型号
- 型号
- 关键词
| 型号 | MSM6352RS28 | MSM6352RS40 | MSM6352GS-K |
|---|---|---|---|
| 描述 | Microcontroller, 4-Bit, MROM, OLMS-63 CPU, 3.58MHz, CMOS, PDIP28 | Microcontroller, 4-Bit, MROM, OLMS-63 CPU, 3.58MHz, CMOS, PDIP40 | Microcontroller, 4-Bit, MROM, OLMS-63 CPU, 3.58MHz, CMOS, PQFP44 |
| 是否Rohs认证 | 不符合 | 不符合 | 不符合 |
| 厂商名称 | LAPIS Semiconductor Co Ltd | LAPIS Semiconductor Co Ltd | LAPIS Semiconductor Co Ltd |
| 包装说明 | DIP, DIP28,.6 | DIP, DIP40,.6 | QFP, QFP44,.53X.57,32 |
| Reach Compliance Code | unknown | unknown | unknown |
| 位大小 | 4 | 4 | 4 |
| CPU系列 | OLMS-63 | OLMS-63 | OLMS-63 |
| JESD-30 代码 | R-PDIP-T28 | R-PDIP-T40 | R-PQFP-G44 |
| JESD-609代码 | e0 | e0 | e0 |
| 端子数量 | 28 | 40 | 44 |
| 最高工作温度 | 70 °C | 70 °C | 70 °C |
| 最低工作温度 | -20 °C | -20 °C | -20 °C |
| 封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| 封装代码 | DIP | DIP | QFP |
| 封装等效代码 | DIP28,.6 | DIP40,.6 | QFP44,.53X.57,32 |
| 封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| 封装形式 | IN-LINE | IN-LINE | FLATPACK |
| 电源 | 2.2/5.5 V | 2.2/5.5 V | 2.2/5.5 V |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified |
| RAM（字节） | 320 | 320 | 320 |
| ROM（单词） | 2048 | 2048 | 2048 |
| ROM可编程性 | MROM | MROM | MROM |
| 速度 | 3.58 MHz | 3.58 MHz | 3.58 MHz |
| 最大压摆率 | 6.8 mA | 6.8 mA | 6.8 mA |
| 表面贴装 | NO | NO | YES |
| 技术 | CMOS | CMOS | CMOS |
| 温度等级 | COMMERCIAL | COMMERCIAL | COMMERCIAL |
| 端子面层 | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
| 端子形式 | THROUGH-HOLE | THROUGH-HOLE | GULL WING |
| 端子节距 | 2.54 mm | 2.54 mm | 0.8 mm |
| 端子位置 | DUAL | DUAL | QUAD |
