型号
- 型号
- 关键词
| 型号 | MC-421000A32BT-80 | MC-421000A32FT-80 | MC-421000A32BT-60 | MC-421000A32FT-70 | MC-421000A32BT-70 | MC-421000A32FT-60 |
|---|---|---|---|---|---|---|
| 描述 | Fast Page DRAM Module, 1MX32, 80ns, CMOS, SIMM-72 | Fast Page DRAM Module, 1MX32, 80ns, CMOS, SIMM-72 | Fast Page DRAM Module, 1MX32, 60ns, CMOS, SIMM-72 | Fast Page DRAM Module, 1MX32, 70ns, CMOS, SIMM-72 | Fast Page DRAM Module, 1MX32, 70ns, CMOS, SIMM-72 | Fast Page DRAM Module, 1MX32, 60ns, CMOS, SIMM-72 |
| 包装说明 | SIMM-72 | SIMM-72 | SIMM-72 | SIMM-72 | SIMM-72 | SIMM-72 |
| Reach Compliance Code | unknow | unknown | unknown | unknown | unknown | unknow |
| 访问模式 | FAST PAGE | FAST PAGE | FAST PAGE | FAST PAGE | FAST PAGE | FAST PAGE |
| 最长访问时间 | 80 ns | 80 ns | 60 ns | 70 ns | 70 ns | 60 ns |
| 其他特性 | RAS ONLY; CAS BEFORE RAS; HIDDEN REFRESH | RAS ONLY; CAS BEFORE RAS; HIDDEN REFRESH | RAS ONLY; CAS BEFORE RAS; HIDDEN REFRESH | RAS ONLY; CAS BEFORE RAS; HIDDEN REFRESH | RAS ONLY; CAS BEFORE RAS; HIDDEN REFRESH | RAS ONLY; CAS BEFORE RAS; HIDDEN REFRESH |
| JESD-30 代码 | R-XSMA-N72 | R-XSMA-N72 | R-XSMA-N72 | R-XSMA-N72 | R-XSMA-N72 | R-XSMA-N72 |
| 内存密度 | 33554432 bi | 33554432 bit | 33554432 bit | 33554432 bit | 33554432 bit | 33554432 bi |
| 内存集成电路类型 | FAST PAGE DRAM MODULE | FAST PAGE DRAM MODULE | FAST PAGE DRAM MODULE | FAST PAGE DRAM MODULE | FAST PAGE DRAM MODULE | FAST PAGE DRAM MODULE |
| 内存宽度 | 32 | 32 | 32 | 32 | 32 | 32 |
| 功能数量 | 1 | 1 | 1 | 1 | 1 | 1 |
| 端口数量 | 1 | 1 | 1 | 1 | 1 | 1 |
| 端子数量 | 72 | 72 | 72 | 72 | 72 | 72 |
| 字数 | 1048576 words | 1048576 words | 1048576 words | 1048576 words | 1048576 words | 1048576 words |
| 字数代码 | 1000000 | 1000000 | 1000000 | 1000000 | 1000000 | 1000000 |
| 工作模式 | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS |
| 最高工作温度 | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C |
| 组织 | 1MX32 | 1MX32 | 1MX32 | 1MX32 | 1MX32 | 1MX32 |
| 封装主体材料 | UNSPECIFIED | UNSPECIFIED | UNSPECIFIED | UNSPECIFIED | UNSPECIFIED | UNSPECIFIED |
| 封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| 封装形式 | MICROELECTRONIC ASSEMBLY | MICROELECTRONIC ASSEMBLY | MICROELECTRONIC ASSEMBLY | MICROELECTRONIC ASSEMBLY | MICROELECTRONIC ASSEMBLY | MICROELECTRONIC ASSEMBLY |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 刷新周期 | 1024 | 1024 | 1024 | 1024 | 1024 | 1024 |
| 最大供电电压 (Vsup) | 5.25 V | 5.25 V | 5.25 V | 5.25 V | 5.25 V | 5.25 V |
| 最小供电电压 (Vsup) | 4.75 V | 4.75 V | 4.75 V | 4.75 V | 4.75 V | 4.75 V |
| 标称供电电压 (Vsup) | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| 表面贴装 | NO | NO | NO | NO | NO | NO |
| 技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
| 温度等级 | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL |
| 端子形式 | NO LEAD | NO LEAD | NO LEAD | NO LEAD | NO LEAD | NO LEAD |
| 端子位置 | SINGLE | SINGLE | SINGLE | SINGLE | SINGLE | SINGLE |
| 厂商名称 | NEC(日电) | - | - | NEC(日电) | NEC(日电) | NEC(日电) |
