GD74HC51D,GD74HC51D pdf中文资料,GD74HC51D引脚图,GD74HC51D电路-Datasheet-电子工程世界

器件参数

参数名称

属性值

是否Rohs认证

不符合

厂商名称

LG Semicon Co Ltd

Reach Compliance Code

unknown

JESD-30 代码

R-PDSO-G14

JESD-609代码

负载电容（CL）

50 pF

逻辑集成电路类型

AND-OR-INVERT GATE

最大I（ol）

0.004 A

端子数量

最高工作温度

85 °C

最低工作温度

-40 °C

封装主体材料

PLASTIC/EPOXY

封装代码

SOP

封装等效代码

SOP14,.25

封装形状

RECTANGULAR

封装形式

SMALL OUTLINE

电源

2/6 V

Prop。Delay @ Nom-Sup

32 ns

认证状态

Not Qualified

施密特触发器

表面贴装

YES

技术

CMOS

温度等级

INDUSTRIAL

端子面层

Tin/Lead (Sn/Pb)

端子形式

GULL WING

端子节距

1.27 mm

端子位置

DUAL

参数对比

与GD74HC51D相近的元器件有：GD54HC51J、GD74HCT51、GD74HCT51J、GD74HCT51D、GD74HC51、GD54HCT51J、GD74HC51J。描述及对比如下：

型号	GD74HC51D	GD54HC51J	GD74HCT51	GD74HCT51J	GD74HCT51D	GD74HC51	GD54HCT51J	GD74HC51J
描述	AND-OR-Invert Gate, CMOS, PDSO14,	AND-OR-Invert Gate, CMOS, CDIP14,	AND-OR-Invert Gate, CMOS, PDIP14,	AND-OR-Invert Gate, CMOS, CDIP14,	AND-OR-Invert Gate, CMOS, PDSO14,	AND-OR-Invert Gate, CMOS, PDIP14,	AND-OR-Invert Gate, CMOS, CDIP14,	AND-OR-Invert Gate, CMOS, CDIP14,
是否Rohs认证	不符合	不符合	不符合	不符合	不符合	不符合	不符合	不符合
厂商名称	LG Semicon Co Ltd	LG Semicon Co Ltd	LG Semicon Co Ltd	LG Semicon Co Ltd	LG Semicon Co Ltd	LG Semicon Co Ltd	LG Semicon Co Ltd	LG Semicon Co Ltd
Reach Compliance Code	unknown	unknown	unknown	unknown	unknown	unknown	unknown	unknown
JESD-30 代码	R-PDSO-G14	R-XDIP-T14	R-PDIP-T14	R-XDIP-T14	R-PDSO-G14	R-PDIP-T14	R-XDIP-T14	R-XDIP-T14
JESD-609代码	e0	e0	e0	e0	e0	e0	e0	e0
负载电容（CL）	50 pF	50 pF	50 pF	50 pF	50 pF	50 pF	50 pF	50 pF
逻辑集成电路类型	AND-OR-INVERT GATE	AND-OR-INVERT GATE	AND-OR-INVERT GATE	AND-OR-INVERT GATE	AND-OR-INVERT GATE	AND-OR-INVERT GATE	AND-OR-INVERT GATE	AND-OR-INVERT GATE
最大I（ol）	0.004 A	0.004 A	0.004 A	0.004 A	0.004 A	0.004 A	0.004 A	0.004 A
端子数量	14	14	14	14	14	14	14	14
最高工作温度	85 °C	125 °C	85 °C	85 °C	85 °C	85 °C	125 °C	85 °C
最低工作温度	-40 °C	-55 °C	-40 °C	-40 °C	-40 °C	-40 °C	-55 °C	-40 °C
封装主体材料	PLASTIC/EPOXY	CERAMIC	PLASTIC/EPOXY	CERAMIC	PLASTIC/EPOXY	PLASTIC/EPOXY	CERAMIC	CERAMIC
封装代码	SOP	DIP	DIP	DIP	SOP	DIP	DIP	DIP
封装等效代码	SOP14,.25	DIP14,.3	DIP14,.3	DIP14,.3	SOP14,.25	DIP14,.3	DIP14,.3	DIP14,.3
封装形状	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR
封装形式	SMALL OUTLINE	IN-LINE	IN-LINE	IN-LINE	SMALL OUTLINE	IN-LINE	IN-LINE	IN-LINE
电源	2/6 V	2/6 V	5 V	5 V	5 V	2/6 V	5 V	2/6 V
Prop。Delay @ Nom-Sup	32 ns	37 ns	36 ns	36 ns	36 ns	32 ns	41 ns	32 ns
认证状态	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified
施密特触发器	NO	NO	NO	NO	NO	NO	NO	NO
表面贴装	YES	NO	NO	NO	YES	NO	NO	NO
技术	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS
温度等级	INDUSTRIAL	MILITARY	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	MILITARY	INDUSTRIAL
端子面层	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)
端子形式	GULL WING	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE	GULL WING	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE
端子节距	1.27 mm	2.54 mm	2.54 mm	2.54 mm	1.27 mm	2.54 mm	2.54 mm	2.54 mm
端子位置	DUAL	DUAL	DUAL	DUAL	DUAL	DUAL	DUAL	DUAL