型号
- 型号
- 关键词
| 型号 | ADG508AKP | ADG509AKRZ-REEL7 | ADG509AKNZ | ADG509AKR-REEL7 | ADG508AKN | ADG508AKRZ | ADG509AKN | ADG508AKNZ | ADG509ATQ | ADG508AKR-REEL |
|---|---|---|---|---|---|---|---|---|---|---|
| 描述 | Multiplexer Switch ICs 8:1 280 Ohm CMOS | Multiplexer Switch ICs 4:1 280 Ohm CMOS | Multiplexer Switch ICs 4:1 280 Ohm CMOS | Multiplexer Switch ICs 4:1 280 Ohm CMOS | Multiplexer Switch ICs 8:1 280 Ohm CMOS | Multiplexer Switch ICs 8:1 280 Ohm CMOS | Multiplexer Switch ICs 4:1 280 Ohm CMOS | Multiplexer Switch ICs 8:1 280 Ohm CMOS | Multiplexer Switch ICs 4:1 280 Ohm CMOS | Multiplexer Switch ICs 8:1 280 Ohm CMOS |
| Brand Name | Analog Devices Inc | - | Analog Devices Inc | - | - | Analog Devices Inc | Analog Devices Inc | Analog Devices Inc | Analog Devices Inc | Analog Devices Inc |
| 是否无铅 | 含铅 | - | 含铅 | - | - | 含铅 | 含铅 | 含铅 | 含铅 | 含铅 |
| 是否Rohs认证 | 不符合 | - | 符合 | - | - | 符合 | 不符合 | 符合 | 不符合 | 不符合 |
| 厂商名称 | ADI(亚德诺半导体) | - | - | - | - | ADI(亚德诺半导体) | ADI(亚德诺半导体) | ADI(亚德诺半导体) | ADI(亚德诺半导体) | ADI(亚德诺半导体) |
| 零件包装代码 | LPCC | - | DIP | - | - | SOIC | DIP | DIP | DIP | SOIC |
| 包装说明 | PLASTIC, MO-047AA, LCC-20 | - | DIP, DIP16,.3 | - | - | SOP, SOP16,.25 | DIP, DIP16,.3 | DIP, DIP16,.3 | DIP, DIP16,.3 | MS-012AC, SOIC-16 |
| 针数 | 20 | - | 16 | - | - | 16 | 16 | 16 | 16 | 16 |
| 制造商包装代码 | P-20 | - | N-16 | - | - | R-16 | N-16 | N-16 | Q-16 | R-16 |
| Reach Compliance Code | not_compliant | - | compliant | - | - | compliant | not_compliant | compliant | not_compliant | not_compliant |
| ECCN代码 | EAR99 | - | EAR99 | - | - | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 |
| 其他特性 | ALSO OPERATES WITH 10.8 V TO 16.5 V SINGLE SUPPLY | - | ALSO OPERATES WITH 10.8 V TO 16.5 V SINGLE SUPPLY | - | - | ALSO OPERATES WITH 10.8 V TO 16.5 V SINGLE SUPPLY | ALSO OPERATES WITH 10.8 V TO 16.5 V SINGLE SUPPLY | ALSO OPERATES WITH 10.8 V TO 16.5 V SINGLE SUPPLY | ALSO OPERATES WITH 10.8 V TO 16.5 V SINGLE SUPPLY | ALSO OPERATES WITH 10.8 V TO 16.5 V SINGLE SUPPLY |
| 模拟集成电路 - 其他类型 | SINGLE-ENDED MULTIPLEXER | - | DIFFERENTIAL MULTIPLEXER | - | - | SINGLE-ENDED MULTIPLEXER | DIFFERENTIAL MULTIPLEXER | SINGLE-ENDED MULTIPLEXER | DIFFERENTIAL MULTIPLEXER | SINGLE-ENDED MULTIPLEXER |
| JESD-30 代码 | S-PQCC-J20 | - | R-PDIP-T16 | - | - | R-PDSO-G16 | R-PDIP-T16 | R-PDIP-T16 | R-GDIP-T16 | R-PDSO-G16 |
| JESD-609代码 | e0 | - | e3 | - | - | e3 | e0 | e3 | e0 | e0 |
| 长度 | 8.965 mm | - | 20.07 mm | - | - | 9.9 mm | 20.07 mm | 20.07 mm | 19.495 mm | 9.9 mm |
| 负电源电压最大值（Vsup） | -16.5 V | - | -16.5 V | - | - | -16.5 V | -16.5 V | -16.5 V | -16.5 V | -16.5 V |
| 负电源电压最小值（Vsup） | -10.8 V | - | -10.8 V | - | - | -10.8 V | -10.8 V | -10.8 V | -10.8 V | -10.8 V |
| 标称负供电电压 (Vsup) | -15 V | - | -15 V | - | - | -15 V | -15 V | -15 V | -15 V | -15 V |
| 信道数量 | 8 | - | 4 | - | - | 8 | 4 | 8 | 4 | 8 |
| 功能数量 | 1 | - | 1 | - | - | 1 | 1 | 1 | 1 | 1 |
| 端子数量 | 20 | - | 16 | - | - | 16 | 16 | 16 | 16 | 16 |
| 标称断态隔离度 | 68 dB | - | 68 dB | - | - | 68 dB | 68 dB | 68 dB | 68 dB | 68 dB |
