型号
- 型号
- 关键词
| 型号 | SA612AN/01,112 | SA612AD-01112 | SA612AD,118 | SA612AD,602 |
|---|---|---|---|---|
| 描述 | 射频无线杂项 LP VHF DBL-BAL W/OSC | RF Mixer LP VHF DBL-BAL W/OSC | RF Mixer DOUBLE BAL MIXER/OSCILLATOR | 射频混合器 DOUBLE BAL MIXER/OSCILLATOR |
| Brand Name | NXP Semiconductor | - | NXP Semiconductor | NXP Semiconductor |
| 厂商名称 | NXP(恩智浦) | - | NXP(恩智浦) | NXP(恩智浦) |
| 零件包装代码 | DIP | - | SOIC | SOIC |
| 包装说明 | DIP, | - | SOP, | SOP, |
| 针数 | 8 | - | 8 | 8 |
| 制造商包装代码 | SOT97-1 | - | SOT96-1 | SOT96-1 |
| Reach Compliance Code | unknown | - | unknown | unknown |
| JESD-30 代码 | R-PDIP-T8 | - | R-PDSO-G8 | R-PDSO-G8 |
| 长度 | 9.5 mm | - | 4.9 mm | 4.9 mm |
| 端子数量 | 8 | - | 8 | 8 |
| 最高工作温度 | 85 °C | - | 85 °C | 85 °C |
| 最低工作温度 | -40 °C | - | -40 °C | -40 °C |
| 封装主体材料 | PLASTIC/EPOXY | - | PLASTIC/EPOXY | PLASTIC/EPOXY |
| 封装代码 | DIP | - | SOP | SOP |
| 封装形状 | RECTANGULAR | - | RECTANGULAR | RECTANGULAR |
| 封装形式 | IN-LINE | - | SMALL OUTLINE | SMALL OUTLINE |
| 认证状态 | Not Qualified | - | Not Qualified | Not Qualified |
| 座面最大高度 | 4.2 mm | - | 1.75 mm | 1.75 mm |
| 表面贴装 | NO | - | YES | YES |
| 温度等级 | INDUSTRIAL | - | INDUSTRIAL | INDUSTRIAL |
| 端子形式 | THROUGH-HOLE | - | GULL WING | GULL WING |
| 端子节距 | 2.54 mm | - | 1.27 mm | 1.27 mm |
| 端子位置 | DUAL | - | DUAL | DUAL |
| 宽度 | 7.62 mm | - | 3.9 mm | 3.9 mm |
