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8329TFM-25ML

Chemicals THERM CONDV EPOXY MC 25ml (0.8 fl oz) FLW

器件类别:工具与设备   

厂商名称:MG Chemicals

厂商官网:https://www.mgchemicals.com

器件标准:

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器件:8329TFM-25ML

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器件参数
参数名称
属性值
Product Attribute
Attribute Value
制造商
Manufacturer
MG Chemicals
产品种类
Product Category
Chemicals
RoHS
Details
产品
Product
Adhesives
类型
Type
Conductive Adhesive
大小
Size
25 mL
Container
Syringe
Description/Function
Thermally conductive adhesive, medium cure
Package Type
Syringe
工厂包装数量
Factory Pack Quantity
1
文档预览
Technical Data Sheet
Thermally Conductive Epoxy Adhesive
Description
8329TFM is a thermally conductive two-part epoxy adhesive. It is dark grey, smooth, thixotropic, and bonds
well to a wide variety of substrates.
This product is used to bond heat sinks, LEDs, and other heat-generating components in electronic
assemblies. It is suitable for use with dual-syringes, mix-tips, and automatic dispensing systems.
For a faster working life, use 8329TFF. For a longer working life, use 8329TFS.
8329TFM
Features and Benefits
• Thermal conductivity: 1.1 W/(m·K)
• 1:1 mix ratio
• Working life: 45 minutes
• Cure time: 24 hours at room temperature or 2.5 hours at 65 °C (149 °F)
• Provides strong electrical insulation
• High tensile strength
• Strong resistance to humidity, salt water, mild bases, and aliphatic hydrocarbons
• Shelf life:
≥3
years
• RoHS 3 compliant
ISO 9001:2008 Registered Quality System. Burlington, Ontario, Canada SAI Global File: 004008
Date: 29 March 2018 / Ver. 2.00
Page 1
8329TFM
Usage Parameters
Properties
Working life @22 °C [72 °F]
Shelf life @22 °C [72 °F]
a)
Service cure @22 °C [72 °F]
Full cure @22 °C [72 °F]
Full cure @65 °C [149 °F]
Full cure @80 °C [176 °F]
Full cure @100 °C [212 °F]
Value
45 min
≥3
y
5h
24 h
2.5 h
1h
30 min
Temperature Ranges
Properties
Constant service temperature
Maximum intermittent temperature
a)
Storage temperature
Value
-40 to 150 °C [-40 to 302 °F]
175 °C [347 °F]
22 to 27 °C [72 to 81 °F]
a)
Temperature that can be withstood for short periods without sustaining damage.
ISO 9001:2008 Registered Quality System. Burlington, Ontario, Canada SAI Global File: 004008
Date: 29 March 2018 / Ver. 2.00
Page 2
8329TFM
Cured Properties
Physical Properties
Color
Density @26 °C [79 °F]
Hardness
Tensile strength
Compressive strength
Lap shear strength (stainless steel)
Lap shear strength (aluminum)
Lap shear strength (copper)
Lap shear strength (brass)
Lap shear strength (polycarbonate)
Lap shear strength (ABS)
Method
Visual
ASTM D 1475
Shore D Durometer
ASTM D 638
ASTM D 695
ASTM D 1002
ASTM D 1002
ASTM D 1002
ASTM D 1002
ASTM D 1002
ASTM D 1002
Value
a)
Black
2.18 g/mL
72D
4.5 N/mm
2
[650 lb/in
2
]
44 N/mm
2
[6 400 lb/in
2
]
9.0 N/mm
2
[1 300 lb/in
2
]
6.6 N/mm
2
[950 lb/in
2
]
8.0 N/mm
2
[1 200 lb/in
2
]
7.8 N/mm
2
[1 100 lb/in
2
]
0.8 N/mm
2
[110 lb/in
2
]
2.1 N/mm
