Freescale Semiconductor
Data Sheet: Technical Data
Document Number: MPC5534
Rev. 6, Apr 2012
MPC5534
Microcontroller Data Sheet
by: Automotive and Industrial Solutions Gruop
This document provides electrical specifications, pin
assignments, and package diagrams for the MPC5534
microcontroller device. For functional characteristics,
refer to the
MPC5534 Microcontroller Reference
Manual.
Contents
1
2
3
Overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
Ordering Information . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
Electrical Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . 4
3.1 Maximum Ratings . . . . . . . . . . . . . . . . . . . . . . . . . . 4
3.2 Thermal Characteristics . . . . . . . . . . . . . . . . . . . . . 5
3.3 Package. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
3.4 EMI Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . 8
3.5 ESD Characteristics . . . . . . . . . . . . . . . . . . . . . . . . 9
3.6 VRC and POR Electrical Specifications . . . . . . . . . 9
3.7 Power-Up/Down Sequencing. . . . . . . . . . . . . . . . . 10
3.8 DC Electrical Specifications . . . . . . . . . . . . . . . . . 14
3.9 Oscillator and FMPLL Electrical Characteristics . . 20
3.10 eQADC Electrical Characteristics . . . . . . . . . . . . . 22
3.11 H7Fb Flash Memory Electrical Characteristics . . . 23
3.12 AC Specifications . . . . . . . . . . . . . . . . . . . . . . . . . 24
3.13 AC Timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26
Mechanicals. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
4.1 MPC5534 208 MAP BGA Pinout . . . . . . . . . . . . . .
4.2 MPC5534 324 PBGA Pinouts . . . . . . . . . . . . . . . .
4.3 MPC5534 208-Pin Package Dimensions. . . . . . . .
4.4 MPC5534 324-Pin Package Dimensions. . . . . . . .
46
46
47
48
50
1
Overview
The MPC5534 microcontroller (MCU) is a member of
the MPC5500 family of microcontrollers built on the
Power Architecture
embedded technology. This family
of parts has many new features coupled with high
performance CMOS technology to provide substantial
reduction of cost per feature and significant performance
improvement over the MPC500 family.
The host processor core of this device complies with the
Power Architecture embedded category that is 100%
user-mode compatible (including floating point library)
with the original PowerPC instruction set. The embedded
architecture enhancements improve the performance in
embedded applications. The core also has additional
instructions, including digital signal processing (DSP)
instructions, beyond the original PowerPC instruction
set.
4
5
Revision History for the MPC5534 Data Sheet . . . . . . . 52
5.1 Changes Between Revisions 5.0 and 6.0 . . . . . . . 52
5.3 Changes Between Revisions 3.0 and 4.0 . . . . . . . 53
© Freescale Semiconductor, Inc., 2008-2012. All rights reserved.
Overview
The MPC5500 family of parts contains many new features coupled with high performance CMOS
technology to provide significant performance improvement over the MPC565.
The host processor core of the MPC5534 also includes an instruction set enhancement allowing variable
length encoding (VLE). This allows optional encoding of mixed 16- and 32-bit instructions. With this
enhancement, it is possible to significantly reduce the code size footprint.
The MPC5534 has a single-level memory hierarchy consisting of 64-kilobytes (KB) on-chip SRAM and
one megabyte (MB) of internal flash memory. Both the SRAM and the flash memory can hold instructions
and data. The external bus interface (EBI) supports most standard memories used with the MPC5xx family.
The MPC5534 does not support arbitration with other masters on the external bus. The MPC5534 must be
the only master on the external bus, or act as a slave-only device.
The complex input/output timer functions of the MPC5534 are performed by an enhanced time processor
unit (eTPU) engine. The eTPU engine controls 32 hardware channels. The eTPU has been enhanced over
the TPU by providing: 24-bit timers, double-action hardware channels, variable number of parameters per
channel, angle clock hardware, and additional control and arithmetic instructions. The eTPU is
programmed using a high-level programming language.
The less complex timer functions of the MPC5534 are performed by the enhanced modular input/output
system (eMIOS). The eMIOS’ 24 hardware channels are capable of single-action, double-action,
pulse-width modulation (PWM), and modulus-counter operations. Motor control capabilities include
edge-aligned and center-aligned PWM.
Off-chip communication is performed by a suite of serial protocols including controller area networks
(FlexCANs), enhanced deserial/serial peripheral interfaces (DSPIs), and enhanced serial communications
interfaces (eSCIs).
The MCU has an on-chip enhanced queued dual analog-to-digital converter (eQADC) with a 5 V
conversion range. The 324 package has 40-channels; the 208 package has 34 channels.
