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SEMIX503GB126HDS

trench igbt modules

器件类别:分立半导体    晶体管   

厂商名称:SEMIKRON

厂商官网:http://www.semikron.com

器件标准:

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器件参数
参数名称
属性值
是否无铅
不含铅
是否Rohs认证
符合
包装说明
FLANGE MOUNT, R-XUFM-X18
针数
18
制造商包装代码
CASE SEMIX 3S
Reach Compliance Code
compliant
外壳连接
ISOLATED
最大集电极电流 (IC)
480 A
集电极-发射极最大电压
1200 V
配置
SERIES CONNECTED, CENTER TAP, 2 ELEMENTS WITH BUILT-IN DIODE AND THERMISTOR
门极-发射极最大电压
20 V
JESD-30 代码
R-XUFM-X18
JESD-609代码
e3/e4
元件数量
2
端子数量
18
最高工作温度
150 °C
封装主体材料
UNSPECIFIED
封装形状
RECTANGULAR
封装形式
FLANGE MOUNT
峰值回流温度(摄氏度)
NOT SPECIFIED
极性/信道类型
N-CHANNEL
认证状态
Not Qualified
表面贴装
NO
端子面层
TIN/SILVER
端子形式
UNSPECIFIED
端子位置
UPPER
处于峰值回流温度下的最长时间
NOT SPECIFIED
晶体管应用
POWER CONTROL
晶体管元件材料
SILICON
标称断开时间 (toff)
750 ns
标称接通时间 (ton)
330 ns
VCEsat-Max
2.1 V
Base Number Matches
1
文档预览
SEMiX 503GB126HDs
Absolute Maximum Ratings
Symbol Conditions
IGBT
Values
Units
SEMiX
®
3s
Trench IGBT Modules
SEMiX 503GB126HDs
Module
Preliminary Data
Inverse Diode
Features
Characteristics
Symbol Conditions
IGBT
min.
typ.
max.
Units
Typical Applications
Remarks
GB
1
19-04-2007 SCH
© by SEMIKRON
SEMiX 503GB126HDs
Characteristics
Symbol Conditions
Inverse Diode
min.
typ.
max.
Units
SEMiX
®
3s
Trench IGBT Modules
Module
SEMiX 503GB126HDs
Preliminary Data
Features
Temperature sensor
Typical Applications
This is an electrostatic discharge sensitive device (ESDS), international standard
IEC 60747-1, Chapter IX.
Remarks
This technical information specifies semiconductor devices but promises no
characteristics. No warranty or guarantee expressed or implied is made regarding
delivery, performance or suitability.
GB
2
19-04-2007 SCH
© by SEMIKRON
SEMiX 503GB126HDs
Fig. 1 Typ. output characteristic, inclusive R
CC'+ EE'
Fig. 2 Rated current vs. temperature I
C
= f (T
C
)
Fig. 3 Typ. turn-on /-off energy = f (I
C
)
Fig. 4 Typ. turn-on /-off energy = f (R
G
)
Fig. 5 Typ. transfer characteristic
Fig. 6 Typ. gate charge characteristic
3
19-04-2007 SCH
© by SEMIKRON
SEMiX 503GB126HDs
Fig. 7 Typ. switching times vs. I
C
Fig. 8 Typ. switching times vs. gate resistor R
G
Fig. 9 Typ. transient thermal impedance
Fig. 10 Typ. CAL diode forward charact., incl. R
CC'+EE'
Fig. 11 Typ. CAL diode peak reverse recovery current
Fig. 12 Typ. CAL diode recovery charge
4
19-04-2007 SCH
© by SEMIKRON
SEMiX 503GB126HDs
5
19-04-2007 SCH
© by SEMIKRON
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参数对比
与SEMIX503GB126HDS相近的元器件有:SEMIX503GB126HDS_09。描述及对比如下:
型号 SEMIX503GB126HDS SEMIX503GB126HDS_09
描述 trench igbt modules trench igbt modules
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