRIER | IN-LINE | SMALL OUTLINE | IN-LINE | SMALL OUTLINE | CHIP CARRIER | IN-LINE | IN-LINE |
峰值回流温度(摄氏度) | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
电源 | 2/6 V | 2/6 V | 2/6 V | 2/6 V | 2/6 V | 2/6 V | 2/6 V | 2/6 V | 2/6 V | 2/6 V |
传播延迟(tpd) | 571 ns | 635 ns | 635 ns | 635 ns | 635 ns | 571 ns | 571 ns | 571 ns | 750 ns | 676 ns |
认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
座面最大高度 | 5 mm | 5.1 mm | 4.57 mm | 5 mm | 1.75 mm | 5.1 mm | 1.75 mm | 4.57 mm | 5 mm | 5 mm |
最大供电电压 (Vsup) | 6 V | 6 V | 6 V | 6 V | 6 V | 6 V | 6 V | 6 V | 6 V | 6 V |
最小供电电压 (Vsup) | 2 V | 2 V | 2 V | 2 V | 2 V | 2 V | 2 V | 2 V | 2 V | 2 V |
表面贴装 | NO | NO | YES | NO | YES | NO | YES | YES | NO | NO |
技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
温度等级 | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | MILITARY | MILITARY |
端子面层 | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
端子形式 | THROUGH-HOLE | THROUGH-HOLE | J BEND | THROUGH-HOLE | GULL WING | THROUGH-HOLE | GULL WING | J BEND | THROUGH-HOLE | THROUGH-HOLE |
端子节距 | 2.54 mm | 2.54 mm | 1.27 mm | 2.54 mm | 1.27 mm | 2.54 mm | 1.27 mm | 1.27 mm | 2.54 mm | 2.54 mm |
端子位置 | DUAL | DUAL | QUAD | DUAL | DUAL | DUAL | DUAL | QUAD | DUAL | DUAL |
处于峰值回流温度下的最长时间 | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
宽度 | 7.62 mm | 7.62 mm | 8.9662 mm | 7.62 mm | 3.9 mm | 7.62 mm | 3.9 mm | 8.9662 mm | 7.62 mm | 7.62 mm |
最小 fmax | 31 MHz | 24 MHz | 24 MHz | 24 MHz | 24 MHz | 31 MHz | 31 MHz | 31 MHz | 20 MHz | 25 MHz |