The system integration unit (SIU) performs several chip-wide configuration functions. Pad configuration
and general-purpose input and output (GPIO) are controlled from the SIU. External interrupts and reset
control are also determined by the SIU. The internal multiplexer sub-block (IMUX) provides multiplexing
of eQADC trigger sources and external interrupt signal multiplexing.
MPC5534 Microcontroller Data Sheet, Rev. 6
2
Freescale Semiconductor
Ordering Information
2
Ordering Information
M PC 5534 M ZQ 80 R
Qualification status
Core code
Device number
Temperature range
Package identifier
Operating frequency (MHz)
Tape and reel status
Operating Frequency
40 = 40 MHz
66 = 66 MHz
80 = 80 MHz
Tape and Reel Status
R = Tape and reel
(blank) = Trays
Qualification Status
P = Pre qualification
M = Fully spec. qualified, general market flow
S = Fully spec. qualified, automotive flow
Temperature Range
M = –40° C to 125° C
Package Identifier
VF = 208MAPBGA SnPb
VM = 208MAPBGA Pb-free
ZQ = 324PBGA SnPb
VZ = 324PBGA Pb-free
Note:
Not all options are available on all devices. Refer to
Table 1.
Figure 1. MPC5500 Family Part Number Example
Unless noted in this data sheet, all specifications apply from T
L
to T
H
.
Table 1. Orderable Part Numbers
Speed (MHz)
Freescale Part Number
MPC5534MVZ80
MPC5534MVZ66
MPC5534MVZ40
MPC5534MVM80
MPC5534MVM66
MPC5534MVM40
MPC5534MZQ80
MPC5534MZQ66
MPC5534MZQ40
MPC5534MVF80
MPC5534MVF66
MPC5534MVF40
1
2
Operating Temperature
1
Min. (T
L
)
Max. (T
H
)
Package Description
Nominal
80
MPC5534 324 package
Lead-free (PbFree)
66
40
80
MPC5534 208 package
Lead-free (PbFree)
66
40
80
MPC5534 324 package
Leaded (SnPb)
66
40
80
MPC5534 208 package
Leaded (SnPb)
66
40
Max.
2
(f
MAX
)
82
68
42
82
68
42
82
68
42
82
68
42
–40° C
125° C
–40° C
125° C
–40° C
125° C
–40° C
125° C
The lowest ambient operating temperature is referenced by T
L
; the highest ambient operating temperature is referenced by T
H
.
Speed is the nominal maximum frequency. Max. speed is the maximum speed allowed including frequency modulation (FM).
42 MHz parts allow for 40 MHz system clock + 2% FM; 68 MHz parts allow for 66 MHz system clock + 2% FM, and
82 MHz parts allow for 80 MHz system clock + 2% FM.
MPC5534 Microcontroller Data Sheet, Rev. 6
Freescale Semiconductor
3
Electrical Characteristics
3
Electrical Characteristics
This section contains detailed information on power considerations, DC/AC electrical characteristics, and
AC timing specifications for the MCU.
3.1
Spec
1
2
4
5
6
7
8
9
10
11
12
Maximum Ratings
Table 2. Absolute Maximum Ratings
1
Characteristic
1.5 V core supply voltage
2
Flash program/erase voltage
Flash read voltage
SRAM standby voltage
Clock synthesizer voltage
3.3 V I/O buffer voltage
Voltage regulator control input voltage
Analog supply voltage (reference to V
SSA
)
I/O supply voltage (fast I/O pads)
3
I/O supply voltage (slow and medium I/O pads)
3
DC input voltage
4
V
DDEH
powered I/O pads
V
DDE
powered I/O pads
Analog reference high voltage (reference to V
RL
)
V
SS
to V
SSA
differential voltage
V
DD
to V
DDA
differential voltage
V
REF
differential voltage
V
RH
to V
DDA
differential voltage
V
RL
to V
SSA
differential voltage
V
DDEH
to V
DDA
differential voltage
V
DDF
to V
DD
differential voltage
V
SSSYN
to V
SS
differential voltage
V
RCVSS
to V
SS
differential voltage
Maximum DC digital input current
8
(per pin, applies to all digital pins)
4
Maximum DC analog input current
9
(per pin, applies to all analog pins)
Maximum operating temperature range
10
Die junction temperature
Storage temperature range
Symbol
V
DD
V
PP
V
FLASH
V
STBY
V
DDSYN
V
DD33
V
RC33
V
DDA
V
DDE
V
DDEH
V
IN
Min.
–0.3
–0.3
–0.3
–0.3
–0.3
–0.3
–0.3
–0.3
–0.3
–0.3
–1.0
5
–1.0
5
–0.3
–0.1
–V
DDA
–0.3
–5.5
–0.3
–V
DDA
–0.3
Max.
