Dual-Port SRAM, 128KX36, 4.2ns, CMOS, PBGA172, 15 X 15 MM, 0.51 MM HEIGHT, 1 MM PITCH, BGA-172
厂商名称:Cypress(赛普拉斯)
下载文档型号 | CY7C0852V-133BGC | ADM6319CZ25ARJZRL7 | CY7C0852V-150BGI | CY7C0852V-100BGC | CY7C0852V-133BGI | CY7C0852V-100BGI |
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描述 | Dual-Port SRAM, 128KX36, 4.2ns, CMOS, PBGA172, 15 X 15 MM, 0.51 MM HEIGHT, 1 MM PITCH, BGA-172 | Supervisory Circuits with Watchdog and Manual Reset in 5-Lead SOT-23 | Dual-Port SRAM, 128KX36, 3.8ns, CMOS, PBGA172, 15 X 15 MM, 0.51 MM HEIGHT, 1 MM PITCH, BGA-172 | Dual-Port SRAM, 128KX36, 5ns, CMOS, PBGA172, 15 X 15 MM, 0.51 MM HEIGHT, 1 MM PITCH, BGA-172 | Dual-Port SRAM, 128KX36, 4.2ns, CMOS, PBGA172, 15 X 15 MM, 0.51 MM HEIGHT, 1 MM PITCH, BGA-172 | Dual-Port SRAM, 128KX36, 5ns, CMOS, PBGA172, 15 X 15 MM, 0.51 MM HEIGHT, 1 MM PITCH, BGA-172 |
是否Rohs认证 | 不符合 | - | 不符合 | 不符合 | 不符合 | 不符合 |
零件包装代码 | BGA | - | BGA | BGA | BGA | BGA |
包装说明 | 15 X 15 MM, 0.51 MM HEIGHT, 1 MM PITCH, BGA-172 | - | 15 X 15 MM, 0.51 MM HEIGHT, 1 MM PITCH, BGA-172 | 15 X 15 MM, 0.51 MM HEIGHT, 1 MM PITCH, BGA-172 | 15 X 15 MM, 0.51 MM HEIGHT, 1 MM PITCH, BGA-172 | 15 X 15 MM, 0.51 MM HEIGHT, 1 MM PITCH, BGA-172 |
针数 | 172 | - | 172 | 172 | 172 | 172 |
Reach Compliance Code | compliant | - | compliant | compliant | compliant | compliant |
ECCN代码 | 3A991.B.2.A | - | 3A991.B.2.A | 3A991.B.2.A | 3A991.B.2.A | 3A991.B.2.A |
最长访问时间 | 4.2 ns | - | 3.8 ns | 5 ns | 4.2 ns | 5 ns |
I/O 类型 | COMMON | - | COMMON | COMMON | COMMON | COMMON |
JESD-30 代码 | S-PBGA-B172 | - | S-PBGA-B172 | S-PBGA-B172 | S-PBGA-B172 | S-PBGA-B172 |
JESD-609代码 | e0 | - | e0 | e0 | e0 | e0 |
长度 | 15 mm | - | 15 mm | 15 mm | 15 mm | 15 mm |
内存密度 | 4718592 bit | - | 4718592 bit | 4718592 bit | 4718592 bit | 4718592 bit |
内存集成电路类型 | DUAL-PORT SRAM | - | DUAL-PORT SRAM | DUAL-PORT SRAM | DUAL-PORT SRAM | DUAL-PORT SRAM |
内存宽度 | 36 | - | 36 | 36 | 36 | 36 |
功能数量 | 1 | - | 1 | 1 | 1 | 1 |
端口数量 | 2 | - | 2 | 2 | 2 | 2 |
端子数量 | 172 | - | 172 | 172 | 172 | 172 |
字数 | 131072 words | - | 131072 words | 131072 words | 131072 words | 131072 words |
字数代码 | 128000 | - | 128000 | 128000 | 128000 | 128000 |
工作模式 | SYNCHRONOUS | - | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS |
最高工作温度 | 70 °C | - | 85 °C | 70 °C | 85 °C | 85 °C |
组织 | 128KX36 | - | 128KX36 | 128KX36 | 128KX36 | 128KX36 |
输出特性 | 3-STATE | - | 3-STATE | 3-STATE | 3-STATE | 3-STATE |
封装主体材料 | PLASTIC/EPOXY | - | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
封装代码 | LBGA | - | LBGA | LBGA | LBGA | LBGA |
封装等效代码 | BGA172,14X14,40 | - | BGA172,14X14,40 | BGA172,14X14,40 | BGA172,14X14,40 | BGA172,14X14,40 |
封装形状 | SQUARE | - | SQUARE | SQUARE | SQUARE | SQUARE |
封装形式 | GRID ARRAY, LOW PROFILE | - | GRID ARRAY, LOW PROFILE | GRID ARRAY, LOW PROFILE | GRID ARRAY, LOW PROFILE | GRID ARRAY, LOW PROFILE |
并行/串行 | PARALLEL | - | PARALLEL | PARALLEL | PARALLEL | PARALLEL |
峰值回流温度(摄氏度) | NOT SPECIFIED | - | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
电源 | 3.3 V | - | 3.3 V | 3.3 V | 3.3 V | 3.3 V |
认证状态 | Not Qualified | - | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
座面最大高度 | 1.25 mm | - | 1.25 mm | 1.25 mm | 1.25 mm | 1.25 mm |
最小待机电流 | 3.14 V | - | 3.14 V | 3.14 V | 3.14 V | 3.14 V |
最大供电电压 (Vsup) | 3.465 V | - | 3.465 V | 3.465 V | 3.465 V | 3.465 V |
最小供电电压 (Vsup) | 3.135 V | - | 3.135 V | 3.135 V | 3.135 V | 3.135 V |
标称供电电压 (Vsup) | 3.3 V | - | 3.3 V | 3.3 V | 3.3 V | 3.3 V |
表面贴装 | YES | - | YES | YES | YES | YES |
技术 | CMOS | - | CMOS | CMOS | CMOS | CMOS |
温度等级 | COMMERCIAL | - | INDUSTRIAL | COMMERCIAL | INDUSTRIAL | INDUSTRIAL |
端子面层 | Tin/Lead (Sn/Pb) | - | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
端子形式 | BALL | - | BALL | BALL | BALL | BALL |
端子节距 | 1 mm | - | 1 mm | 1 mm | 1 mm | 1 mm |
端子位置 | BOTTOM | - | BOTTOM | BOTTOM | BOTTOM | BOTTOM |
处于峰值回流温度下的最长时间 | NOT SPECIFIED | - | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
宽度 | 15 mm | - | 15 mm | 15 mm | 15 mm | 15 mm |
厂商名称 | - | - | Cypress(赛普拉斯) | Cypress(赛普拉斯) | Cypress(赛普拉斯) | Cypress(赛普拉斯) |