| 通态电阻匹配规范 | 22.5 Ω | - | 22.5 Ω | - | - | 22.5 Ω | 22.5 Ω | 22.5 Ω | 22.5 Ω | 22.5 Ω |
| 最大通态电阻 (Ron) | 450 Ω | - | 450 Ω | - | - | 450 Ω | 450 Ω | 450 Ω | 450 Ω | 450 Ω |
| 最高工作温度 | 85 °C | - | 85 °C | - | - | 85 °C | 85 °C | 85 °C | 125 °C | 85 °C |
| 最低工作温度 | -40 °C | - | -40 °C | - | - | -40 °C | -40 °C | -40 °C | -55 °C | -40 °C |
| 封装主体材料 | PLASTIC/EPOXY | - | PLASTIC/EPOXY | - | - | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | CERAMIC, GLASS-SEALED | PLASTIC/EPOXY |
| 封装代码 | QCCJ | - | DIP | - | - | SOP | DIP | DIP | DIP | SOP |
| 封装等效代码 | LDCC20,.4SQ | - | DIP16,.3 | - | - | SOP16,.25 | DIP16,.3 | DIP16,.3 | DIP16,.3 | SOP16,.25 |
| 封装形状 | SQUARE | - | RECTANGULAR | - | - | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| 封装形式 | CHIP CARRIER | - | IN-LINE | - | - | SMALL OUTLINE | IN-LINE | IN-LINE | IN-LINE | SMALL OUTLINE |
| 峰值回流温度（摄氏度） | 220 | - | NOT APPLICABLE | - | - | 260 | NOT APPLICABLE | NOT APPLICABLE | NOT APPLICABLE | 240 |
| 电源 | 12/15,GND/-12/-15 V | - | 12/15,GND/-12/-15 V | - | - | 12/15,GND/-12/-15 V | 12/15,GND/-12/-15 V | 12/15,GND/-12/-15 V | 12/15,GND/-12/-15 V | 12/15,GND/-12/-15 V |
| 认证状态 | Not Qualified | - | Not Qualified | - | - | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 座面最大高度 | 4.57 mm | - | 5.33 mm | - | - | 1.75 mm | 5.33 mm | 5.33 mm | 5.08 mm | 1.75 mm |
| 最大信号电流 | 0.02 A | - | 0.02 A | - | - | 0.02 A | 0.02 A | 0.02 A | 0.02 A | 0.02 A |
| 最大供电电流 (Isup) | 1.5 mA | - | 1.5 mA | - | - | 1.5 mA | 1.5 mA | 1.5 mA | 1.5 mA | 1.5 mA |
| 最大供电电压 (Vsup) | 16.5 V | - | 16.5 V | - | - | 16.5 V | 16.5 V | 16.5 V | 16.5 V | 16.5 V |
| 最小供电电压 (Vsup) | 10.8 V | - | 10.8 V | - | - | 10.8 V | 10.8 V | 10.8 V | 10.8 V | 10.8 V |
| 标称供电电压 (Vsup) | 15 V | - | 15 V | - | - | 15 V | 15 V | 15 V | 15 V | 15 V |
| 表面贴装 | YES | - | NO | - | - | YES | NO | NO | NO | YES |
| 最长断开时间 | 300 ns | - | 300 ns | - | - | 300 ns | 300 ns | 300 ns | 300 ns | 300 ns |
| 最长接通时间 | 300 ns | - | 300 ns | - | - | 300 ns | 300 ns | 300 ns | 300 ns | 300 ns |
| 切换 | BREAK-BEFORE-MAKE | - | BREAK-BEFORE-MAKE | - | - | BREAK-BEFORE-MAKE | BREAK-BEFORE-MAKE | BREAK-BEFORE-MAKE | BREAK-BEFORE-MAKE | BREAK-BEFORE-MAKE |
| 技术 | CMOS | - | CMOS | - | - | CMOS | CMOS | CMOS | CMOS | CMOS |
| 温度等级 | INDUSTRIAL | - | INDUSTRIAL | - | - | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | MILITARY | INDUSTRIAL |
| 端子面层 | Tin/Lead (Sn85Pb15) | - | Matte Tin (Sn) | - | - | Matte Tin (Sn) | Tin/Lead (Sn85Pb15) | Matte Tin (Sn) | Tin/Lead (Sn63Pb37) | Tin/Lead (Sn85Pb15) |
| 端子形式 | J BEND | - | THROUGH-HOLE | - | - | GULL WING | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | GULL WING |
| 端子节距 | 1.27 mm | - | 2.54 mm | - | - | 1.27 mm | 2.54 mm | 2.54 mm | 2.54 mm | 1.27 mm |
| 端子位置 | QUAD | - | DUAL | - | - | DUAL | DUAL | DUAL | DUAL | DUAL |
| 处于峰值回流温度下的最长时间 | 20 | - | NOT APPLICABLE | - | - | 30 | NOT APPLICABLE | NOT APPLICABLE | NOT APPLICABLE | 30 |
| 宽度 | 8.965 mm | - | 7.62 mm | - | - | 3.9 mm | 7.62 mm | 7.62 mm | 7.62 mm | 3.9 mm |
模拟与混合信号
淘e淘
DIY/开源硬件专区
DIY/开源硬件专区
嵌入式系统
ARM技术
