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MSAFR12N50AE3

Power Field-Effect Transistor, 12A I(D), 500V, 0.4ohm, 1-Element, N-Channel, Silicon, Metal-oxide Semiconductor FET,

器件类别:分立半导体    晶体管   

厂商名称:Microsemi

厂商官网:https://www.microsemi.com

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器件参数
参数名称
属性值
包装说明
CHIP CARRIER, R-CBCC-N3
Reach Compliance Code
compli
雪崩能效等级(Eas)
8 mJ
外壳连接
DRAIN
配置
SINGLE WITH BUILT-IN DIODE
最小漏源击穿电压
500 V
最大漏极电流 (ID)
12 A
最大漏源导通电阻
0.4 Ω
FET 技术
METAL-OXIDE SEMICONDUCTOR
JESD-30 代码
R-CBCC-N3
元件数量
1
端子数量
3
工作模式
ENHANCEMENT MODE
封装主体材料
CERAMIC, METAL-SEALED COFIRED
封装形状
RECTANGULAR
封装形式
CHIP CARRIER
极性/信道类型
N-CHANNEL
最大脉冲漏极电流 (IDM)
48 A
表面贴装
YES
端子形式
NO LEAD
端子位置
BOTTOM
晶体管应用
SWITCHING
晶体管元件材料
SILICON
Base Number Matches
1
参数对比
与MSAFR12N50AE3相近的元器件有:MSAER12N50AE3、IRF720、MSAFZ15N40A、MSAEZ15N40A、MSAFX11N80A、MSAFX24N50AE3。描述及对比如下:
型号 MSAFR12N50AE3 MSAER12N50AE3 IRF720 MSAFZ15N40A MSAEZ15N40A MSAFX11N80A MSAFX24N50AE3
描述 Power Field-Effect Transistor, 12A I(D), 500V, 0.4ohm, 1-Element, N-Channel, Silicon, Metal-oxide Semiconductor FET, Power Field-Effect Transistor, 12A I(D), 500V, 0.4ohm, 1-Element, N-Channel, Silicon, Metal-oxide Semiconductor FET, Power Field-Effect Transistor, 3.3A I(D), 400V, 1.8ohm, 1-Element, N-Channel, Silicon, Metal-oxide Semiconductor FET, TO-220 Small Signal Field-Effect Transistor Small Signal Field-Effect Transistor Small Signal Field-Effect Transistor Power Field-Effect Transistor, 24A I(D), 500V, 0.23ohm, 1-Element, N-Channel, Silicon, Metal-oxide Semiconductor FET,
包装说明 CHIP CARRIER, R-CBCC-N3 CHIP CARRIER, R-CBCC-N3 FLANGE MOUNT, R-PSFM-T2 CHIP CARRIER, R-CBCC-N3 CHIP CARRIER, R-CBCC-N3 CHIP CARRIER, R-CBCC-N3 CHIP CARRIER, R-CBCC-N3
Reach Compliance Code compli compli compliant unknown unknown unknown compliant
最大漏源导通电阻 0.4 Ω 0.4 Ω 1.8 Ω 0.3 Ω 0.3 Ω 0.95 Ω 0.23 Ω
JESD-30 代码 R-CBCC-N3 R-CBCC-N3 R-PSFM-T2 R-CBCC-N3 R-CBCC-N3 R-CBCC-N3 R-CBCC-N3
端子数量 3 3 2 3 3 3 3
封装主体材料 CERAMIC, METAL-SEALED COFIRED CERAMIC, METAL-SEALED COFIRED PLASTIC/EPOXY CERAMIC, METAL-SEALED COFIRED CERAMIC, METAL-SEALED COFIRED CERAMIC, METAL-SEALED COFIRED CERAMIC, METAL-SEALED COFIRED
封装形状 RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR
封装形式 CHIP CARRIER CHIP CARRIER FLANGE MOUNT CHIP CARRIER CHIP CARRIER CHIP CARRIER CHIP CARRIER
表面贴装 YES YES NO YES YES YES YES
端子形式 NO LEAD NO LEAD THROUGH-HOLE NO LEAD NO LEAD NO LEAD NO LEAD
端子位置 BOTTOM BOTTOM SINGLE BOTTOM BOTTOM BOTTOM BOTTOM
配置 SINGLE WITH BUILT-IN DIODE SINGLE WITH BUILT-IN DIODE SINGLE - - - SINGLE WITH BUILT-IN DIODE
最小漏源击穿电压 500 V 500 V 400 V - - - 500 V
最大漏极电流 (ID) 12 A 12 A 3.3 A - - - 24 A
FET 技术 METAL-OXIDE SEMICONDUCTOR METAL-OXIDE SEMICONDUCTOR METAL-OXIDE SEMICONDUCTOR - - - METAL-OXIDE SEMICONDUCTOR
元件数量 1 1 1 - - - 1
工作模式 ENHANCEMENT MODE ENHANCEMENT MODE ENHANCEMENT MODE - - - ENHANCEMENT MODE
极性/信道类型 N-CHANNEL N-CHANNEL N-CHANNEL - - - N-CHANNEL
晶体管元件材料 SILICON SILICON SILICON - - - SILICON
Base Number Matches 1 1 1 1 1 1 -
JESD-609代码 - - e0 e0 e0 e0 -
认证状态 - - Not Qualified Not Qualified Not Qualified Not Qualified -
端子面层 - - TIN LEAD TIN LEAD TIN LEAD TIN LEAD -
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