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RF1K49211

Power Field-Effect Transistor, 7A I(D), 12V, 0.02ohm, 1-Element, N-Channel, Silicon, Metal-oxide Semiconductor FET, MS-012AA

器件类别:分立半导体    晶体管   

厂商名称:Harris

厂商官网:http://www.harris.com/

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器件参数
参数名称
属性值
是否Rohs认证
不符合
厂商名称
Harris
包装说明
SMALL OUTLINE, R-PDSO-G8
Reach Compliance Code
unknown
ECCN代码
EAR99
其他特性
LOGIC LEVEL COMPATIBLE
配置
SINGLE
最小漏源击穿电压
12 V
最大漏极电流 (Abs) (ID)
7 A
最大漏极电流 (ID)
7 A
最大漏源导通电阻
0.02 Ω
FET 技术
METAL-OXIDE SEMICONDUCTOR
JEDEC-95代码
MS-012AA
JESD-30 代码
R-PDSO-G8
JESD-609代码
e0
元件数量
1
端子数量
8
工作模式
ENHANCEMENT MODE
最高工作温度
150 °C
封装主体材料
PLASTIC/EPOXY
封装形状
RECTANGULAR
封装形式
SMALL OUTLINE
峰值回流温度(摄氏度)
NOT SPECIFIED
极性/信道类型
N-CHANNEL
最大功率耗散 (Abs)
2 W
认证状态
Not Qualified
表面贴装
YES
端子面层
Tin/Lead (Sn/Pb)
端子形式
GULL WING
端子位置
DUAL
处于峰值回流温度下的最长时间
NOT SPECIFIED
晶体管应用
SWITCHING
晶体管元件材料
SILICON
文档预览
S E M I C O N D U C T O R
RF1K49211
7A, 12V, 0.020Ω, Logic
Level, Single N-Channel Power MOSFET
Description
The RF1K49211 Single N-Channel power MOSFET is man-
ufactured using an advanced MegaFET process. This pro-
cess, which uses feature sizes approaching those of LSI
integrated circuits, gives optimum utilization of silicon, result-
ing in outstanding performance. It was designed for use in
applications such as switching regulators, switching convert-
ers, motor drivers, relay drivers, and low-voltage bus
switches. This product achieves full-rated conduction at a
gate bias in the 3V - 5V range, thereby facilitating true on-off
power control directly from logic level (5V) integrated circuits.
Formerly developmental type TA49211.
June 1997
Features
• 7A, 12V
• r
DS(ON)
= 0.020Ω
Temperature Compensating
PSPICE Model
• Peak Current vs Pulse Width Curve
• UIS Rating Curve
Ordering Information
PART NUMBER
RF1K49211
PACKAGE
MS-012AA
BRAND
RF1K49211
NOTE: When ordering, use the entire part number. For ordering in
tape and reel, add the suffix 96 to the part number, i.e. RF1K4921196.
Symbol
NC(1)
DRAIN(8)
SOURCE(2)
DRAIN(7)
SOURCE(3)
DRAIN(6)
GATE(4)
DRAIN(5)
Packaging
JEDEC MS-012AA
BRANDING DASH
5
1
2
3
4
CAUTION: These devices are sensitive to electrostatic discharge. Users should follow proper ESD Handling Procedures.
Copyright
©
Harris Corporation 1997
File Number
4303
1
RF1K49211
Absolute Maximum Ratings
T
A
= 25
o
C Unless Otherwise Specified
RF1K49211
12
12
±10
7
Refer to Peak Current Curve
Refer to UIS Curve
2
0.016
-55 to 150
260
UNITS
V
V
V
A
Drain to Source Voltage (Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . V
DSS
Drain to Gate Voltage (Rgs = 20KΩ) (Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . V
DGR
Gate to Source Voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . V
GS
Drain Current
Continuous (Pulse Width = 1s) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . I
D
Pulsed . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .I
DM
Pulsed Avalanche Rating . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . E
AS
Power Dissipation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . P
