型号
- 型号
- 关键词
| 型号 | MSM5416273-60TS-L | MSM5416273-50TS-K | MSM5416273-50TS-L | MSM5416273-60TS-K | MSM5416273-70TS-K | MSM5416273-70TS-L |
|---|---|---|---|---|---|---|
| 描述 | Memory Circuit, 256KX16, CMOS, PDSO64 | Memory Circuit, 256KX16, CMOS, PDSO64 | Memory Circuit, 256KX16, CMOS, PDSO64 | Memory Circuit, 256KX16, CMOS, PDSO64 | Memory Circuit, 256KX16, CMOS, PDSO64 | Memory Circuit, 256KX16, CMOS, PDSO64 |
| 是否Rohs认证 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 |
| 厂商名称 | LAPIS Semiconductor Co Ltd | LAPIS Semiconductor Co Ltd | LAPIS Semiconductor Co Ltd | LAPIS Semiconductor Co Ltd | LAPIS Semiconductor Co Ltd | LAPIS Semiconductor Co Ltd |
| 包装说明 | TSSOP, TSSOP64/70,.46 | TSSOP, TSSOP64/70,.46 | TSSOP, TSSOP64/70,.46 | TSSOP, TSSOP64/70,.46 | TSSOP, TSSOP64/70,.46 | TSSOP, TSSOP64/70,.46 |
| Reach Compliance Code | unknow | unknow | unknow | unknow | unknow | unknow |
| 最长访问时间 | 60 ns | 50 ns | 50 ns | 60 ns | 70 ns | 70 ns |
| JESD-30 代码 | R-PDSO-G64 | R-PDSO-G64 | R-PDSO-G64 | R-PDSO-G64 | R-PDSO-G64 | R-PDSO-G64 |
| JESD-609代码 | e0 | e0 | e0 | e0 | e0 | e0 |
| 内存密度 | 4194304 bi | 4194304 bi | 4194304 bi | 4194304 bi | 4194304 bi | 4194304 bi |
| 内存集成电路类型 | MEMORY CIRCUIT | MEMORY CIRCUIT | MEMORY CIRCUIT | MEMORY CIRCUIT | MEMORY CIRCUIT | MEMORY CIRCUIT |
| 内存宽度 | 16 | 16 | 16 | 16 | 16 | 16 |
| 端子数量 | 64 | 64 | 64 | 64 | 64 | 64 |
| 字数 | 262144 words | 262144 words | 262144 words | 262144 words | 262144 words | 262144 words |
| 字数代码 | 256000 | 256000 | 256000 | 256000 | 256000 | 256000 |
| 最高工作温度 | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C |
| 组织 | 256KX16 | 256KX16 | 256KX16 | 256KX16 | 256KX16 | 256KX16 |
| 封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| 封装代码 | TSSOP | TSSOP | TSSOP | TSSOP | TSSOP | TSSOP |
| 封装等效代码 | TSSOP64/70,.46 | TSSOP64/70,.46 | TSSOP64/70,.46 | TSSOP64/70,.46 | TSSOP64/70,.46 | TSSOP64/70,.46 |
| 封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| 封装形式 | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
| 电源 | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 最大待机电流 | 0.008 A | 0.008 A | 0.008 A | 0.008 A | 0.008 A | 0.008 A |
| 最大压摆率 | 0.15 mA | 0.16 mA | 0.16 mA | 0.15 mA | 0.14 mA | 0.14 mA |
| 标称供电电压 (Vsup) | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| 表面贴装 | YES | YES | YES | YES | YES | YES |
| 技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
| 温度等级 | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL |
| 端子面层 | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
| 端子形式 | GULL WING | GULL WING | GULL WING | GULL WING | GULL WING | GULL WING |
| 端子节距 | 0.635 mm | 0.635 mm | 0.635 mm | 0.635 mm | 0.635 mm | 0.635 mm |
| 端子位置 | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL |