型号 | ADG509AKR-REEL7 | ADG509AKRZ-REEL7 | ADG509AKNZ | ADG508AKN | ADG508AKP | ADG508AKRZ | ADG509AKN | ADG508AKNZ | ADG509ATQ | ADG508AKR-REEL |
---|---|---|---|---|---|---|---|---|---|---|
描述 | Multiplexer Switch ICs 4:1 280 Ohm CMOS | Multiplexer Switch ICs 4:1 280 Ohm CMOS | Multiplexer Switch ICs 4:1 280 Ohm CMOS | Multiplexer Switch ICs 8:1 280 Ohm CMOS | Multiplexer Switch ICs 8:1 280 Ohm CMOS | Multiplexer Switch ICs 8:1 280 Ohm CMOS | Multiplexer Switch ICs 4:1 280 Ohm CMOS | Multiplexer Switch ICs 8:1 280 Ohm CMOS | Multiplexer Switch ICs 4:1 280 Ohm CMOS | Multiplexer Switch ICs 8:1 280 Ohm CMOS |
Brand Name | - | - | Analog Devices Inc | - | Analog Devices Inc | Analog Devices Inc | Analog Devices Inc | Analog Devices Inc | Analog Devices Inc | Analog Devices Inc |
是否无铅 | - | - | 含铅 | - | 含铅 | 含铅 | 含铅 | 含铅 | 含铅 | 含铅 |
是否Rohs认证 | - | - | 符合 | - | 不符合 | 符合 | 不符合 | 符合 | 不符合 | 不符合 |
零件包装代码 | - | - | DIP | - | LPCC | SOIC | DIP | DIP | DIP | SOIC |
包装说明 | - | - | DIP, DIP16,.3 | - | PLASTIC, MO-047AA, LCC-20 | SOP, SOP16,.25 | DIP, DIP16,.3 | DIP, DIP16,.3 | DIP, DIP16,.3 | MS-012AC, SOIC-16 |
针数 | - | - | 16 | - | 20 | 16 | 16 | 16 | 16 | 16 |
制造商包装代码 | - | - | N-16 | - | P-20 | R-16 | N-16 | N-16 | Q-16 | R-16 |
Reach Compliance Code | - | - | compliant | - | not_compliant | compliant | not_compliant | compliant | not_compliant | not_compliant |
ECCN代码 | - | - | EAR99 | - | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 |
其他特性 | - | - | ALSO OPERATES WITH 10.8 V TO 16.5 V SINGLE SUPPLY | - | ALSO OPERATES WITH 10.8 V TO 16.5 V SINGLE SUPPLY | ALSO OPERATES WITH 10.8 V TO 16.5 V SINGLE SUPPLY | ALSO OPERATES WITH 10.8 V TO 16.5 V SINGLE SUPPLY | ALSO OPERATES WITH 10.8 V TO 16.5 V SINGLE SUPPLY | ALSO OPERATES WITH 10.8 V TO 16.5 V SINGLE SUPPLY | ALSO OPERATES WITH 10.8 V TO 16.5 V SINGLE SUPPLY |
模拟集成电路 - 其他类型 | - | - | DIFFERENTIAL MULTIPLEXER | - | SINGLE-ENDED MULTIPLEXER | SINGLE-ENDED MULTIPLEXER | DIFFERENTIAL MULTIPLEXER | SINGLE-ENDED MULTIPLEXER | DIFFERENTIAL MULTIPLEXER | SINGLE-ENDED MULTIPLEXER |
JESD-30 代码 | - | - | R-PDIP-T16 | - | S-PQCC-J20 | R-PDSO-G16 | R-PDIP-T16 | R-PDIP-T16 | R-GDIP-T16 | R-PDSO-G16 |
JESD-609代码 | - | - | e3 | - | e0 | e3 | e0 | e3 | e0 | e0 |
长度 | - | - | 20.07 mm | - | 8.965 mm | 9.9 mm | 20.07 mm | 20.07 mm | 19.495 mm | 9.9 mm |
负电源电压最大值(Vsup) | - | - | -16.5 V | - | -16.5 V | -16.5 V | -16.5 V | -16.5 V | -16.5 V | -16.5 V |
负电源电压最小值(Vsup) | - | - | -10.8 V | - | -10.8 V | -10.8 V | -10.8 V | -10.8 V | -10.8 V | -10.8 V |
标称负供电电压 (Vsup) | - | - | -15 V | - | -15 V | -15 V | -15 V | -15 V | -15 V | -15 V |
信道数量 | - | - | 4 | - | 8 | 8 | 4 | 8 | 4 | 8 |
功能数量 | - | - | 1 | - | 1 | 1 | 1 | 1 | 1 | 1 |
端子数量 | - | - | 16 | - | 20 | 16 | 16 | 16 | 16 | 16 |
标称断态隔离度 | - | - | 68 dB | - | 68 dB | 68 dB | 68 dB | 68 dB | 68 dB | 68 dB |
通态电阻匹配规范 | - | - | 22.5 Ω | - | 22.5 Ω | 22.5 Ω | 22.5 Ω | 22.5 Ω | 22.5 Ω | 22.5 Ω |
