XPC740PRX300LE,XPC740PRX300LE pdf中文资料,XPC740PRX300LE引脚图,XPC740PRX300LE电路-Datasheet-电子工程世界

器件参数

参数名称

属性值

是否Rohs认证

不符合

零件包装代码

BGA

包装说明

BGA, BGA255,16X16,50

针数

255

Reach Compliance Code

unknown

ECCN代码

3A001.A.3

其他特性

ALSO REQUIRES 3.3V I/O SUPPLY

地址总线宽度

位大小

边界扫描

YES

最大时钟频率

100 MHz

外部数据总线宽度

格式

FLOATING POINT

集成缓存

YES

JESD-30 代码

S-CBGA-B255

JESD-609代码

长度

21 mm

低功率模式

YES

端子数量

255

最高工作温度

105 °C

最低工作温度

封装主体材料

CERAMIC, METAL-SEALED COFIRED

封装代码

BGA

封装等效代码

BGA255,16X16,50

封装形状

SQUARE

封装形式

GRID ARRAY

峰值回流温度（摄氏度）

NOT SPECIFIED

电源

1.9,3.3 V

认证状态

Not Qualified

座面最大高度

3 mm

速度

300 MHz

最大供电电压

2 V

最小供电电压

1.8 V

标称供电电压

1.9 V

表面贴装

YES

技术

CMOS

温度等级

OTHER

端子面层

Tin/Lead (Sn/Pb)

端子形式

BALL

端子节距

1.27 mm

端子位置

BOTTOM

处于峰值回流温度下的最长时间

NOT SPECIFIED

宽度

21 mm

uPs/uCs/外围集成电路类型

MICROPROCESSOR, RISC

Base Number Matches

参数对比

与XPC740PRX300LE相近的元器件有：XPC750PRX333LE、XPC740PRX366RE、XPC740PRX333LE、XPC740PRX400RE、XPC750PRX366RE、XPC750PRX300LE、XPC750PRX400RE。描述及对比如下：