1.7
6.5
4.6
1.7
4.6
4.6
4.6
5.5
4.6
6.5
6.5
6
4.6
7
5.5
0.1
V
DD
5.5
5.5
0.3
V
DDEH
0.3
Unit
V
V
V
V
V
V
V
V
V
V
V
V
V
V
V
V
V
V
V
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
V
RH
V
SS
– V
SSA
V
DD
– V
DDA
V
RH
– V
RL
V
RH
– V
DDA
V
RL
– V
SSA
V
DDEH
– V
DDA
V
DDF
– V
DD
V
SSSYN
– V
SS
V
RCVSS
– V
SS
I
MAXD
I
MAXA
T
J
T
STG
V
RC33
to V
DDSYN
differential voltage spec has been moved to
Table 9
DC Electrical Specifications, Spec 43a.
–0.1
–0.1
–2
–3
T
L
–55.0
0.1
0.1
2
3
150.0
150.0
V
V
mA
mA
o
C
o
C
MPC5534 Microcontroller Data Sheet, Rev. 6
4
Freescale Semiconductor
Electrical Characteristics
Table 2. Absolute Maximum Ratings
1
(continued)
Spec
28
Characteristic
Maximum solder temperature
11
Lead free (Pb-free)
Leaded (SnPb)
Moisture sensitivity level
12
Symbol
T
SDR
MSL
Min.
—
—
—
Max.
260.0
245.0
3
Unit
o
C
29
1
Functional operating conditions are given in the DC electrical specifications. Absolute maximum ratings are stress ratings only,
and functional operation at the maxima is not guaranteed. Stress beyond any of the listed maxima can affect device reliability
or cause permanent damage to the device.
2
1.5 V ± 10% for proper operation. This parameter is specified at a maximum junction temperature of 150
o
C.
3
All functional non-supply I/O pins are clamped to V
SS
and V
DDE
, or V
DDEH
.
4
AC signal overshoot and undershoot of up to ± 2.0 V of the input voltages is permitted for an accumulative duration of
60 hours over the complete lifetime of the device (injection current not limited for this duration).
5
Internal structures hold the voltage greater than –1.0 V if the injection current limit of 2 mA is met. Keep the negative DC
voltage greater than –0.6 V on SINB during the internal power-on reset (POR) state.
6
Internal structures hold the input voltage less than the maximum voltage on all pads powered by V
DDEH
supplies, if the
maximum injection current specification is met (2 mA for all pins) and V
DDEH
is within the operating voltage specifications.
7
Internal structures hold the input voltage less than the maximum voltage on all pads powered by V
DDE
supplies, if the maximum
injection current specification is met (2 mA for all pins) and V
DDE
is within the operating voltage specifications.
8
Total injection current for all pins (including both digital and analog) must not exceed 25 mA.
9
Total injection current for all analog input pins must not exceed 15 mA.
10
Lifetime operation at these specification limits is not guaranteed.
11
Moisture sensitivity profile per IPC/JEDEC J-STD-020D.
12
Moisture sensitivity per JEDEC test method A112.
3.2
Thermal Characteristics
Table 3. MPC5534 Thermal Characteristic
Package
The shaded rows in the following table indicate information specific to a four-layer board.
Spec
MPC5534 Thermal Characteristic
Symbol
208
MAPBGA
42
26
34
22
15
8
2
324
PBGA
34
23
28
20
15
10
2
Unit
1
2
3
4
5
6
7
1
2
3
4
5
Junction to ambient
1, 2
, natural convection (one-layer board)
Junction to ambient
1, 3
, natural convection (four-layer board 2s2p)
Junction to ambient (@200 ft./min., one-layer board)
Junction to ambient (@200 ft./min., four-layer board 2s2p)
Junction to board
4
(four-layer board 2s2p)
Junction to case
5
Junction to package top
6
, natural convection
R
JA
R
JA
R
JMA
R
JMA
R
JB
R
JC
JT
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
Junction temperature is a function of: on-chip power dissipation, package thermal resistance, mounting site (board)
temperature, ambient temperature, air flow, power dissipation of other board components, and board thermal resistance.
Per SEMI G38-87 and JEDEC JESD51-2 with the single-layer board in a horizontal position.
Per JEDEC JESD51-6 with the board in a horizontal position.
Thermal resistance between the die and the printed circuit board per JEDEC JESD51-8. Board temperature is measured on
the top surface of the board near the package.
Indicates the average thermal resistance between the die and the case top surface as measured by the cold plate method
(MIL SPEC-883 Method 1012.1) with the cold plate temperature used for the case temperature.
MPC5534 Microcontroller Data Sheet, Rev. 6
Freescale Semiconductor
5
