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S71NS064NA0BFWMP3

Memory Circuit, 4MX16, CMOS, PBGA44, 7.70 X 6.20 MM, 1.20 MM HEIGHT, LEAD FREE, FBGA-44

器件类别:存储    存储   

厂商名称:SPANSION

厂商官网:http://www.spansion.com/

器件标准:

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器件参数
参数名称
属性值
是否Rohs认证
符合
厂商名称
SPANSION
零件包装代码
BGA
包装说明
7.70 X 6.20 MM, 1.20 MM HEIGHT, LEAD FREE, FBGA-44
针数
44
Reach Compliance Code
unknown
其他特性
PSRAM IS ORGANIZED AS 1M X 16; SYNCHRONOUS BURST MODE ALSO POSSIBLE
JESD-30 代码
R-PBGA-B44
JESD-609代码
e2
长度
7.7 mm
内存密度
67108864 bit
内存集成电路类型
MEMORY CIRCUIT
内存宽度
16
湿度敏感等级
3
功能数量
1
端子数量
44
字数
4194304 words
字数代码
4000000
工作模式
ASYNCHRONOUS
最高工作温度
85 °C
最低工作温度
-25 °C
组织
4MX16
封装主体材料
PLASTIC/EPOXY
封装代码
TFBGA
封装形状
RECTANGULAR
封装形式
GRID ARRAY, THIN PROFILE, FINE PITCH
认证状态
Not Qualified
座面最大高度
1.2 mm
最大供电电压 (Vsup)
1.95 V
最小供电电压 (Vsup)
1.7 V
标称供电电压 (Vsup)
1.8 V
表面贴装
YES
技术
CMOS
温度等级
OTHER
端子面层
Tin/Silver/Copper/Nickel (Sn/Ag/Cu/Ni)
端子形式
BALL
端子节距
0.5 mm
端子位置
BOTTOM
宽度
6.285 mm
文档预览
S71NS128NA0/S71NS064NA0 Based MCPs
Stacked Multi-Chip Product (MCP) MirrorBit™ Flash Memory
and PSRAM 128 Mb (8M x 16-bit) and 64 Mb (4M x 16-Bit),
110 nm CMOS 1.8 Volt-only, Multiplexed, Simultaneous Read/
Write, Burst Mode Flash Memory with
16 Mb (1M x 16-Bit) PSRAM
Data Sheet
ADVANCE
INFORMATION
Notice to Readers:
This document states the current technical specifications
regarding the Spansion product(s) described herein. Each product described
herein may be designated as Advance Information, Preliminary, or Full
Production. See
Notice On Data Sheet Designations
for definitions.
Publication Number
S71NS128_064NA0_00
Revision
A
Amendment
0
Issue Date
April 6, 2005
This document contains information on a product under development at Spansion, LLC. The information is intended to help you evaluate this product. Do not design in
this product without contacting the factory. Spansion reserves the right to change or discontinue work on this proposed product without notice.
A d v a n c e
I n f o r m a t i o n
Notice On Data Sheet Designations
Spansion LLC issues data sheets with Advance Information or Preliminary designations to advise
readers of product information or intended specifications throughout the product life cycle, in-
cluding development, qualification, initial production, and full production. In all cases, however,
readers are encouraged to verify that they have the latest information before finalizing their de-
sign. The following descriptions of Spansion data sheet designations are presented here to
highlight their presence and definitions.
Advance Information
The Advance Information designation indicates that Spansion LLC is developing one or more spe-
cific products, but has not committed any design to production. Information presented in a
document with this designation is likely to change, and in some cases, development on the prod-
uct may discontinue. Spansion LLC therefore places the following conditions upon Advance
Information content:
“This document contains information on one or more products under development at Spansion LLC. The
information is intended to help you evaluate this product. Do not design in this product without con-
tacting the factory. Spansion LLC reserves the right to change or discontinue work on this proposed
product without notice.”
Preliminary
The Preliminary designation indicates that the product development has progressed such that a
commitment to production has taken place. This designation covers several aspects of the prod-
uct life cycle, including product qualification, initial production, and the subsequent phases in the
manufacturing process that occur before full production is achieved. Changes to the technical
specifications presented in a Preliminary document should be expected while keeping these as-
pects of production under consideration. Spansion places the following conditions upon
Preliminary content:
“This document states the current technical specifications regarding the Spansion product(s) described
herein. The Preliminary status of this document indicates that product qualification has been completed,
and that initial production has begun. Due to the phases of the manufacturing process that require
maintaining efficiency and quality, this document may be revised by subsequent versions or modifica-
tions due to changes in technical specifications.”
Combination
Some data sheets will contain a combination of products with different designations (Advance
Information, Preliminary, or Full Production). This type of document will distinguish these prod-
ucts and their designations wherever necessary, typically on the first page, the ordering
information page, and pages with the DC Characteristics table and the AC Erase and Program
table (in the table notes). The disclaimer on the first page refers the reader to the notice on this
page.
Full Production (No Designation on Document)
When a product has been in production for a period of time such that no changes or only nominal
changes are expected, the Preliminary designation is removed from the data sheet. Nominal
changes may include those affecting the number of ordering part numbers available, such as the
addition or deletion of a speed option, temperature range, package type, or V
IO
range. Changes
may also include those needed to clarify a description or to correct a typographical error or in-
correct specification. Spansion LLC applies the following conditions to documents in this
category:
“This document states the current technical specifications regarding the Spansion product(s) described
herein. Spansion LLC deems the products to have been in sufficient production volume such that sub-
sequent versions of this document are not expected to change. However, typographical or specification
corrections, or modifications to the valid combinations offered may occur.”
Questions regarding these document designations may be directed to your local AMD or Fujitsu
sales office.
ii
S71NS128NA0/S71NS064NA0 Based MCPs
S71NS128_064NA0_00_A0 April 6, 2005
S71NS128NA0/S71NS064NA0 Based MCPs
Stacked Multi-Chip Product (MCP) MirrorBit™ Flash Memory
and PSRAM 128 Mb (8M x 16-bit) and 64 Mb (4M x 16-Bit),
110 nm CMOS 1.8 Volt-only, Multiplexed, Simultaneous Read/
Write, Burst Mode Flash Memory with 16 Mb (1M x 16-Bit)
pSRAM
Data Sheet
ADVANCE
INFORMATION
Distinctive Characteristics
MCP Features
Power supply voltage of 1.7 V to 1.95 V
Speed
Flash = 54 MHz, 66 MHz, 80 MHz
Asynchronous access time
Flash = 70_ns, PSRAM = 70_ns
7.7 x 6.2 x 1.0 mm 44-ball FBGA (S71NS064NA0
9.2 x 8 x 1.0 mm 44-ball FBGA (S71NS128NA0)
–25°C to +85°C
Packages:
Operating Temperature
General Description
The S71NS Series is a product line of stacked Multi-Chip Product (MCP) packages
and consists of
One multiplexed FLASH memory die (NS128N or NS064N)
One PSRAM
The products covered by this document are listed in the table below. For details about their spec-
ifications, please refer to the individual data sheets (included in this document) for further
details.
Flash Density
Device
S71NS064NA0
S71NS128NA0
64 Mb
128 Mb
PSRAM Density
16 Mb
32 Mb
Publication Number
S71NS128_064NA0_00
Revision
A
Amendment
0
Issue Date
April 6, 2005
This document contains information on a product under development at Spansion, LLC. The information is intended to help you evaluate this product. Do not design in
this product without contacting the factory. Spansion reserves the right to change or discontinue work on this proposed product without notice.
A d v a n c e
I n f o r m a t i o n
Contents
S71NS128NA0/S71NS064NA0 Based MCPs . . . . . . . . . . . . . . . . . . . . . . . . 1
Product Selector Guide . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
MCP Block Diagrams . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
Connection Diagrams . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
S71NS128NA0, 44-ball Very-Thin FBGA (NLB044) Pinout, NS128N + 16 PSRAM................................................................9
S71NS064NA0, 44-ball Very-Thin FBGA (NLD044) Pinout, NS064N + 16 PSRAM........................................................... 10
Input/Output Descriptions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