型号	XPC740PRX300LE	XPC750PRX333LE	XPC740PRX366RE	XPC740PRX333LE	XPC740PRX400RE	XPC750PRX366RE	XPC750PRX300LE	XPC750PRX400RE
描述	32-BIT, 300MHz, RISC PROCESSOR, CBGA255, 21 X 21 MM, 3 MM HEIGHT, 1.27 MM PITCH, CERAMIC, BGA-255	32-BIT, 333MHz, RISC PROCESSOR, CBGA360, 25 X 25 MM, 3.20 MM HEIGHT, 1.27 MM PITCH, CERAMIC, BGA-360	RISC Microprocessor, 32-Bit, 366MHz, CMOS, CBGA255, 21 X 21 MM, 3 MM HEIGHT, 1.27 MM PITCH, CERAMIC, BGA-255	RISC Microprocessor, 32-Bit, 333MHz, CMOS, CBGA255, 21 X 21 MM, 3 MM HEIGHT, 1.27 MM PITCH, CERAMIC, BGA-255	RISC Microprocessor, 32-Bit, 400MHz, CMOS, CBGA255, 21 X 21 MM, 3 MM HEIGHT, 1.27 MM PITCH, CERAMIC, BGA-255	RISC Microprocessor, 32-Bit, 366MHz, CMOS, CBGA360, 25 X 25 MM, 3.20 MM HEIGHT, 1.27 MM PITCH, CERAMIC, BGA-360	32-BIT, 300MHz, RISC PROCESSOR, CBGA360, 25 X 25 MM, 3.20 MM HEIGHT, 1.27 MM PITCH, CERAMIC, BGA-360	32-BIT, 400MHz, RISC PROCESSOR, CBGA360, 25 X 25 MM, 3.20 MM HEIGHT, 1.27 MM PITCH, CERAMIC, BGA-360
包装说明	BGA, BGA255,16X16,50	BGA, BGA360,19X19,50	BGA, BGA255,16X16,50	BGA, BGA255,16X16,50	BGA, BGA255,16X16,50	BGA,	BGA, BGA360,19X19,50	BGA,
Reach Compliance Code	unknown	unknown	unknown	unknown	unknown	unknown	unknow	unknow
ECCN代码	3A001.A.3	3A001.A.3	3A001.A.3	3A001.A.3	3A001.A.3	3A001.A.3	3A001.A.3	3A001.A.3
其他特性	ALSO REQUIRES 3.3V I/O SUPPLY	ALSO REQUIRES 3.3V I/O SUPPLY	ALSO REQUIRES 3.3V I/O SUPPLY	ALSO REQUIRES 3.3V I/O SUPPLY	ALSO REQUIRES 3.3V I/O SUPPLY	ALSO REQUIRES 3.3V I/O SUPPLY	ALSO REQUIRES 3.3V I/O SUPPLY	ALSO REQUIRES 3.3V I/O SUPPLY
地址总线宽度	32	32	32	32	32	32	32	32
位大小	32	32	32	32	32	32	32	32
边界扫描	YES	YES	YES	YES	YES	YES	YES	YES
最大时钟频率	100 MHz	100 MHz	100 MHz	100 MHz	100 MHz	100 MHz	100 MHz	100 MHz
外部数据总线宽度	64	64	64	64	64	64	64	64
格式	FLOATING POINT	FLOATING POINT	FLOATING POINT	FLOATING POINT	FLOATING POINT	FLOATING POINT	FLOATING POINT	FIXED POINT
集成缓存	YES	YES	YES	YES	YES	YES	YES	YES
JESD-30 代码	S-CBGA-B255	S-CBGA-B360	S-CBGA-B255	S-CBGA-B255	S-CBGA-B255	S-CBGA-B360	S-CBGA-B360	S-CBGA-B360
长度	21 mm	25 mm	21 mm	21 mm	21 mm	25 mm	25 mm	25 mm
低功率模式	YES	YES	YES	YES	YES	YES	YES	YES
端子数量	255	360	255	255	255	360	360	360
最高工作温度	105 °C	105 °C	65 °C	105 °C	65 °C	65 °C	105 °C	65 °C
封装主体材料	CERAMIC, METAL-SEALED COFIRED	CERAMIC, METAL-SEALED COFIRED	CERAMIC, METAL-SEALED COFIRED	CERAMIC, METAL-SEALED COFIRED	CERAMIC, METAL-SEALED COFIRED	CERAMIC, METAL-SEALED COFIRED	CERAMIC, METAL-SEALED COFIRED	CERAMIC, METAL-SEALED COFIRED
封装代码	BGA	BGA	BGA	BGA	BGA	BGA	BGA	BGA
封装形状	SQUARE	SQUARE	SQUARE	SQUARE	SQUARE	SQUARE	SQUARE	SQUARE
封装形式	GRID ARRAY	GRID ARRAY	GRID ARRAY	GRID ARRAY	GRID ARRAY	GRID ARRAY	GRID ARRAY	GRID ARRAY
认证状态	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified
座面最大高度	3 mm	3.2 mm	3 mm	3 mm	3 mm	3.2 mm	3.2 mm	3.2 mm
速度	300 MHz	333 MHz	366 MHz	333 MHz	400 MHz	366 MHz	300 MHz	400 MHz
最大供电电压	2 V	2 V	2.1 V	2 V	2.1 V	2.1 V	2 V	2.1 V
最小供电电压	1.8 V	1.8 V	2 V	1.8 V	2 V	2 V	1.8 V	2 V
标称供电电压	1.9 V	1.9 V	2.05 V	1.9 V	2.05 V	2.05 V	1.9 V	2.05 V
表面贴装	YES	YES	YES	YES	YES	YES	YES	YES
技术	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS
温度等级	OTHER	OTHER	COMMERCIAL	OTHER	COMMERCIAL	COMMERCIAL	OTHER	COMMERCIAL
端子形式	BALL	BALL	BALL	BALL	BALL	BALL	BALL	BALL
端子节距	1.27 mm	1.27 mm	1.27 mm	1.27 mm	1.27 mm	1.27 mm	1.27 mm	1.27 mm
端子位置	BOTTOM	BOTTOM	BOTTOM	BOTTOM	BOTTOM	BOTTOM	BOTTOM	BOTTOM
宽度	21 mm	25 mm	21 mm	21 mm	21 mm	25 mm	25 mm	25 mm
uPs/uCs/外围集成电路类型	MICROPROCESSOR, RISC	MICROPROCESSOR, RISC	MICROPROCESSOR, RISC	MICROPROCESSOR, RISC	MICROPROCESSOR, RISC	MICROPROCESSOR, RISC	MICROPROCESSOR, RISC	MICROPROCESSOR, RISC
是否Rohs认证	不符合	不符合	-	不符合	-	不符合	不符合	不符合
JESD-609代码	e0	e0	-	e0	-	e0	e0	e0
峰值回流温度（摄氏度）	NOT SPECIFIED	NOT SPECIFIED	-	NOT SPECIFIED	-	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED
端子面层	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	-	Tin/Lead (Sn/Pb)	-	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)
处于峰值回流温度下的最长时间	NOT SPECIFIED	NOT SPECIFIED	-	NOT SPECIFIED	-	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED
厂商名称	-	-	Motorola ( NXP )	Motorola ( NXP )	Motorola ( NXP )	Motorola ( NXP )	Motorola ( NXP )	Motorola ( NXP )