2
[300 lb/in
2
]
Note: Specifications are for epoxy samples cured at 65 °C for 2.5 h and conditioned at ambient temperature
and humidity.
a)
N/mm
2
= mPa; lb/in
2
= psi
ISO 9001:2008 Registered Quality System. Burlington, Ontario, Canada SAI Global File: 004008
Date: 29 March 2018 / Ver. 2.00
Page 3
8329TFM
Cured Properties
Electrical Properties
Breakdown voltage
Dielectric strength
Breakdown voltage @3.175 mm [1/8"]
Dielectric strength @3.175 mm [1/8"]
Volume resistivity
Volume conductivity
Method
ASTM D 149
ASTM D 149
Reference fit
a)
Reference fit
a)
ASTM D 257
ASTM D 257
Value
16 500 V [16.5 kV]
180 V/mil [7.3 kV/mm]
19 500 V [19.5 kV]
160 V/mil [6.1 kV/mm]
8.9 x 10
12
Ω·cm
1.1 x 10
-13
S/cm
Thermal Properties
Glass transition temperature (T
g
)
CTE
b)
prior T
g
after T
g
Thermal conductivity @25 °C [77 °F]
@50 °C [222 °F]
@100 °C [212 °F]
Thermal diffusivity @25 °C [77 °F]
Specific heat capacity @25 °C [77 °F]
Method
ASTM E 3418
ASTM E 831
ASTM E 831
ASTM E 1461 92
ASTM E 1461 92
ASTM E 1461 92
ASTM E 1461 92
ASTM E 1461 92
Value
76 °C [170 °F]
67 ppm/°C [153 ppm/°F]
125 ppm/°C [257 ppm/°F]
1.1 W/(m·K)
1.1 W/(m·K)
1.0 W/(m·K)
0.5 mm
2
/s
1.1 J/(g·K)
Note: Specifications are for epoxy samples cured at 65 °C for 2.5 h and conditioned at ambient temperature
and humidity.
a)
To allow comparison between products, the dielectric strength was recalculated with the Tautscher
equation fitted to 5 experimental values and extrapolated to a standard thickness of 1/8” (3.175 mm).
b)
Coefficient of Thermal Expansion (CTE) units are in ppm/°C = in/in/°C × 10
-6
= unit/unit/°C × 10
-6
ISO 9001:2008 Registered Quality System. Burlington, Ontario, Canada SAI Global File: 004008
Date: 29 March 2018 / Ver. 2.00
Page 4
8329TFM
Uncured Properties
Physical Properties
Color
Viscosity
Density
Mix ratio by volume
Mix ratio by weight
Solids content (w/w)
Mixture (A:B)
Black
Thixotropic
2.19 g/mL
1:1
1:0.96
100%
Physical Properties
Color
Viscosity @25 °C [77 °F]
Density
Odor
Part A
Black
Not available
2.23 g/mL
Mild
Part B
Dark grey
2 000 000 cP [2 000 Pa·s]
a)
2.18 g/mL
Amine
a)
Brookfield viscometer at 2 rpm with spindle RV S95
ISO 9001:2008 Registered Quality System. Burlington, Ontario, Canada SAI Global File: 004008
Date: 29 March 2018 / Ver. 2.00
Page 5
查看更多>
参数对比
与8329TFM-25ML相近的元器件有:8329TFM-50ML。描述及对比如下:
型号 8329TFM-25ML 8329TFM-50ML
描述 Chemicals THERM CONDV EPOXY MC 25ml (0.8 fl oz) FLW Chemicals THERM CONDV EPOXY MC 50ml (1.6 fl oz) FLW
Product Attribute Attribute Value Attribute Value
制造商
Manufacturer
MG Chemicals MG Chemicals
产品种类
Product Category
Chemicals Chemicals
RoHS Details Details
产品
Product
Adhesives Adhesives
类型
Type
Conductive Adhesive Conductive Adhesive
大小
Size
25 mL 50 mL
Container Syringe Cartridge
Description/Function Thermally conductive adhesive, medium cure Thermally conductive adhesive, medium cure
Package Type Syringe Cartridge
工厂包装数量
Factory Pack Quantity
1 1
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