CMOS 8-BIT SINGLE-CHIP MICROCOMPUTER (TLCS-48C)
器件类别:嵌入式处理器和控制器 微控制器和处理器
厂商名称:Toshiba(东芝)
厂商官网:http://toshiba-semicon-storage.com/
下载文档型号 | TMP80C39AP-6 | 80C39AP | TMP80C39A | TMP80C39AP | TMP80C49AU-6 | TMP80C49AU | TMP80C49AP | TMP80C49AP-6 | TMP80C49A |
---|---|---|---|---|---|---|---|---|---|
描述 | CMOS 8-BIT SINGLE-CHIP MICROCOMPUTER (TLCS-48C) | CMOS 8-BIT SINGLE-CHIP MICROCOMPUTER (TLCS-48C) | CMOS 8-BIT SINGLE-CHIP MICROCOMPUTER (TLCS-48C) | CMOS 8-BIT SINGLE-CHIP MICROCOMPUTER (TLCS-48C) | CMOS 8-BIT SINGLE-CHIP MICROCOMPUTER (TLCS-48C) | CMOS 8-BIT SINGLE-CHIP MICROCOMPUTER (TLCS-48C) | CMOS 8-BIT SINGLE-CHIP MICROCOMPUTER (TLCS-48C) | CMOS 8-BIT SINGLE-CHIP MICROCOMPUTER (TLCS-48C) | CMOS 8-BIT SINGLE-CHIP MICROCOMPUTER (TLCS-48C) |
是否Rohs认证 | 不符合 | - | - | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | - |
厂商名称 | Toshiba(东芝) | - | - | Toshiba(东芝) | - | Toshiba(东芝) | Toshiba(东芝) | Toshiba(东芝) | - |
零件包装代码 | DIP | - | - | DIP | QFP | QFP | DIP | DIP | - |
包装说明 | PLASTIC, DIP-40 | - | - | PLASTIC, DIP-40 | 10 X 10 MM, MICRO, PLASTIC, QFP-44 | QFP, | PLASTIC, DIP-40 | DIP, DIP40,.6 | - |
针数 | 40 | - | - | 40 | 44 | 44 | 40 | 40 | - |
Reach Compliance Code | unknown | - | - | unknown | unknow | unknow | unknown | unknown | - |
具有ADC | NO | - | - | NO | NO | NO | NO | NO | - |
地址总线宽度 | 12 | - | - | 12 | 12 | 12 | 12 | 12 | - |
位大小 | 8 | - | - | 8 | 8 | 8 | 8 | 8 | - |
最大时钟频率 | 6 MHz | - | - | 11 MHz | 6 MHz | 11 MHz | 11 MHz | 6 MHz | - |
DAC 通道 | NO | - | - | NO | NO | NO | NO | NO | - |
DMA 通道 | NO | - | - | NO | NO | NO | NO | NO | - |
外部数据总线宽度 | 8 | - | - | 8 | 8 | 8 | 8 | 8 | - |
JESD-30 代码 | R-PDIP-T40 | - | - | R-PDIP-T40 | S-PQFP-G44 | S-PQFP-G44 | R-PDIP-T40 | R-PDIP-T40 | - |
JESD-609代码 | e0 | - | - | e0 | e0 | e0 | e0 | e0 | - |
长度 | 52.07 mm | - | - | 52.07 mm | 10 mm | 10 mm | 52.07 mm | 52.07 mm | - |
I/O 线路数量 | 19 | - | - | 19 | 27 | 27 | 27 | 27 | - |
端子数量 | 40 | - | - | 40 | 44 | 44 | 40 | 40 | - |
最高工作温度 | 85 °C | - | - | 70 °C | 85 °C | 85 °C | 70 °C | 85 °C | - |
PWM 通道 | NO | - | - | NO | NO | NO | NO | NO | - |
封装主体材料 | PLASTIC/EPOXY | - | - | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | - |
封装代码 | DIP | - | - | DIP | QFP | QFP | DIP | DIP | - |
封装形状 | RECTANGULAR | - | - | RECTANGULAR | SQUARE | SQUARE | RECTANGULAR | RECTANGULAR | - |
封装形式 | IN-LINE | - | - | IN-LINE | FLATPACK | FLATPACK | IN-LINE | IN-LINE | - |
峰值回流温度(摄氏度) | 240 | - | - | NOT SPECIFIED | - | NOT SPECIFIED | NOT SPECIFIED | 240 | - |
认证状态 | Not Qualified | - | - | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | - |
座面最大高度 | 5.08 mm | - | - | 5.08 mm | 3.05 mm | 3.05 mm | 5.08 mm | 5.08 mm | - |
速度 | 6 MHz | - | - | 11 MHz | 6 MHz | - | 11 MHz | 6 MHz | - |
最大压摆率 | 10 mA | - | - | 15 mA | 10 mA | 15 mA | 15 mA | 10 mA | - |
最大供电电压 | 6 V | - | - | 6.5 V | 6 V | 5.5 V | 6.5 V | 6 V | - |
最小供电电压 | 4 V | - | - | 4.5 V | 4 V | 4.5 V | 4.5 V | 4 V | - |
标称供电电压 | 5 V | - | - | 5 V | 5 V | - | 5 V | 5 V | - |
表面贴装 | NO | - | - | NO | YES | YES | NO | NO | - |
技术 | CMOS | - | - | CMOS | CMOS | CMOS | CMOS | CMOS | - |
温度等级 | INDUSTRIAL | - | - | COMMERCIAL | INDUSTRIAL | INDUSTRIAL | COMMERCIAL | INDUSTRIAL | - |
端子面层 | Tin/Lead (Sn/Pb) | - | - | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | - |
端子形式 | THROUGH-HOLE | - | - | THROUGH-HOLE | GULL WING | GULL WING | THROUGH-HOLE | THROUGH-HOLE | - |
端子节距 | 2.54 mm | - | - | 2.54 mm | 0.8 mm | 0.8 mm | 2.54 mm | 2.54 mm | - |
端子位置 | DUAL | - | - | DUAL | QUAD | QUAD | DUAL | DUAL | - |
处于峰值回流温度下的最长时间 | NOT SPECIFIED | - | - | NOT SPECIFIED | - | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | - |
宽度 | 15.24 mm | - | - | 15.24 mm | 10 mm | 10 mm | 15.24 mm | 15.24 mm | - |
uPs/uCs/外围集成电路类型 | MICROCONTROLLER | - | - | MICROCONTROLLER | MICROCONTROLLER | MICROCONTROLLER | MICROCONTROLLER | MICROCONTROLLER | - |
Base Number Matches | 1 | - | - | 1 | 1 | - | 1 | 1 | - |