型号 | WS57C71C-40L | WS57C71C-45L | WS57C71C-55DM | WS57C71C-55TM | WS57C71C-40D | WS57C71C-55CM | WS57C71C-55LM | WS57C71C-55LMB |
---|---|---|---|---|---|---|---|---|
描述 | EPROM, 32KX8, 40ns, CMOS, CQCC32, | EPROM, 32KX8, 45ns, CMOS, CQCC32, | EPROM, 32KX8, 55ns, CMOS, CDIP28, | EPROM, 32KX8, 55ns, CMOS, CDIP28, | EPROM, 32KX8, 40ns, CMOS, CDIP28, | EPROM, 32KX8, 55ns, CMOS, CQCC32, | EPROM, 32KX8, 55ns, CMOS, CQCC32, | EPROM, 32KX8, 55ns, CMOS, CQCC32, |
是否Rohs认证 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 |
Reach Compliance Code | unknown | unknown | unknown | unknown | unknown | unknown | unknown | unknown |
最长访问时间 | 40 ns | 45 ns | 55 ns | 55 ns | 40 ns | 55 ns | 55 ns | 55 ns |
I/O 类型 | COMMON | COMMON | COMMON | COMMON | COMMON | COMMON | COMMON | COMMON |
JESD-30 代码 | R-XQCC-J32 | R-XQCC-J32 | R-XDIP-T28 | R-XDIP-T28 | R-XDIP-T28 | R-XQCC-N32 | R-XQCC-J32 | R-XQCC-J32 |
JESD-609代码 | e0 | e0 | e0 | e0 | e0 | e0 | e0 | e0 |
内存密度 | 262144 bit | 262144 bit | 262144 bit | 262144 bit | 262144 bit | 262144 bit | 262144 bit | 262144 bit |
内存宽度 | 8 | 8 | 8 | 8 | 8 | 8 | 8 | 8 |
端子数量 | 32 | 32 | 28 | 28 | 28 | 32 | 32 | 32 |
字数 | 32768 words | 32768 words | 32768 words | 32768 words | 32768 words | 32768 words | 32768 words | 32768 words |
字数代码 | 32000 | 32000 | 32000 | 32000 | 32000 | 32000 | 32000 | 32000 |
最高工作温度 | 70 °C | 70 °C | 125 °C | 125 °C | 70 °C | 125 °C | 125 °C | 125 °C |
最低工作温度 | - | - | -55 °C | -55 °C | - | -55 °C | -55 °C | -55 °C |
组织 | 32KX8 | 32KX8 | 32KX8 | 32KX8 | 32KX8 | 32KX8 | 32KX8 | 32KX8 |
输出特性 | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE |
封装主体材料 | CERAMIC | CERAMIC | CERAMIC | CERAMIC | CERAMIC | CERAMIC | CERAMIC | CERAMIC |
封装代码 | QCCJ | QCCJ | DIP | DIP | DIP | QCCN | QCCJ | QCCJ |
封装等效代码 | LDCC32,.45X.7 | LDCC32,.45X.7 | DIP28,.6 | DIP28,.3 | DIP28,.6 | LCC32,.45X.55 | LDCC32,.45X.7 | LDCC32,.45X.7 |
封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
封装形式 | CHIP CARRIER | CHIP CARRIER | IN-LINE | IN-LINE | IN-LINE | CHIP CARRIER | CHIP CARRIER | CHIP CARRIER |
电源 | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
最大待机电流 | 0.03 A | 0.03 A | 0.04 A | 0.04 A | 0.03 A | 0.04 A | 0.04 A | 0.04 A |
最大压摆率 | 0.08 mA | 0.074 mA | 0.076 mA | 0.076 mA | 0.08 mA | 0.076 mA | 0.076 mA | 0.076 mA |
标称供电电压 (Vsup) | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
表面贴装 | YES | YES | NO | NO | NO | YES | YES | YES |
技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
温度等级 | COMMERCIAL | COMMERCIAL | MILITARY | MILITARY | COMMERCIAL | MILITARY | MILITARY | MILITARY |
端子面层 | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
端子形式 | J BEND | J BEND | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | NO LEAD | J BEND | J BEND |
端子节距 | 1.27 mm | 1.27 mm | 2.54 mm | 2.54 mm | 2.54 mm | 1.27 mm | 1.27 mm | 1.27 mm |
端子位置 | QUAD | QUAD | DUAL | DUAL | DUAL | QUAD | QUAD | QUAD |
厂商名称 | Waferscale Integration Inc | - | Waferscale Integration Inc | Waferscale Integration Inc | Waferscale Integration Inc | Waferscale Integration Inc | Waferscale Integration Inc | Waferscale Integration Inc |