Logic Symbol . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
Ordering Information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
Order Number .........................................................................................................................................................................................12
Physical Dimension — S71NS128NA0 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
NLB044, 44-Ball Very Thin Fine-Pitch Ball Grid Array (FBGA) 9.2 x 8 mm Package .......................................................13
Physical Dimension — S71NS064NA0 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
NLD044, 44-Ball Very Thin Fine-pitch Ball Grid Array (BGA) 7.7 x 6.2 mm....................................................................... 14
Distinctive Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
General Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
Product Selector Guide . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19
Block Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20
Block Diagram of Simultaneous Operation Circuit . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21
Input/Output Descriptions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22
Logic Symbol . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23
Device Bus Operations . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24
VersatileIO™ (V
IO
) Control.................................................................................................................................................................24
Requirements for Asynchronous Read Operation (Non-Burst)..............................................................................................24
Requirements for Synchronous (Burst) Read Operation...........................................................................................................25
Continuous Burst .........................................................................................................................................................................25
8-, 16-, and 32-Word Linear Burst with Wrap Around ....................................................................................................27
8-, 16-, and 32-Word Linear Burst without Wrap Around .............................................................................................27
Programmable Wait State................................................................................................................................................................... 28
Configuration Register ......................................................................................................................................................................... 28
Handshaking Feature............................................................................................................................................................................. 28
Simultaneous Read/Write Operations with Zero Latency ....................................................................................................... 28
Writing Commands/Command Sequences.................................................................................................................................... 28
Accelerated Program and Erase Operations................................................................................................................................. 28
Write Buffer Programming Operation............................................................................................................................................ 29
Autoselect Mode.....................................................................................................................................................................................30
Advanced Sector Protection and Unprotection............................................................................................................................30
Sector Protection.....................................................................................................................................................................................31
Persistent Sector Protection ................................................................................................................................................................31
Persistent Protection Bit (PPB) ................................................................................................................................................32
Persistent Protection Bit Lock (PPB Lock Bit) in Persistent Sector Protection Mode ..........................................32
Dynamic Protection Bit (DYB) ................................................................................................................................................32
Persistent Sector Protection Mode Lock Bit..................................................................................................................................34
Password Sector Protection................................................................................................................................................................34
64-bit Password .......................................................................................................................................................................................34
Password Mode Lock Bit......................................................................................................................................................................34
Persistent Protection Bit Lock (PPB Lock Bit) in Password Sector Protection Mode......................................................35
Hardware Data Protection Mode......................................................................................................................................................35
Write Protect (WP#) .................................................................................................................................................................36
WP# Boot Sector Protection .............................................................................................................................................................36
Low VCC Write Inhibit ........................................................................................................................................................................36
2
S71NS128NA0/S71NS064NA0 Based MCPs
S71NS128_064NA0_00_A0 April 6, 2005
S29NSxxxN MirrorBit
TM
Flash Family . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
A d v a n c e
I n f o r m a t i o n
Write Pulse “Glitch” Protection ........................................................................................................................................................36
Logical Inhibit............................................................................................................................................................................................36
Power-Up Write Inhibit .............................................................................................................................................................36
Lock Register............................................................................................................................................................................................36
Standby Mode .........................................................................................................................................................................................37
Automatic Sleep Mode ..........................................................................................................................................................................37
RESET#: Hardware Reset Input .........................................................................................................................................................37
V
CC