D
Derate Above 25
o
C. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Operating and Storage Temperature . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . T
J
, T
STG
Soldering Temperature of Leads for 10s . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . T
L
W
W/
o
C
o
C
o
C
CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation
of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied
NOTE:
1. T
J
= 25
o
C to 150
o
C.
Electrical Specifications
PARAMETER
T
A
= 25
o
C, Unless Otherwise Specified
SYMBOL
BV
DSS
V
GS(TH)
I
DSS
TEST CONDITIONS
I
D
= 250µA, V
GS
= 0V
V
GS
= V
DS
, I
D
= 250µA
V
DS
= 12V,
V
GS
= 0V
V
GS
=
±10V
I
D
= 7A, V
GS
= 5V
V
DD
= 6V, I
D
7A,
R
L
= 0.86Ω, V
GS
=
5V,
R
GS
= 25Ω
(Figures 18, 19)
T
A
= 25
o
C
T
A
= 150
o
C
MIN
12
1
-
-
-
-
-
-
-
-
-
-
V
GS
= 0V to 10V
V
GS
= 0V to 5V
V
GS
= 0V to 1V
V
DD
= 9.6V,
I
D
7A,
R
L
= 1.37Ω
I
g(REF)
= 1.0mA
(Figures 20, 21)
-
-
-
-
-
-
Pulse Width = 1s
Device mounted on FR-4 material
-
TYP
-
-
-
-
-
-
-
50
150
120
160
-
60
35
2
1850
1600
600
-
MAX
-
2
1
50
100
0.020
250
-
-
-
-
350
75
45
2.5
-
-
-
62.5
UNITS
V
V
µA
µA
nA
ns
ns
ns
ns
ns
ns
nC
nC
nC
pF
pF
pF
o
C/W
Drain to Source Breakdown Voltage
Gate to Source Threshold Voltage
Zero Gate Voltage Drain Current
Gate to Source Leakage Current
Drain to Source On Resistance
Turn-On Time
Turn-On Delay Time
Rise Time
Turn-Off Delay Time
Fall Time
Turn-Off Time
Total Gate Charge
Gate Charge at 5V
Threshold Gate Charge
Input Capacitance
Output Capacitance
Reverse Transfer Capacitance
Thermal Resistance Junction to Ambient
I
GSS
r
DS(ON)
t
ON
t
d(ON)
t
r
t
d(OFF)
t
f
t
OFF
Q
g(TOT)
Q
g(5)
Q
g(TH)
C
ISS
C
OSS
C
RSS
R
θJA
V
DS
= 12V, V
GS
= 0V,
f = 1MHz
(Figure 14)
Source to Drain Diode Specifications
PARAMETERS
Source to Drain Diode Voltage
Reverse Recovery Time
SYMBOL
V
SD
t
rr
I
SD
= 7A
I
SD
= 7A, dI
SD
/dt = 100A/µs
TEST CONDITIONS
MIN
-
-
TYP
-
-
MAX
1.25
95
UNITS
V
ns
2
RF1K49211
Typical Performance Curves
1.2
POWER DISSIPATION MULTIPLIER
1.0
I
D
, DRAIN CURRENT (A)
6
0.8
8
0.6
0.4
0.2
0
0
25
50
75
100
125
o
C)
T
A
, AMBIENT TEMPERATURE (
150
4
2
0
25
75
100
125
50
o
C)
T
A
, AMBIENT TEMPERATURE (
150
FIGURE 1. NORMALIZED POWER DISSIPATION vs
TEMPERATURE
FIGURE 2. MAXIMUM CONTINUOUS DRAIN CURRENT vs
TEMPERATURE
10
Z
θ
JC
, NORMALIZED THERMAL
IMPEDANCE
1
DUTY CYCLE - DESCENDING ORDER
0.5
0.2
0.1
0.05
0.02
0.01
P
DM
0.1
t
1
0.01
t
2
NOTES:
DUTY FACTOR: D = t
1
/t
2
PEAK T
J
= P
DM
x Z
θ
JA
x R
θ
JA
+ T
A
10
-3
10
-2
10
-1
10
0
10
1
10
2
10
3
SINGLE PULSE
0.001
10
-5
10
-4
t
1
, RECTANGULAR PULSE DURATION (s)
FIGURE 3. NORMALIZED MAXIMUM TRANSIENT THERMAL IMPEDANCE
100
T
J
= MAX RATED
T
A
= 25
o
C
I
DM
, PEAK CURRENT (A)
300
I
D
, DRAIN CURRENT (A)
10
5ms
10ms
1
100ms
1s
0.1
OPERATION IN THIS
AREA MAY BE
LIMITED BY r
DS(ON)
0.01
0.1
1
DC
V
DSS
MAX = 12V
10
50
100
V
GS
= 5V
T
A
= 25
o
C FOR TEMPERATURES
ABOVE 25
o
C DERATE PEAK
CURRENT AS FOLLOWS:
I
=
I
25
150 - T
A
125
10 TRANSCONDUCTANCE
MAY LIMIT CURRENT
IN THIS REGION
1
10
-5
10
-4
10
-3
10
-2
10
-1
10
0
10
1
V
DS
, DRAIN TO SOURCE VOLTAGE (V)
t, PULSE WIDTH (s)
