型号
- 型号
- 关键词
HCT SERIES, QUAD 2-INPUT NOR GATE, PDSO14, 4.40 MM, PLASTIC, MO-153, SOT402-1, TSSOP-14
厂商名称：NXP(恩智浦)
厂商官网：https://www.nxp.com
器件标准：
| 型号 | 74HCT02PW-Q100 | 74HC02BQ-Q100 | 74HCT02BQ-Q100 | 74HC02PW-Q100 | 74HCT02D-Q100 | 74HC02D-Q100 |
|---|---|---|---|---|---|---|
| 描述 | HCT SERIES, QUAD 2-INPUT NOR GATE, PDSO14, 4.40 MM, PLASTIC, MO-153, SOT402-1, TSSOP-14 | HC/UH SERIES, QUAD 2-INPUT NOR GATE, PQCC14, 2.50 X 3 MM, 0.85 MM HEIGHT, PLASTIC, MO-241, SOT762-1, DHVQFN-14 | HCT SERIES, QUAD 2-INPUT NOR GATE, PQCC14, 2.50 X 3 MM, 0.85 MM HEIGHT, PLASTIC, MO-241, SOT762-1, DHVQFN-14 | HC/UH SERIES, QUAD 2-INPUT NOR GATE, PDSO14, 4.40 MM, PLASTIC, MO-153, SOT402-1, TSSOP-14 | HCT SERIES, QUAD 2-INPUT NOR GATE, PDSO14, 3.90 MM, PLASTIC, MS-012, SOT108-1, SOP-14 | HC/UH SERIES, QUAD 2-INPUT NOR GATE, PDSO14, 3.90 MM, PLASTIC, MS-012, SOT108-1, SOP-14 |
| 是否Rohs认证 | 符合 | 符合 | 符合 | 符合 | 符合 | 符合 |
| 厂商名称 | NXP(恩智浦) | NXP(恩智浦) | NXP(恩智浦) | NXP(恩智浦) | NXP(恩智浦) | NXP(恩智浦) |
| 零件包装代码 | TSSOP | QFN | QFN | TSSOP | SOIC | SOIC |
| 包装说明 | TSSOP, | 2.50 X 3 MM, 0.85 MM HEIGHT, PLASTIC, MO-241, SOT762-1, DHVQFN-14 | 2.50 X 3 MM, 0.85 MM HEIGHT, PLASTIC, MO-241, SOT762-1, DHVQFN-14 | 4.40 MM, PLASTIC, MO-153, SOT402-1, TSSOP-14 | 3.90 MM, PLASTIC, MS-012, SOT108-1, SOP-14 | 3.90 MM, PLASTIC, MS-012, SOT108-1, SOP-14 |
| 针数 | 14 | 14 | 14 | 14 | 14 | 14 |
| Reach Compliance Code | unknown | unknown | unknown | unknown | unknown | unknow |
| 系列 | HCT | HC/UH | HCT | HC/UH | HCT | HC/UH |
| JESD-30 代码 | R-PDSO-G14 | R-PQCC-N14 | R-PQCC-N14 | R-PDSO-G14 | R-PDSO-G14 | R-PDSO-G14 |
| 长度 | 5 mm | 3 mm | 3 mm | 5 mm | 8.65 mm | 8.65 mm |
| 逻辑集成电路类型 | NOR GATE | NOR GATE | NOR GATE | NOR GATE | NOR GATE | NOR GATE |
| 湿度敏感等级 | 1 | 1 | 1 | 1 | 1 | 1 |
| 功能数量 | 4 | 4 | 4 | 4 | 4 | 4 |
| 输入次数 | 2 | 2 | 2 | 2 | 2 | 2 |
| 端子数量 | 14 | 14 | 14 | 14 | 14 | 14 |
| 最高工作温度 | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C |
| 最低工作温度 | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C |
| 封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| 封装代码 | TSSOP | HVQCCN | HVQCCN | TSSOP | SOP | SOP |
| 封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| 封装形式 | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE | SMALL OUTLINE |
| 峰值回流温度（摄氏度） | 260 | 260 | 260 | 260 | 260 | 260 |
| 传播延迟（tpd） | 29 ns | 135 ns | 29 ns | 135 ns | 29 ns | 135 ns |
| 筛选级别 | AEC-Q100 | AEC-Q100 | AEC-Q100 | AEC-Q100 | AEC-Q100 | AEC-Q100 |
| 座面最大高度 | 1.1 mm | 1 mm | 1 mm | 1.1 mm | 1.75 mm | 1.75 mm |
| 最大供电电压 (Vsup) | 5.5 V | 6 V | 5.5 V | 6 V | 5.5 V | 6 V |
| 最小供电电压 (Vsup) | 4.5 V | 2 V | 4.5 V | 2 V | 4.5 V | 2 V |
| 标称供电电压 (Vsup) | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| 表面贴装 | YES | YES | YES | YES | YES | YES |
| 技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
| 温度等级 | AUTOMOTIVE | AUTOMOTIVE | AUTOMOTIVE | AUTOMOTIVE | AUTOMOTIVE | AUTOMOTIVE |
| 端子形式 | GULL WING | NO LEAD | NO LEAD | GULL WING | GULL WING | GULL WING |
| 端子节距 | 0.65 mm | 0.5 mm | 0.5 mm | 0.65 mm | 1.27 mm | 1.27 mm |
| 端子位置 | DUAL | QUAD | QUAD | DUAL | DUAL | DUAL |
| 处于峰值回流温度下的最长时间 | 30 | 30 | 30 | 30 | 30 | 30 |
| 宽度 | 4.4 mm | 2.5 mm | 2.5 mm | 4.4 mm | 3.9 mm | 3.9 mm |
| Base Number Matches | 1 | 1 | 1 | 1 | 1 | - |