Power-up and Power-down Sequencing .....................................................................................................................37
Output Disable Mode............................................................................................................................................................................37
SecSi™ (Secured Silicon) Sector SectorFlash Memory Region.................................................................................................37
Factory Locked: Factor SecSi Sector Programmed and Protected At the Factory .................................................38
Customer SecSi Sector ...............................................................................................................................................................38
Common Flash Memory Interface (CFI). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 39
Command Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 52
Reading Array Data................................................................................................................................................................................52
Set Configuration Register Command Sequence..........................................................................................................................52
Read Configuration Register Command Sequence ......................................................................................................................52
Read Mode Setting .......................................................................................................................................................................53
Programmable Wait State Configuration .............................................................................................................................53
Programmable Wait State .........................................................................................................................................................53
Handshaking ...................................................................................................................................................................................54
Burst Length Configuration .......................................................................................................................................................54
Burst Wrap Around ....................................................................................................................................................................54
RDY Configuration ......................................................................................................................................................................54
RDY Polarity ..................................................................................................................................................................................55
Configuration Register . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 56
Reset Command......................................................................................................................................................................................56
Autoselect Command Sequence ...................................................................................................................................................... 58
Enter SecSi™ Sector/Exit SecSi Sector Command Sequence.................................................................................................... 58
Unlock Bypass Command Sequence ......................................................................................................................................59
Program Command Sequence ............................................................................................................................................................59
Program Command Sequence ..................................................................................................................................................59
Program Command Sequence (Unlock Bypass Mode) .....................................................................................................59
Accelerated Program.............................................................................................................................................................................59
Write Buffer Programming Command Sequence ........................................................................................................................ 60
Chip Erase Command Sequence ........................................................................................................................................................62
Chip Erase Command Sequence .............................................................................................................................................62
Sector Erase Command Sequence.....................................................................................................................................................63
Sector Erase Command Sequence ..........................................................................................................................................63
Accelerated Sector Erase ......................................................................................................................................................... 64
Erase Suspend/Erase Resume Commands.......................................................................................................................................65
Program Suspend/Program Resume Commands ..........................................................................................................................65
Lock Register Command Set Definitions ....................................................................................................................................... 66
Password Protection Command Set Definitions.......................................................................................................................... 66
Non-Volatile Sector Protection Command Set Definitions ......................................................................................................67
Global Volatile Sector Protection Freeze Command Set.......................................................................................................... 69
Volatile Sector Protection Command Set...................................................................................................................................... 69
Write Operation Status . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 75
DQ7: Data# Polling ................................................................................................................................................................................75
RDY: Ready .............................................................................................................................................................................................77
DQ6: Toggle Bit I....................................................................................................................................................................................77
DQ2: Toggle Bit II...................................................................................................................................................................................77
Reading Toggle Bits DQ6/DQ2 ..........................................................................................................................................................79
DQ5: Exceeded Timing Limits ............................................................................................................................................................79
DQ3: Sector Erase Start Timeout State Indicator....................................................................................................................... 80
April 6, 2005 S71NS128_064NA0_00_A0
S71NS128NA0/S71NS064NA0 Based MCPs
3
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