FIGURE 4. FORWARD BIAS SAFE OPERATING AREA
FIGURE 5. PEAK CURRENT CAPABILITY
3
RF1K49211
Typical Performance Curves
50
I
AS
, AVALANCHE CURRENT (A)
(Continued)
50
V
GS
= 10V
I
D
, DRAIN CURRENT (A)
40
V
GS
= 5V
V
GS
= 4V
30
V
GS
= 3V
20
STARTING T
J
= 25
o
C
10
STARTING T
J
= 150
o
C
1
0.01
If R = 0
t
AV
= (L)(I
AS
)/(1.3*RATED BV
DSS
- V
DD
)
If R
0
t
AV
= (L/R)ln[(I
AS
*R)/(1.3*RATED BV
DSS
- V
DD
) +1]
0.1
1
10
t
AV
, TIME IN AVALANCHE (ms)
100
10
V
GS
= 2.5V
PULSE DURATION = 250µs, T
A
= 25
o
C
0
0
1
2
3
4
5
V
DS
, DRAIN TO SOURCE VOLTAGE (V)
NOTE:
Refer to Harris Application Notes AN9321 and AN9322.
FIGURE 7. SATURATION CHARACTERISTICS
FIGURE 6. UNCLAMPED INDUCTIVE SWITCHING CAPABILITY
50
I
D(ON)
, ON-STATE DRAIN CURRENT (A)
200
PULSE DURATION = 250µs, V
DD
= 10V
I
D
= 15A
I
D
= 7.0A
I
D
= 3.5A
I
D
= 1.75A
25
o
C
-55
o
C
40
r
DS(ON)
, ON-STATE RESISTANCE (mΩ)
PULSE TEST
PULSE DURATION = 250µs
DUTY CYCLE = 0.5% MAX
V
DD
= 10V
150
o
C
150
30
100
20
50
10
0
0
1
2
3
4
V
GS
, GATE TO SOURCE VOLTAGE (V)
5
0
2
2.5
3
3.5
4
4.5
5
V
GS
, GATE TO SOURCE VOLTAGE (V)
FIGURE 8. TRANSFER CHARACTERISTICS
FIGURE 9. DRAIN TO SOURCE ON RESISTANCE vs GATE
VOLTAGE AND DRAIN CURRENT
350
300
SWITCHING TIME (ns)
250
200
150
100
50
0
V
DD
= 6V, I
D
= 7A, R
L
= 0.86Ω
2.0
NORMALIZED ON RESISTANCE
t
f
t
r
PULSE DURATION = 250µs, V
GS
= 5V, I
D
= 7A
1.5
t
d(OFF)
1.0
t
d(ON)
0.5
0
10
20
30
40
50
0.0
-80
-40
0
40
80
120
160
R
GS
, GATE TO SOURCE RESISTANCE (Ω)
T
J
, JUNCTION TEMPERATURE (
o
C)
FIGURE 10. SWITCHING TIME AS A FUNCTION OF GATE
RESISTANCE
FIGURE 11. NORMALIZED r
DS(ON)
vs JUNCTION
TEMPERATURE
4
RF1K49211
Typical Performance Curves
1.2
NORMALIZED DRAIN TO SOURCE
BREAKDOWN VOLTAGE
V
GS
= V
DS
, I
D
= 250µA
(Continued)
1.2
I
D
= 250µA
THRESHOLD VOLTAGE
NORMALIZED GATE
1.1
1.0
1.0
0.8
0.9
0.6
-80
-40
0
40
80
120
T
J
, JUNCTION TEMPERATURE (
o
C)
160
0.8
-80
-40
0
40
80
120
T
J
, JUNCTION TEMPERATURE (
o
C)
160
FIGURE 12. NORMALIZED GATE THRESHOLD VOLTAGE vs
JUNCTION TEMPERATURE
FIGURE 13. NORMALIZED DRAIN TO SOURCE BREAKDOWN
VOLTAGE vs JUNCTION TEMPERATURE
V
DS
, DRAIN TO SOURCE VOLTAGE (V)
V
GS
= 0V, f = 1MHz
3000
C, CAPACITANCE (pF)
2500
2000
1500
1000
C
RSS
500
0
C
ISS
V
DD
= BV
DSS
9
V
DD
= BV
DSS
3.75
6
C
OSS
3
R
L
= 1.71Ω
I
G(REF)
= 0.75mA
V
GS
= 5V
PLATEAU VOLTAGES IN
DESCENDING ORDER:
V
DD
= BV
DSS
V
DD
= 0.75 BV
DSS
V
DD
= 0.50 BV
DSS
V
DD
= 0.25 BV
DSS
2.50
1.25
0
0
I G
(
REF
)
0
2
4
6
8
10
12
V
DS
, DRAIN TO SOURCE VOLTAGE (V)
-
20
---------------------
I G
(
AC T
)
I G
(
REF
)
t, TIME (µs)
-
80
---------------------
I
G
(
AC T
)
FIGURE 14. CAPACITANCE vs DRAIN TO SOURCE VOLTAGE
NOTE: Refer to Harris Application Notes AN7254 and AN7260.
FIGURE 15. NORMALIZED SWITCHING WAVEFORMS FOR
CONSTANT GATE CURRENT
Test Circuits and Waveforms
V
DS
BV
DSS
L
VARY t
P
TO OBTAIN
REQUIRED PEAK I
AS
V
GS
DUT
t
P
R
G
-
I
AS
V
DD
t
P
V
DS
V
DD
+
0V
I
AS
0.01Ω
0
t
AV
FIGURE 16. UNCLAMPED ENERGY TEST CIRCUIT
FIGURE 17. UNCLAMPED ENERGY WAVEFORMS
5
V
GS
, GATE TO SOURCE VOLTAGE (V)
3500
12
5.00
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