型号
- 型号
- 关键词
| 型号 | WS57C71C-55LM | WS57C71C-45L | WS57C71C-55DM | WS57C71C-55TM | WS57C71C-40D | WS57C71C-40L | WS57C71C-55CM | WS57C71C-55LMB |
|---|---|---|---|---|---|---|---|---|
| 描述 | EPROM, 32KX8, 55ns, CMOS, CQCC32, | EPROM, 32KX8, 45ns, CMOS, CQCC32, | EPROM, 32KX8, 55ns, CMOS, CDIP28, | EPROM, 32KX8, 55ns, CMOS, CDIP28, | EPROM, 32KX8, 40ns, CMOS, CDIP28, | EPROM, 32KX8, 40ns, CMOS, CQCC32, | EPROM, 32KX8, 55ns, CMOS, CQCC32, | EPROM, 32KX8, 55ns, CMOS, CQCC32, |
| 是否Rohs认证 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 |
| Reach Compliance Code | unknown | unknown | unknown | unknown | unknown | unknown | unknown | unknown |
| 最长访问时间 | 55 ns | 45 ns | 55 ns | 55 ns | 40 ns | 40 ns | 55 ns | 55 ns |
| I/O 类型 | COMMON | COMMON | COMMON | COMMON | COMMON | COMMON | COMMON | COMMON |
| JESD-30 代码 | R-XQCC-J32 | R-XQCC-J32 | R-XDIP-T28 | R-XDIP-T28 | R-XDIP-T28 | R-XQCC-J32 | R-XQCC-N32 | R-XQCC-J32 |
| JESD-609代码 | e0 | e0 | e0 | e0 | e0 | e0 | e0 | e0 |
| 内存密度 | 262144 bit | 262144 bit | 262144 bit | 262144 bit | 262144 bit | 262144 bit | 262144 bit | 262144 bit |
| 内存宽度 | 8 | 8 | 8 | 8 | 8 | 8 | 8 | 8 |
| 端子数量 | 32 | 32 | 28 | 28 | 28 | 32 | 32 | 32 |
| 字数 | 32768 words | 32768 words | 32768 words | 32768 words | 32768 words | 32768 words | 32768 words | 32768 words |
| 字数代码 | 32000 | 32000 | 32000 | 32000 | 32000 | 32000 | 32000 | 32000 |
| 最高工作温度 | 125 °C | 70 °C | 125 °C | 125 °C | 70 °C | 70 °C | 125 °C | 125 °C |
| 最低工作温度 | -55 °C | - | -55 °C | -55 °C | - | - | -55 °C | -55 °C |
| 组织 | 32KX8 | 32KX8 | 32KX8 | 32KX8 | 32KX8 | 32KX8 | 32KX8 | 32KX8 |
| 输出特性 | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE |
| 封装主体材料 | CERAMIC | CERAMIC | CERAMIC | CERAMIC | CERAMIC | CERAMIC | CERAMIC | CERAMIC |
| 封装代码 | QCCJ | QCCJ | DIP | DIP | DIP | QCCJ | QCCN | QCCJ |
| 封装等效代码 | LDCC32,.45X.7 | LDCC32,.45X.7 | DIP28,.6 | DIP28,.3 | DIP28,.6 | LDCC32,.45X.7 | LCC32,.45X.55 | LDCC32,.45X.7 |
| 封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| 封装形式 | CHIP CARRIER | CHIP CARRIER | IN-LINE | IN-LINE | IN-LINE | CHIP CARRIER | CHIP CARRIER | CHIP CARRIER |
| 电源 | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 最大待机电流 | 0.04 A | 0.03 A | 0.04 A | 0.04 A | 0.03 A | 0.03 A | 0.04 A | 0.04 A |
| 最大压摆率 | 0.076 mA | 0.074 mA | 0.076 mA | 0.076 mA | 0.08 mA | 0.08 mA | 0.076 mA | 0.076 mA |
| 标称供电电压 (Vsup) | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| 表面贴装 | YES | YES | NO | NO | NO | YES | YES | YES |
| 技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
| 温度等级 | MILITARY | COMMERCIAL | MILITARY | MILITARY | COMMERCIAL | COMMERCIAL | MILITARY | MILITARY |
| 端子面层 | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
| 端子形式 | J BEND | J BEND | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | J BEND | NO LEAD | J BEND |
| 端子节距 | 1.27 mm | 1.27 mm | 2.54 mm | 2.54 mm | 2.54 mm | 1.27 mm | 1.27 mm | 1.27 mm |
| 端子位置 | QUAD | QUAD | DUAL | DUAL | DUAL | QUAD | QUAD | QUAD |
| 厂商名称 | Waferscale Integration Inc | - | Waferscale Integration Inc | Waferscale Integration Inc | Waferscale Integration Inc | Waferscale Integration Inc | Waferscale Integration Inc | Waferscale Integration Inc |