最大通态电阻 (Ron) | - | - | 450 Ω | - | 450 Ω | 450 Ω | 450 Ω | 450 Ω | 450 Ω | 450 Ω |
最高工作温度 | - | - | 85 °C | - | 85 °C | 85 °C | 85 °C | 85 °C | 125 °C | 85 °C |
最低工作温度 | - | - | -40 °C | - | -40 °C | -40 °C | -40 °C | -40 °C | -55 °C | -40 °C |
封装主体材料 | - | - | PLASTIC/EPOXY | - | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | CERAMIC, GLASS-SEALED | PLASTIC/EPOXY |
封装代码 | - | - | DIP | - | QCCJ | SOP | DIP | DIP | DIP | SOP |
封装等效代码 | - | - | DIP16,.3 | - | LDCC20,.4SQ | SOP16,.25 | DIP16,.3 | DIP16,.3 | DIP16,.3 | SOP16,.25 |
封装形状 | - | - | RECTANGULAR | - | SQUARE | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
封装形式 | - | - | IN-LINE | - | CHIP CARRIER | SMALL OUTLINE | IN-LINE | IN-LINE | IN-LINE | SMALL OUTLINE |
峰值回流温度(摄氏度) | - | - | NOT APPLICABLE | - | 220 | 260 | NOT APPLICABLE | NOT APPLICABLE | NOT APPLICABLE | 240 |
电源 | - | - | 12/15,GND/-12/-15 V | - | 12/15,GND/-12/-15 V | 12/15,GND/-12/-15 V | 12/15,GND/-12/-15 V | 12/15,GND/-12/-15 V | 12/15,GND/-12/-15 V | 12/15,GND/-12/-15 V |
认证状态 | - | - | Not Qualified | - | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
座面最大高度 | - | - | 5.33 mm | - | 4.57 mm | 1.75 mm | 5.33 mm | 5.33 mm | 5.08 mm | 1.75 mm |
最大信号电流 | - | - | 0.02 A | - | 0.02 A | 0.02 A | 0.02 A | 0.02 A | 0.02 A | 0.02 A |
最大供电电流 (Isup) | - | - | 1.5 mA | - | 1.5 mA | 1.5 mA | 1.5 mA | 1.5 mA | 1.5 mA | 1.5 mA |
最大供电电压 (Vsup) | - | - | 16.5 V | - | 16.5 V | 16.5 V | 16.5 V | 16.5 V | 16.5 V | 16.5 V |
最小供电电压 (Vsup) | - | - | 10.8 V | - | 10.8 V | 10.8 V | 10.8 V | 10.8 V | 10.8 V | 10.8 V |
标称供电电压 (Vsup) | - | - | 15 V | - | 15 V | 15 V | 15 V | 15 V | 15 V | 15 V |
表面贴装 | - | - | NO | - | YES | YES | NO | NO | NO | YES |
最长断开时间 | - | - | 300 ns | - | 300 ns | 300 ns | 300 ns | 300 ns | 300 ns | 300 ns |
最长接通时间 | - | - | 300 ns | - | 300 ns | 300 ns | 300 ns | 300 ns | 300 ns | 300 ns |
切换 | - | - | BREAK-BEFORE-MAKE | - | BREAK-BEFORE-MAKE | BREAK-BEFORE-MAKE | BREAK-BEFORE-MAKE | BREAK-BEFORE-MAKE | BREAK-BEFORE-MAKE | BREAK-BEFORE-MAKE |
技术 | - | - | CMOS | - | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
温度等级 | - | - | INDUSTRIAL | - | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | MILITARY | INDUSTRIAL |
端子面层 | - | - | Matte Tin (Sn) | - | Tin/Lead (Sn85Pb15) | Matte Tin (Sn) | Tin/Lead (Sn85Pb15) | Matte Tin (Sn) | Tin/Lead (Sn63Pb37) | Tin/Lead (Sn85Pb15) |
端子形式 | - | - | THROUGH-HOLE | - | J BEND | GULL WING | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | GULL WING |
端子节距 | - | - | 2.54 mm | - | 1.27 mm | 1.27 mm | 2.54 mm | 2.54 mm | 2.54 mm | 1.27 mm |
端子位置 | - | - | DUAL | - | QUAD | DUAL | DUAL | DUAL | DUAL | DUAL |
处于峰值回流温度下的最长时间 | - | - | NOT APPLICABLE | - | 20 | 30 | NOT APPLICABLE | NOT APPLICABLE | NOT APPLICABLE | 30 |
宽度 | - | - | 7.62 mm | - | 8.965 mm | 3.9 mm | 7.62 mm | 7.62 mm | 7.62 mm | 3.9 mm |
厂商名称 | - | - | - | - | ADI(亚德诺半导体) | ADI(亚德诺半导体) | ADI(亚德诺半导体) | ADI(亚德诺半导体) | ADI(亚德诺半导体) | ADI(亚德诺半导体) |